Gas processing system

A gas processing system and gas processing technology, applied in the field of low-cost, high-maintenance gas processing system, and miniaturization, can solve the problems of high price and large-scale gas processing system, and achieve the effect of simple structure

Inactive Publication Date: 2012-07-25
EDWARDS JAPAN
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Problems solved by technology

[0007] (3) In order to transport the silicon dioxide powder contained in the treatment gas after silane combustion and decomposition to the filter bag BF, and in order to reduce the temperature of the treatment gas after combustion and decomposition, it is necessary to make the cleaning from the combustion type detoxification device 6 to the factory The air supply volume of the entire piping system (including piping 4) of the device 5 is a large air volume (for example, about 60m 3 / min); in order to cope with the large air volume, the entire piping system needs to be made of large diameter and strong piping made of stainless steel and other metals, or the inside of the piping needs to be coated with anti-corrosion, and large-scale factory scrubber equipment with large processing capacity is required. 5, the whole gas treatment system containing factory scrubber equipment 5 must become large and expensive

Method used

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Embodiment Construction

[0023] Refer to the attached Figure 1 The best mode for carrying out the present invention will be described in detail.

[0024] figure 1 It is a system configuration diagram of an example in which a gas processing system as an embodiment of the present invention is applied to a semiconductor manufacturing plant.

[0025] figure 1 In a semiconductor manufacturing plant, processes such as CVD (Chemical Vapor Deposition, Chemical Vapor Deposition), etching, etc. are performed in each sealed chamber C1, C2...Cn. Process gases such as silane used in these processes or gaseous substances produced by-products in the process are exhausted to the closed chambers C1, C2...Cn by unshown exhaust pumps connected to the closed chambers C1, C2...Cn external. Furthermore, the cleaning gas such as nitrogen trifluoride used in the plasma automatic cleaning of the closed chambers C1, C2...Cn is similarly exhausted to the outside of the closed chambers C1, C2...Cn. In this way, the gas t...

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Abstract

Provided is a gas processing system suitable for achieving cost reduction, size reduction and improvement of maintenability of the entire gas processing system including a pipe. A gas processing system (1) is provided with: a water-cooled combustion-type harm removing device (2) which, with silane that is a semiconductor material gas and a gaseous fluoride such as NF3, CF4, C2F6, SF6, CHF3, or CF6 that is used as a cleaning gas when the interiors of closed chambers (C1, C2 ... Cn) of a plasma CVD device and the like are cleaned by plasma as gases to be processed, performs combustion decomposition and washing dust collection on the gases to be processed; an electric dust collection device (3) which performs electric dust collection on process gas after the combustion decomposition and washing dust collection; and a pipe (4) for sending the process gas after the electric dust collection to a plant scrubber facility (5).

Description

technical field [0001] The present invention relates to the processing of silane (SiH 4 ) or nitrogen trifluoride (NF 3 ) and other gaseous fluorides are detoxified (detoxified), and in particular, it relates to a gas treatment system that achieves low cost, miniaturization, and improved maintainability of the entire gas treatment system including piping. Background technique [0002] figure 2 It is a system configuration diagram showing an example of a conventional gas processing system in a semiconductor manufacturing factory, a flat panel display factory, or a solar panel factory. In this semiconductor manufacturing factory, processes such as CVD (Chemical Vapor Deposition, chemical vapor deposition), etching, and the like are performed in each of the sealed chambers C1, C2...Cn. Process gases such as silane used in these processes or gaseous substances by-produced in the processes are sent to the gas treatment system 1 for detoxification. Furthermore, cleaning gases ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F23G7/06B01D53/46B01D53/68F23J15/08
CPCF23J15/06B01D53/323B01D2257/2047F23J2217/60B01D53/68F23J15/006F23J2217/102Y02E20/363B01D2259/80B01D2252/103B01D47/00B01D2257/553B01D2258/0216Y02C20/30F23J2219/80Y02E20/346F23G7/065B01D53/46F23G7/06F23J15/08
Inventor 中山泉高桥克典
Owner EDWARDS JAPAN
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