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Organosilicone-epoxy-polyimide adhesive and preparation method thereof

A technology of polyimide and polyimide resin, which is applied in the field of silicone-epoxy-polyimide adhesive and its preparation, can solve problems such as energy consumption and copper foil oxidation reaction, and achieve environmental protection and source The effect of convenience and simple preparation process

Inactive Publication Date: 2012-08-01
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its main disadvantage is that it needs long-term high-temperature curing at a high temperature of 350°C
This not only consumes energy, puts forward higher technical requirements for equipment, but also easily oxidizes copper foil

Method used

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  • Organosilicone-epoxy-polyimide adhesive and preparation method thereof
  • Organosilicone-epoxy-polyimide adhesive and preparation method thereof
  • Organosilicone-epoxy-polyimide adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 0.1 moles (15.2 grams) of 3,5-diaminobenzoic acid and 0.1 moles (41.0 grams) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane were added to the reactor, and 800 N, N-dimethylacetamide solvent in milliliters, stirred at room temperature to dissolve into a homogeneous solution, added 0.22 moles (114.4 g) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl] Propane dianhydride, after stirring and reacting at room temperature, add 800 ml of toluene and 10.7 g of p-toluenesulfonic acid, heat and reflux for water separation for 10-15 hours, separate 800 ml of toluene, add 16000 ml of ethanol solvent, and precipitate a solid powder, filtered, and dried to obtain 159.2 grams of carboxyl-containing polyimide resin, designated as CPI-11.

Embodiment 2

[0028] 0.1 moles (15.2 grams) of 3,5-diaminobenzoic acid and 0.6 moles (246.0 grams) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane were added to the reactor, and 10460 One milliliter of N, N-dimethylacetamide solvent, stirred and dissolved at room temperature to form a homogeneous solution, added 0.84 moles (436.8 grams) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl] Propane dianhydride, after the stirring reaction at room temperature is complete, add 10460 ml of toluene and 51.2 g of p-toluenesulfonic acid, heat and reflux for water separation for 10-15 hours, separate 10460 ml of toluene, add 209200 ml of ethanol solvent, and precipitate a solid powder, filtered, and dried to obtain 659.2 grams of carboxyl-containing polyimide resin, designated as CPI-16.

Embodiment 3

[0030] According to the mass 100 of N, N, N', N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (TGDDM):

[0031] A component:

[0032]

[0033] B component:

[0034] 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane 15

[0035] When ready to use, just mix the two components evenly. The curing process is as follows: start to heat up from room temperature to 100°C, keep for 1 hour, continue to heat up to 160°C, keep for 2 hours, and naturally cool to room temperature. The performance test is shown in Table 1. .

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Abstract

The invention relates to an organosilicon-epoxy-polyimide adhesive and a preparation method thereof. The organosilicon-epoxy-polyimide adhesive includes A component and B component, the A component is prepared by N, N', N'-quadri-glycidyl-4, 4'-diaminodiphenyl methane epoxy resin, carboxyl polyimide resin, alicylic epoxy resin and amino-terminated organosilicone, the B component is prepared by 2, 2-bi(4-(2,4-diaminobenzene epoxide) phenyl) propane. The preparation method of the organosilicon-epoxy-polyimide adhesive includes: only mixing the A component and the B component uniformly when in use. The organosilicone-epoxy-polyimide adhesive is fine in heatproof performance, simple in preparation process and free of solvent and has environment protection effect, and tensile shearing strength is up to 31.2MPa.

Description

technical field [0001] The invention belongs to the field of organic adhesives and preparation thereof, in particular to an organic silicon-epoxy-polyimide adhesive and a preparation method thereof. Background technique [0002] At present, there are many researches on high-temperature resistant adhesives in China, but there are not many adhesives that can achieve high connection strength and ideal heat resistance at the same time. Beijing Institute of Aeronautical Materials Zhao Shenglong, Liu Qingfang and others introduced in the Supplement to Volume 23 of "Journal of Aeronautical Materials" in October 2003 that by mixing high-functionality epoxy resin AG-80 and bisphenol A epoxy resin, using mixed amine A type of curing agent has been made into an adhesive that can be cured at room temperature and can withstand heat at 200°C, but the tensile shear strength of this adhesive at high temperature is not ideal, only 3MPa. Wang Chao, Zhang Bin and others introduced a solvent-f...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J179/08C09J183/08C08G59/58C08G59/38C08G73/10
Inventor 虞鑫海阎睿陈晓玲陈梅芳
Owner DONGHUA UNIV
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