Solar cell emitting electrode corroding method

A technology for solar cells and emitters, applied in circuits, electrical components, climate sustainability, etc., can solve the problems of difficult control and repetition of corrosion, poor uniformity of sheet resistance, inconsistent emitter depth, etc., to improve wettability, easy Repeat, improve the effect of uniformity

Inactive Publication Date: 2012-08-15
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The mixed solution of hydrofluoric acid and nitric acid is widely used in the texturing of polycrystalline silicon wafers, but for the corrosion of the emitter, the depth of the emitter is very shallow, and the requirements for corrosion control are very high. Control the corrosion speed and uniformity of the mixed solution Resilience has become a problem that is difficult to solve. After the emitter of the silicon wafer is corroded by a simple dilute mixed solution of hydrofluoric acid and

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0020] Example 1

[0021] Equipped with additive-free hydrofluoric acid and nitric acid etching solution, in which HF: HNO 3 : H 2 O (volume ratio of saturated solution) = 1:3:20; then configure the hydrofluoric acid and nitric acid etching solution with additives, in which HF:HNO 3 : H 2 O (volume ratio of saturated solution) = 1:3:20, the addition amount of sodium nitrite is 0.2mol / L, the addition amount of sodium sulfate is 0.1mol / L, the two mixed solutions are fully stirred and the temperature is stable At 20±2℃.

[0022] Take two single crystal silicon wafers with a size of 125×125mm. After cleaning, texturing, and diffusion, the square resistance is 30 ohms / square. One is etched in a mixed solution of hydrofluoric acid and nitric acid without additives for 120 seconds. After being etched in a mixed solution of hydrofluoric acid and nitric acid with additives for 120 seconds, the two silicon wafers were cleaned with a dilute alkali solution. After testing, the square resistanc...

Example Embodiment

[0023] Example 2

[0024] Equipped with additive-free hydrofluoric acid and nitric acid etching solution, in which HF: HNO 3 : H 2 O (volume ratio of saturated solution) = 1:3:20; then configure the hydrofluoric acid and nitric acid etching solution with additives, in which HF:HNO 3 :H2O (saturated solution volume ratio) = 1:3:20, the addition amount of sodium nitrite is 0.2mol / L, the addition amount of sodium sulfate is 0.1mol / L, the two mixed solutions are fully stirred and the temperature is stable At 20±2℃.

[0025] Take two single-crystal silicon wafers with a size of 125×125mm. After cleaning and texturing, the square resistance after diffusion is 30 ohms / square. Both wafers are screen-printed with an etching mask on the emitter and dried. One piece was etched in the mixed solution of hydrofluoric acid and nitric acid without additives for 150 seconds, and the other piece was etched in the mixed solution of hydrofluoric acid and nitric acid with additives for 150 seconds. The...

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PUM

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Abstract

The invention discloses a treatment process of emitting electrodes of solar cells, and particularly relates to a solar cell emitting electrode corroding method. The method comprises steps that a mixing solution of hydrofluoric acid and nitric acid is used as basic corroding liquid; at least one or any combination of nitrous acid, nitrite, sulfuric acid, sulfuric acid or phosphate is added; factors of proportion, temperature, time and adding amount of additives of the corroding liquid are optimized; a high impurity concentration area on the surface of the emitting electrode is eliminated uniformly and controllably; and afterwards the emitting electrode is washed so as to manufacture the solar cell with low surface impurity concentration, or a selective emitting electrode solar cell in combination with a printing process of masking.

Description

Technical field: [0001] The invention relates to a treatment process for a solar cell surface emitter, in particular to a method for corroding a solar cell emitter. Background technique: [0002] The emitter is the basic structure of crystalline silicon solar cells. In the research and development of new solar cells, in order to improve the conversion efficiency of solar cells, the optimization of the emitter is a very important aspect. The current manufacturing process often adopts high-temperature thermal diffusion to form the emitter, and there is often a high impurity concentration on the surface of the emitter. This region with high impurity concentration may increase the recombination rate of carriers on the surface, so that the carriers generated by short-wavelength light at the emitter will be quickly lost, which will be very unfavorable to the open circuit voltage and short circuit current of the solar cell. The impact of the battery conversion efficiency is also l...

Claims

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Application Information

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IPC IPC(8): C23F1/24H01L31/18
CPCY02P70/50
Inventor 梁宗存曾飞沈辉
Owner SUN YAT SEN UNIV
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