Automatic aligning image processing method of lithography machine
An image processing and automatic alignment technology, which is applied in microlithography exposure equipment, optics, photoplate making process of pattern surface, etc., can solve the problems of complex structure, low alignment accuracy, and complex alignment optical path, etc., and achieve alignment The effect of high accuracy, short alignment time and good anti-noise ability
Inactive Publication Date: 2012-09-12
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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Problems solved by technology
The current alignment method includes photometric off-axis alignment, the alignment system is simple, but the alignment accuracy is low
With the improvement of lithography resolution, the alignment system is mainly a diffraction grating coaxial alignment system (TTL alignment), but the alignment optical path is much more complicated and the structure is also very complicated
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[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0023] figure 1 This is the schematic diagram of the automatic alignment system. The system consists of two identical and independent optical paths. The objective lens has a large enough focal depth to ensure that the mask and the silicon wafer can be separated on the CCD phase surface when there is a certain gap. At the same time, the marked images of the silicon wafer (cross) and the mask (square frame) are obtained and sent to the computer through the USB interface.
[0024] figure 2 Positioning of image marks on masks and wafers. The mark is on the edge of the mask plate and the silicon wafer. The mark on the mask is a square, and the mark on the silicon wafer is a cross. The purpose of image alignment is to make the center of the pattern on the mask and the silicon wafer for each exposure accurate. coincide.
[0025] Let the left and right mark cent...
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The invention provides an automatic aligning image processing method of a lithography machine, which comprises the following steps that: firstly, the noise of an acquired mark image is smoothed, and the best threshold is worked out for binaryzation; and the center of a mark is worked out for rough alignment by identifying the edge position of a target through a video summation projection method. Precise positioning is carried out by edge searching and curve fitting, so that the motion of a workpiece bench is controlled and the high-precision alignment of the lithography machine is realized. The method has the advantages of high alignment precision, higher alignment efficiency and the like.
Description
technical field [0001] The invention belongs to the alignment technology in the field of lithography machine equipment, and relates to a fast image processing method for automatic alignment of a lithography machine. The method is used to control the movement of a workpiece table to adjust the relative position of a mask and a silicon wafer, thereby completing automatic alignment. standard process. Background technique [0002] Photolithography technology is the forerunner and foundation of large-scale integrated circuit manufacturing technology and micro-optics and micro-mechanical technology. The alignment system is one of the key components of the lithography machine, because the alignment accuracy directly affects the resolution and repeat overlay accuracy of the lithography machine. The current alignment method includes photometric off-axis alignment, and the alignment system is simple, but the alignment accuracy is low. With the improvement of lithography resolution, ...
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IPC IPC(8): G03F7/20G03F9/00
Inventor 冯金花李艳丽杨勇罗正全邢薇
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI