A chip integrating silicon micro-microphone and cmos integrated circuit and its manufacturing method
A technology of integrated circuits and microphones, applied in electrical components, electrostatic transducers, microphones, sensors, etc., can solve the problems of difficult signal-to-noise ratio of MEMS microphones, limited MEMS microphone structure design, etc., to improve the overall performance and improve the total signal-to-noise ratio. than the effect of gain
Active Publication Date: 2015-08-05
GOERTEK MICROELECTRONICS CO LTD
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The rapid development of consumer electronics requires MEMS microphones with better sound quality, but the noise floor of MEMS microphones is related to the design of MEMS microphones, which is limited to the structural design of MEMS microphones, and it is quite difficult to further improve the signal-to-noise ratio of MEMS microphones
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0033] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0034] Figure 1 to Figure 7 It is a schematic flowchart of a method for manufacturing a chip integrating a silicon micro-microphone and a CMOS integrated circuit provided by an embodiment of the present invention. like Figure 1 to Figure 7 As shown, the production steps are as follows:
[0035] Step 1: See figure 1 , select a silicon wafer 10, one surface of which has a first region 21 for making a CMOS integrated circuit and a second region 22 for making a silicon micro-microphone.
[0036] Step two: see also figure 1 , fabricate a CMOS integrated circuit on the first region 21 according to the standard process flow; wherein, during the field oxygen step, the other surface of the silicon wafer 10 is oxidized together, and the silicon oxide layer is protected in the subsequent process to be used as Masking layer during back cavity etching, when ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The embodiment of the invention discloses a chip integrating a silicon micro microphone and a complementary metal oxide semiconductor (CMOS) integrated circuit and a manufacturing method of the chip. The chip takes a silicon wafer as a substrate, and one surface of the silicon wafer is divided into two areas, namely a CMOS integrated circuit area and a silicon micro microphone area, wherein the silicon micro microphone area comprises two or more micro-electromechanical system (MEMS) acoustic transducers which are connected with one another in series, in parallel or in a difference mode, and the MEMS acoustic transducers are electrically connected with one another through electrical connection paths in the chip and the MEMS acoustic transducers are also electrically connected with the CMOS integrated circuit through electrical connection paths in the chip. On the one hand, the embodiment of the invention can significantly promote the overall performance, the size and the power consumption of an MEMS microphone relative to a multi-chip integration mode, and on the other hand, the embodiment of the invention can improve the total signal-to-noise ratio gain of the MEMS microphone relative to the chip only integrating a single MEMS acoustic transducer.
Description
technical field [0001] The invention relates to a chip integrating a silicon micro-microphone and a CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) integrated circuit and a manufacturing method thereof. Background technique [0002] MEMS microphone is a microphone with many applications and better performance at present, and MEMS acoustic transducer and CMOS integrated circuit are arranged on the circuit board inside its packaging structure. Previously, MEMS devices and CMOS integrated circuits generally adopted a multi-chip integration method, that is, different manufacturers used different processes to independently complete the manufacture of MEMS chips and CMOS integrated circuits, and then packaged and integrated the two into one device unit; The manufacturing process of an integrated method is mature, and the design and manufacture of MEMS devices can be optimized separately. The disadvantage is that the MEMS device and the CMOS ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R31/00
Inventor 潘昕宋青林
Owner GOERTEK MICROELECTRONICS CO LTD