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Chemical polish for copper and alloy surface treatment and preparation method thereof

A technology of surface treatment and chemical polishing, applied in the field of polishing agent, to achieve the effect of strong anti-oxidation ability, good polishing effect and little influence on human body

Inactive Publication Date: 2012-10-24
许泽波
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a chemical polishing agent for surface treatment of copper and alloys with easy production and processing, strong environmental protection, convenient storage, minimal impact on the human body, good polishing effect, and strong oxidation resistance, and a preparation method thereof. To overcome the deficiencies in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Embodiment one: a kind of method for the chemical polishing agent of copper and alloy surface treatment, its step is as follows:

[0053] Step 1: Weigh 15.5 parts of hydrogen peroxide, 10 parts of oxalic acid, 12 parts of sulfuric acid, 0.5 parts of benzotriazole, 4006 parts of polyethylene glycol and 54 parts of water;

[0054] Step 2: Put 54 parts of tap water into an acid-resistant container;

[0055] Step 3: Add 0.5 parts of benzotriazole in step 2 and stir until dissolved;

[0056] Step 4: Add 4006 parts of polyethylene glycol to the solution prepared in step 3 and stir until dissolved;

[0057] Step 5: Add 10 parts of oxalic acid to the solution prepared in step 4 and stir until dissolved;

[0058] Step 6: Add 12 parts of sulfuric acid to the solution prepared in step 5 and stir until dissolved;

[0059] Step 7: Add 15.5 parts of hydrogen peroxide to the solution prepared in Step 6 and stir for 5 to 10 minutes until it reaches a uniform state.

Embodiment 2

[0060] Embodiment two: a kind of method for preparing the chemical polishing agent of above-mentioned copper and alloy surface treatment, its steps are as follows:

[0061] Step 1: Weigh 28 parts of hydrogen peroxide, 15.5 parts of citric acid, 13.5 parts of sulfuric acid, 1.0 parts of benzotriazole, 10 parts of ethylene glycol and 32 parts of water;

[0062] Step 2: Put 32 parts of tap water weighed in an acid-resistant container;

[0063] Step 3: Add 1.0 parts of benzotriazole in step 2 and stir until dissolved;

[0064] Step 4: Add 10 parts of ethylene glycol to the solution prepared in step 3 and stir until dissolved;

[0065] Step 5: Add 15.5 parts of citric acid to the solution prepared in step 4 and stir until dissolved;

[0066] Step 6: Add 13.5 parts of sulfuric acid to the solution prepared in step 5 and stir until dissolved;

[0067] Step 7: Add 30 parts of hydrogen peroxide to the solution prepared in step 6 and stir for 5 to 10 minutes until it reaches a unifor...

Embodiment 3

[0068] Embodiment three: a kind of method for preparing the chemical polishing agent of above-mentioned copper and alloy surface treatment, its steps are as follows:

[0069] Step 1: Weigh 32 parts of hydrogen peroxide, 13.5 parts of amino acid, 11 parts of phosphoric acid, 2.5 parts of hydrazine hydrate, 10 parts of ethanol and 31 parts of water;

[0070] Step 2: Put 31 parts of tap water into an acid-resistant container;

[0071]Step 3: Add 2.5 parts of hydrazine hydrate in step 2 and stir until dissolved;

[0072] Step 4: Add 10 parts of ethanol to the solution prepared in step 3 and stir until dissolved;

[0073] Step 5: Add 13.5 parts of amino acids to the solution prepared in Step 4 and stir until dissolved;

[0074] Step 6: Add 11 parts of phosphoric acid to the solution prepared in step 5 and stir until dissolved;

[0075] Step 7: Add 31 parts of hydrogen peroxide to the solution prepared in Step 6 and stir for 5 to 10 minutes until it reaches a uniform state.

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PUM

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Abstract

Disclosed are chemical polish for copper and alloy surface treatment and a preparation method thereof. The chemical polish is prepared by mixing 15-55% of hydrogen peroxide, 10-20% of organic acid, 10-20% of inorganic acid, 0.5-5% of antioxidant inhibitor, 5-15% of alcohol ether, and the balance of water. The chemical polish for copper and alloy surface treatment has the advantages of easiness to produce and process, high environmental friendliness, convenience to store, low affection to human bodies, effectiveness in polishing, and high oxidation resistance.

Description

technical field [0001] The invention relates to a polishing agent, in particular to a chemical polishing agent for copper and alloy surface treatment and a preparation method thereof. Background technique [0002] The surface treatment of existing copper pipes generally includes polishing treatment. In this polishing treatment process, three acid (80% sulfuric acid, 20% nitric acid and 0-1% hydrochloric acid) are generally used for polishing. The three acid polishing process will produce serious yellow smoke. Nitrogen oxide gas is highly polluting to operators and the air, and nitrogen dioxide gas is a highly carcinogenic substance. [0003] Chinese Patent Document No. CN101831653A disclosed a polishing agent for metallographic detection of martensitic high-alloy heat-resistant steel on September 15, 2010. The components of the polishing agent and their weight / number ratios are: 1.8-2.2 parts of oxalic acid; 0.8-1.2 parts of acid; 10-30 parts of water; 30-50 parts of hydrog...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F3/06
Inventor 许泽波
Owner 许泽波
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