Boron diffusion method of crystalline silicon solar cell
A solar cell and diffusion method technology, applied in the field of crystalline silicon solar cell manufacturing, can solve the problems of reducing the concentration of impurities on the surface of the diffusion layer, uneven diffusion resistance, and affecting battery performance, so as to reduce the formation of boron-rich layers and improve diffusion Uniformity, the effect of improving battery performance
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Embodiment 1
[0030] A boron diffusion method for a crystalline silicon solar cell, comprising the steps of:
[0031] (1) Put the silicon wafer with suede into the diffusion furnace tube, raise the temperature to 980°C, feed oxygen for 10 minutes, and the oxygen flow rate is 10L / min;
[0032] (2) Access to BBr 3 , O 2 and N 2 Boron diffusion is performed, where BBr 3 The flow rate is 800mL / min; O 2 The flow rate is 500mL / min; N 2 The flow rate is 10L / min; the boron diffusion time is 50min;
[0033] (3) Stop the power supply, keep warm for 10 minutes under nitrogen atmosphere, nitrogen flow rate 10L / min;
[0034] (4) Cool down, take out the silicon wafer, and complete the diffusion process.
Embodiment 2
[0036] A boron diffusion method for a crystalline silicon solar cell, comprising the steps of:
[0037] (1) Put the silicon wafer with textured surface into the diffusion furnace tube, and start to feed oxygen for 15 minutes after heating up to 900°C, and the oxygen flow rate is 10L / min;
[0038] (2) Heating up, when the temperature reaches 980°C, BBr is introduced 3 , O 2 and N 2 , where BBr 3 The flow rate is 800mL / min; O 2 The flow rate is 500mL / min; N 2 The flow rate is 10mL / min; the time is 50min;
[0039] (3) Stop the power supply, cool down to 900°C, keep warm for 10 minutes under nitrogen atmosphere, and nitrogen flow rate is 10L / min;
[0040] (4) Cool down, take out the silicon wafer, and complete the diffusion process.
Embodiment 3
[0042] A boron diffusion method for a crystalline silicon solar cell, comprising the steps of:
[0043] (1) Put the silicon wafer with suede into the diffusion furnace tube, start to feed oxygen after heating up to 800°C, continue to raise the temperature to 980°C within 30 minutes, and the oxygen flow rate is 10L / min;
[0044] (2) After the temperature reaches 980°C, BBr is introduced 3 , O 2 and N 2 , where BBr 3 The flow rate is 800mL / min; O 2 The flow rate is 500mL / min; N 2 The flow rate is 10mL / min; the time is 50min;
[0045] (3) Stop the power supply, cool down to 900°C, keep warm for 10 minutes under nitrogen atmosphere, and nitrogen flow rate is 10L / min;
[0046] (4) Cool down, take out the silicon wafer, and complete the diffusion process.
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