Device and method for preparing metal microballoons by using ultrasonic surface standing waves

A technology of ultrasonic surface wave and metal microspheres, which is applied in the field of devices for preparing metal microspheres, can solve the problems of complex metal microsphere devices and inflexible size control, achieve good size consistency, avoid sticking, and improve production efficiency Effect

Inactive Publication Date: 2012-11-14
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The present invention aims to solve the problems of complex and inflexible size control of existing metal microsphere preparation devices, and proposes a device and method for preparing metal microspheres using ultrasonic surface standing waves

Method used

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  • Device and method for preparing metal microballoons by using ultrasonic surface standing waves

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specific Embodiment approach 1

[0025] Specific implementation mode one: combine figure 1 Describe this specific embodiment, a device for preparing metal microspheres using ultrasonic surface standing waves in this embodiment, consists of an air chamber 1 and a titanium alloy casting mold 2 located in the air chamber, a heating element 3, a substrate 4, and two ultrasonic surfaces The wave emitting device 5 and the droplet flow control device 6 are composed, the heating element 3 is arranged on the outer surface of the titanium alloy casting mold 2, the bottom of the titanium alloy casting mold 2 is provided with a droplet flow control device 6, and the upper surface of the substrate 4 is The two ends of the surface are provided with ultrasonic surface wave emitting devices 5 respectively, the substrate 4 is located directly below the titanium alloy mold 2, and an air inlet 7 is arranged at the upper end of a side wall of the gas chamber 1, and an air inlet 7 is arranged on the side opposite to the air inlet....

specific Embodiment approach 2

[0026] Embodiment 2: This embodiment is different from Embodiment 1 in that: the heating element 3 is an induction or resistance heating element. Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0027] Specific embodiment three: In this embodiment, a method for preparing metal microspheres by using ultrasonic surface standing waves is realized in the following steps:

[0028] 1. Put the metal material in the titanium alloy casting mold 2, and at the same time pass inert gas into the gas chamber 1 for protection, then start the heating element 3, heat the metal material to 20°C~100°C above the melting point, and keep it warm for 10~30min. After the material is completely melted, the metal material melt is obtained, and then the ultrasonic surface wave emitting device 5 is started, and the droplet flow control device 6 is turned on at the same time to make the metal material melt drip onto the surface of the substrate 4 drop by drop, forming a spherical shape with the same size under the action of ultrasonic waves. metal droplets;

[0029] 2. Stop the ultrasonic surface wave emitting device 5 and the heating element 3, start cooling with an air cooling system at a cooli...

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Abstract

The invention discloses a device and method for preparing metal microballoons by using ultrasonic surface standing waves, relates to a device and a method for preparing the metal microballoons, and aims to solve the problems that the conventional device for preparing the metal microballoons is complicated, and the size cannot be controlled flexibly. The device consists of an air storehouse and a titanium alloy casting die, a heating element, a base plate, two ultrasonic surface wave emission devices and a droplet flow control device which are positioned in the air storehouse. The method comprises the following steps of: 1, completely dissolving a metal material to obtain a metal solution, gradually dropping the metal solution on the surface of the base plate, and forming spherical metal droplets with the same size under the action of ultrasonic waves; and 2, cooling the metal microballoons by an air-cooling system until the metal microballoons are cooled to be solids, and thus obtaining the metal microballoons with the same size. By the device and the method, various metal microballoons with relatively small sizes can be prepared; the preparation process takes 1 to 2 minutes at one time, so that the production efficiency is greatly improved; and the device and the method are applied to the field of preparation of the metal microballoons.

Description

technical field [0001] The invention relates to a device and a method for preparing metal microspheres. Background technique [0002] With the rapid development of the semiconductor packaging industry, higher requirements are put forward for high-density packaging in various forms and structures. Among them, micro-ball grid packaging (BGA) has high I / O density and high yield due to its easy operation. Many advantages such as high efficiency are widely used. The solder ball is connected to the circuit board as the output terminal of the package. In order to improve the soldering quality between the package and the circuit board, it is required that the solder balls have an appropriate and consistent size and good roundness. At present, solder balls are usually first prepared by using a solder ball production device, and then the prepared solder balls are placed in a solder ball screening device, and the quality of the solder balls is screened by using the solder ball screen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08
Inventor 许志武马琳黎华栋闫久春
Owner HARBIN INST OF TECH
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