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Glass fiber reinforced organic silicon modified phenolic molding material and preparation method thereof

A technology of phenolic molding compound and glass fiber, which is applied in the field of phenolic molding compound, can solve the problems of difficult long-term storage of phenolic molding compound, and achieve the effects of improved water absorption and weather resistance, low energy consumption, high toughness and heat resistance

Active Publication Date: 2012-11-14
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The Chinese patent with the publication number CN 101974199 A discloses a low-shrinkage phenolic molding compound, which uses a thermosetting novolac resin as a matrix, adds glass fibers and cotton fibers at the same time, and uses nano-scale inorganic fillers to improve the strength and shrinkage resistance of the material. Overall improvement, but due to the use of thermosetting novolac resin as a matrix, the obtained phenolic molding compound is difficult to store for a long time

Method used

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  • Glass fiber reinforced organic silicon modified phenolic molding material and preparation method thereof
  • Glass fiber reinforced organic silicon modified phenolic molding material and preparation method thereof
  • Glass fiber reinforced organic silicon modified phenolic molding material and preparation method thereof

Examples

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preparation example 1

[0045] (1) Preparation of organosilicon modifier: Add eugenol (164kg, 1000mol) and 15g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to about 60°C, and add 1,1,3,3-tetramethyldisilazol Oxygen (67kg, 500mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction was carried out until the end of the heating phenomenon and then continued for 2-3 hours to obtain the organosilicon modifier with a yield of 93% , the structural formula and nuclear magnetic spectrum of the organosilicon modifier are as follows figure 1 shown.

[0046](2) Preparation of organosilicon-modified thermoplastic phenolic resin: Add 80 kg of phenol and 10 kg of organosilicon modifier prepared by the above method into the synthesis reaction kettle, heat up and stir, add an appropriate amount of oxalic acid to adjust the pH<2, and the temperature rises to about 85°C Add dropwise 45 kg of formaldehyde solution with a mass perce...

preparation example 2

[0049] (1) Preparation of organosilicon modifier: Add eugenol (82kg, 500mol) and 9g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to about 60°C, and add 1,1,3,3-tetramethyldisilica Oxane (33.5kg, 250mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction was carried out until the end of the temperature rise phenomenon and continued for 2-3 hours to obtain an organosilicon modifier with a yield of 94 %.

[0050] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: add 100kg of phenol and 10kg of organosilicon modifier prepared by the above method to the synthesis reaction kettle, add oxalic acid to adjust the pH of the system to about 2, heat up and stir, and the temperature rises to about 85°C, drop 55kg of 37% formaldehyde solution by mass and keep it warm for 2 hours until the system becomes turbid, then vacuumize and dehydrate under reduced pressure under heating, sto...

preparation example 3

[0053] (1) Preparation of organosilicon modifier: Add 2-allylphenol (133kg, 1000mol) and 15g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to about 60°C, and mix 1,1,3,3-tetra Methyldisiloxane (67kg, 500mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction continued for 2-3 hours after the end of the temperature rise phenomenon, and the organosilicon modifier was obtained. Yield 91%.

[0054] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: Add 80kg of phenol and 10kg of organosilicon modifier prepared by the above method into the synthesis reaction kettle, add oxalic acid to adjust the pH of the system to about 2, heat up and stir, and the temperature rises to about Add 45 kg of formaldehyde solution with a mass percentage of 37% dropwise at 85°C, keep it warm for 2 hours until the system becomes turbid, then vacuumize and dehydrate the system under heating until ...

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Abstract

The invention discloses a glass fiber reinforced organic silicon modified phenolic molding material and a preparation method thereof. The phenolic molding material comprises the following components in percentage by weight: 35-70 percent of organic silicon modified thermoplastic phenolic resin, 5-45 percent of glass fiber, 5-30 percent of wood powder, 5-45 percent of filling material, 0.5-3 percent of release agent, 0.25-1.5 percent of coloring agent and 2.5-10 percent of curing agent, and the above components are mixed, crushed or graduated and the like to obtain the phenolic molding material. The obtained phenolic molding material has the advantages of long storage time, uneasiness in wetting, excellent weathering resistance, small relative density, low production cost and excellent toughness and heat resistance of solidified materials. A plastic part made by utilizing the phenolic molding material has the characteristics of good mechanical property, good toughness, small relative density, high thermal deformation temperature and the like.

Description

technical field [0001] The invention relates to the field of phenolic molding compound, in particular to a glass fiber modified phenolic molding compound and a preparation method thereof. Background technique [0002] Phenolic molding compound is a thermosetting plastic material prepared mainly from thermoplastic phenolic resin and other fillers. It has the characteristics of low price, excellent mechanical properties, good insulation performance, and easy and quick molding. It is widely used in military industry, electrical components, instruments, and buildings. and other fields. However, this type of material also has defects such as brittleness, difficulty in storage, and limited heat resistance. [0003] The Chinese patent with the notification number CN 1175042 C discloses a high-temperature-resistant inorganic fiber-reinforced injection-type phenolic molding compound. The phenolic molding compound is prepared by mixing ordinary thermoplastic phenolic resin with inorg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08L97/02C08K13/04C08K7/14C08K3/34C08K3/26C08K3/02C08G8/28
Inventor 范宏李诚卜志扬李伯耿
Owner ZHEJIANG UNIV
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