LED (light-emitting diode) packaging adhesive and production method thereof

A technology of LED packaging and production methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as the refractive index cannot be raised, dead lights, and colloids turn yellow.

Active Publication Date: 2012-11-14
兆舜科技(广东)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, due to the immaturity of the process, the thermoplasticity after complete vulcanization is not good, and the colloid falls off during the thermal shock test, resulting in LED dead lights, or cracking due to failure to withstand reflow soldering; potassium, sodium and total chlorine detection Exceeding the standard; the yellowing resistance is not good, and the colloid will turn yellow after a period of use; the air permeability is not good, and water vapor will infiltrate after being placed for a period of time, resulting in cracking due to heat and water vapor during the lighting process Phenomenon; the refractive index cannot be improved, and is generally maintained at a level of about 1.50; the overall level cannot meet the existing needs

Method used

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  • LED (light-emitting diode) packaging adhesive and production method thereof
  • LED (light-emitting diode) packaging adhesive and production method thereof
  • LED (light-emitting diode) packaging adhesive and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] (1) Preparation method of component A base rubber

[0062] The raw materials and proportions are shown in Table 1.

[0063] Table 1

[0064]

[0065]

[0066] Steps

[0067] (i) Hydrolysis reaction: Add the specified amount of liquid A into the dropping bottle, add liquid B into the three-necked reaction bottle with a stirrer, thermometer, dropping bottle and reflux condenser, start stirring, and slowly dissolve the liquid A Drop into liquid B and carry out hydrolysis reaction at 25°C for 70 minutes. After the reaction is completed, transfer the reactant into a separatory funnel, separate the lower layer of acid water, and wash the hydrolyzate repeatedly with water until there is no Cl - (AgNO 3 inspection), filter, and reserve;

[0068] (ii) Condensation reaction: Add a specified amount of neutral hydrolyzate and NaOH catalyst into a three-necked reaction flask with a stirrer, thermometer, dropping funnel and reflux condenser, start stirring, and react at ref...

Embodiment 2

[0080] (1) Preparation method of component A base rubber

[0081] The raw materials and proportioning are shown in Table 3.

[0082] table 3

[0083]

[0084]

[0085] Steps

[0086] (i) Hydrolysis reaction: Add the specified amount of liquid A into the dropping bottle, add liquid B into the three-necked reaction bottle with a stirrer, thermometer, dropping bottle and reflux condenser, start stirring, and slowly dissolve the liquid A Drop into liquid B for 100 minutes at 10°C for hydrolysis reaction. After the reaction is over, transfer the reactant to a separatory funnel, remove the acidic water in the lower layer, and wash the hydrolyzate repeatedly with water until there is no Cl - (AgNO 3 inspection), filter, and reserve;

[0087](ii) Condensation reaction: Add a specified amount of neutral hydrolyzate and KOH catalyst into a three-necked reaction flask with a stirrer, thermometer, dropping funnel and reflux condenser, start stirring, and react at 115°C for 50 mi...

Embodiment 3

[0099] (1) Preparation method of component A base rubber

[0100] The raw materials and proportioning are shown in Table 5.

[0101] table 5

[0102]

[0103]

[0104] Steps

[0105] (i) Hydrolysis reaction: Add the specified amount of liquid A into the dropping bottle, add liquid B into the three-necked reaction bottle with a stirrer, thermometer, dropping bottle and reflux condenser, start stirring, and slowly dissolve the liquid A Drop into liquid B at 45°C for hydrolysis reaction for 50 minutes. After the reaction is over, transfer the reactant into a separatory funnel, separate the lower layer of acid water, and wash the hydrolyzate repeatedly with water until there is no Cl - (AgNO 3 inspection), filter, and reserve;

[0106] (ii) Condensation reaction: the specified amount of neutral hydrolyzate and KHCO 3 Add the catalyst into a three-necked reaction flask equipped with a stirrer, a thermometer, a dropping funnel and a reflux condenser, start stirring, and r...

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Abstract

The invention relates to an LED (light-emitting diode) packaging adhesive with high refraction index. A production method for the LED packaging adhesive comprises the following steps of: performing hydrolysis reaction on liquid A and liquid B to obtain hydrolysate and performing condensation under the catalysis of an alkaline catalyst to obtain a component A-based adhesive; performing hydrolysis reaction on liquid C and liquid D to obtain hydrolysate and performing condensation under the catalysis of an alkaline catalyst to obtain a component B-based adhesive; and mixing the component A-based adhesive and the component B-based adhesive to obtain the LED packaging adhesive. The LED packaging adhesive improves the plasticity of high-hardness vulcanization pieces, completely avoids lamp failure and yellowing phenomenon caused by the colloid, has high compactness and low air permeability of the molecular structure and has extremely high luminous flux.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular, the invention relates to a high-refractive-index LED packaging glue, its production method and its application. Background technique [0002] In recent years, LED technology and market at home and abroad have developed rapidly. Among them, the luminous efficiency of LED has increased by 100 times, and the cost has dropped by 10 times. The development prospects of backlight, automobile combination taillights and interior lighting, etc., have attracted global lighting manufacturers to join in LED light source and market development. Therefore, LED is known as a new light source in the 21st century, and is expected to become the fourth-generation light source after incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps. [0003] Semiconductor LEDs are used as lighting sources, and the luminous flux of conventional products is far from that of general-purpose light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08L83/05C08G77/20C08G77/12H01L33/56
Inventor 陈正旺陈芳
Owner 兆舜科技(广东)有限公司
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