Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition

A technology for optical semiconductor devices and resin compositions, which is applied to semiconductor devices, semiconductor/solid-state device parts, epoxy resin adhesives, etc. Small fluctuation, excellent brightness stability, high heat resistance and transparency

Active Publication Date: 2014-12-31
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, one of the reliability evaluations of LEDs includes the evaluation of luminance stability, and the following problems have been pointed out with conventional sealing materials: a rise or fall in luminance can be observed in a power-on test, and poor luminance stability
So far, there has not been obtained an epoxy resin composition with a small change in brightness and excellent brightness stability.

Method used

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  • Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition
  • Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition
  • Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition

Examples

Experimental program
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Effect test

Embodiment 1

[0105] As the cycloaliphatic epoxy resin, 50 parts by weight of "CELLOXIDE 2021P" (trade name) manufactured by Daicel Chemical Industries, Ltd., and 50 parts by weight of "EHPE3150CE" (trade name) manufactured by Daicel Chemical Industries, Ltd. were used.

[0106] As a curing agent, 100 parts by weight of methylhexahydrophthalic anhydride (manufactured by Shinnippon Chemical Co., Ltd., trade name "Rikacid MH-700") was used, and as a curing accelerator, tetraphenyl bromide (manufactured by Wako Pure Chemical Industries, Ltd.) 1 part by weight. In addition, 1.5 parts by weight of ethylene glycol (manufactured by Wako Pure Chemical Industries, Ltd.) was used.

[0107] The above-mentioned components were uniformly mixed (2000 rpm, 5 minutes) using "a defoaming stirrer" manufactured by Thinky Co., Ltd., to obtain a resin composition for encapsulating an optical semiconductor.

Embodiment 2

[0109] In addition to the use of ethyl triphenyl iodide (Wako Pure Chemical Industries Co., Ltd.) 0.5 parts by weight and triphenylphosphine (Kishida Chemical Co., Ltd.) 0.5 parts by weight were used as curing accelerators, and a resin combination for optical semiconductor sealing was obtained in the same manner as in Example 1. things.

Embodiment 3

[0111] As the epoxy resin, 70 parts by weight of "EHPE3150CE" (trade name) manufactured by Daicel Chemical Industry Co., Ltd. and 30 parts by weight of "YD-128" (trade name) manufactured by Tohto Chemical Co., Ltd. were used, except In addition, the resin composition for optical semiconductor sealing was obtained by the method similar to Example 1.

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Abstract

Disclosed is a resin composition for sealing an optical semiconductor, said resin composition containing an epoxy resin, a hardener, and a hardening accelerator. Between 55% and 100% of the total weight of the epoxy resin in the disclosed resin composition is an alicyclic epoxy resin (A) consisting of at least one compound selected from among: compounds represented by formula (I); compounds in which an epoxy group is bonded to an alicycle via a direct single bond; and compounds having at least three epoxy groups each comprising adjacent two carbon atoms and an oxygen atom that are part of an alicycle. The hardener in the disclosed resin composition is an acid anhydride hardener, and the hardening accelerator is an ionic conjugate of the phosphonium ion represented by formula (1) with a halogen anion capable of forming an ion pair with the phosphonium ion.

Description

technical field [0001] The present invention relates to a resin composition for sealing an optical semiconductor, a cured product obtained by curing the composition, and an optical semiconductor device using the composition. Background technique [0002] As a resin composition for sealing an optical semiconductor element, many epoxy resin compositions containing an epoxy resin, a curing agent, and a curing accelerator have been reported. For example, a kind of epoxy resin composition is disclosed in patent document 1, and it comprises the epoxy resin (A) that has more than 2 epoxy groups in every 1 molecule, epoxy resin curing agent (B) and hardening accelerator ( C), the epoxy resin composition has excellent solubility in organic solvents, contains an epoxy-modified ester compound that is easy to mix with epoxy resin as an epoxy resin curing agent, and has low hygroscopicity and low dielectric constant, Excellent electrical properties such as low dielectric loss tangent. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/24C08G59/68H01L23/29H01L23/31
CPCC08G59/688C08G59/24H01L23/296H01L23/295C08G59/4215C09J163/00H01L23/293H01L2924/0002H01L2924/00
Inventor 木村伯子
Owner DAICEL CHEM IND LTD
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