Processing component for cutting hard and brittle materials and cutting component

A technology of hard and brittle materials and compositions, applied in the direction of stone processing tools, stone processing equipment, lubricating compositions, etc., can solve the problems of increasing costs, reducing the use efficiency of those skilled in the art, and adding one more processing step
CN102787005AInactive Publication Date: 2012-11-21DAXIN MATERIALS
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
DAXIN MATERIALS
Publication Date
2012-11-21
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention provides a processing component for cutting hard and brittle materials, comprising hexagonal boron nitrides, solution constituents and surface active agents. The total weight of the solution constituents is 100 part by weight, the content of the hexagonal boron nitrides is 0.01-10 part by weight, but not equal to 0.01 part by weight. When being used for cutting hard and brittle materials, the processing component has the characteristics of high-temperature resistance, good lubricating property, good polishing effect and good cutting capability. When the processing component is cut into a plurality of hard and brittle sheets, the hard and brittle sheets are easy to be separated and uneasy to be bonded. No surface damage of the sheet will occur due to the friction generated by the separation of the hard and brittle sheets, and no breaking of the sheet due to the absorption force generated during cutting will occur. Yield is effectively improved.
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Description

technical field

[0001] The invention relates to a processing composition and a cutting composition for cutting hard and brittle materials, in particular to a processing composition and a cutting composition containing hexagonal boron nitride. Background technique

[0002] The wire saw cutting technology is currently widely used in cutting silicon ingots, and can be mainly divided into free abrasive grains and fixed abrasive grains. The fixed abrasive method is to fix the abrasive particles (such as diamond abrasive grains or silicon carbide abrasive grains) on the steel wire to form a cutting tool, and then use the processing composition to cut the silicon crystal rod, while the free abrasive grain method is based on The wire saw is a cutting tool, and a cutting composition containing abrasive particles and the above-mentioned processing composition is used to cut silicon crystal rods. Regardless of whether the free abrasive method or the fixed abrasive method is used, it w...

Claims

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