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Processing component for cutting hard and brittle materials and cutting component

A technology of hard and brittle materials and compositions, applied in the direction of stone processing tools, stone processing equipment, lubricating compositions, etc., can solve the problems of increasing costs, reducing the use efficiency of those skilled in the art, and adding one more processing step

Inactive Publication Date: 2012-11-21
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This approach not only increases the cost of those skilled in the art, but also requires one more processing step, which reduces the use efficiency of those skilled in the art

Method used

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  • Processing component for cutting hard and brittle materials and cutting component
  • Processing component for cutting hard and brittle materials and cutting component

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0029] The preparation method of the processing composition and cutting composition of the present invention is not particularly limited, and a general mixing method can be used, such as mixing hexagonal boron nitride, polyols and surfactants evenly to form a processing composition , and then, add the processing composition into the abrasive particles, and keep stirring until uniform, and the cutting composition can be formed.

[0030] The method for cutting hard and brittle materials of the present invention is to contact the hard and brittle materials with the above-mentioned processing composition, and cut the hard and brittle materials into a plurality of hard and brittle chips with cutting surfaces by a cutting device. The processing composition makes the hard and crisp pieces easy to peel off from each other and difficult to stick.

[0031] The cutting device is well known to those skilled in the art, so details will not be repeated here.

[0032] Preferably, the hard a...

Embodiment 1

[0037] Weigh 0.02 parts by weight of hexagonal boron nitride, 2.033 parts by weight of diethylene glycol, 77.64 parts by weight of propylene glycol, 5.082 parts by weight of polyethylene glycol (model PEG-600), 1.016 parts by weight of SINOPOL263, 0.102 parts by weight SW-923, 0.102 parts by weight of SAS-60, 0.203 parts by weight of triethanolamine, 0.02 parts by weight of phthalate, 0.183 parts by weight of octanoic acid and 15.25 parts by weight of water are stirred and mixed at room temperature to obtain processed Composition.

Embodiment 2～5 and comparative example 1～2

[0039] Examples 2 to 5 and Comparative Examples 1 to 2 prepared the processed composition in the same steps as in Example 1, the difference being that the types of hexagonal boron nitride, solvent components, surfactants and additives were changed and content, as shown in Table 1. The processed composition was evaluated for each test item, and the results are shown in Table 1.

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PUM

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Abstract

The invention provides a processing component for cutting hard and brittle materials, comprising hexagonal boron nitrides, solution constituents and surface active agents. The total weight of the solution constituents is 100 part by weight, the content of the hexagonal boron nitrides is 0.01-10 part by weight, but not equal to 0.01 part by weight. When being used for cutting hard and brittle materials, the processing component has the characteristics of high-temperature resistance, good lubricating property, good polishing effect and good cutting capability. When the processing component is cut into a plurality of hard and brittle sheets, the hard and brittle sheets are easy to be separated and uneasy to be bonded. No surface damage of the sheet will occur due to the friction generated by the separation of the hard and brittle sheets, and no breaking of the sheet due to the absorption force generated during cutting will occur. Yield is effectively improved.

Description

technical field [0001] The invention relates to a processing composition and a cutting composition for cutting hard and brittle materials, in particular to a processing composition and a cutting composition containing hexagonal boron nitride. Background technique [0002] The wire saw cutting technology is currently widely used in cutting silicon ingots, and can be mainly divided into free abrasive grains and fixed abrasive grains. The fixed abrasive method is to fix the abrasive particles (such as diamond abrasive grains or silicon carbide abrasive grains) on the steel wire to form a cutting tool, and then use the processing composition to cut the silicon crystal rod, while the free abrasive grain method is based on The wire saw is a cutting tool, and a cutting composition containing abrasive particles and the above-mentioned processing composition is used to cut silicon crystal rods. Regardless of whether the free abrasive method or the fixed abrasive method is used, it w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M169/04C10M173/02B28D1/06B28D5/04C10N40/00
Inventor 王兴嘉佘怡璇卢厚德汤慧怡
Owner DAXIN MATERIALS
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