Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-power white-light LED fluorescent powder coating method

A phosphor, high-power technology, used in optics, opto-mechanical equipment, instruments, etc., can solve the problems of uneven light field distribution, device failure, difficult to accurately control the thickness and shape of the phosphor layer, and improve light uniformity. , Reduce the effect of spatial light chromatic aberration

Inactive Publication Date: 2012-12-26
SHENZHEN JIUZHOU OPTOELECTRONICS TECH
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Main problems: 1. Due to the unevenness of the actual microscopic surface of the glue droplet, when the light exits, local yellowish or bluish uneven spots appear; 2. The thickness and shape of the phosphor layer are difficult to accurately control, resulting in light field distribution Inhomogeneous; 3. In actual operation, regardless of manual or machine operation, there will be certain differences in the shape of the phosphor powder between the same batch of LEDs, resulting in poor light and color consistency of the product and low repetition rate of the product
However, the water-soluble polyvinyl alcohol transparent photosensitive adhesive used in this method cannot withstand the high temperature of subsequent packaging such as reflow soldering processes, which may cause device failure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-power white-light LED fluorescent powder coating method
  • High-power white-light LED fluorescent powder coating method
  • High-power white-light LED fluorescent powder coating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Mix phenolic resin, azonaphthoquinone and propylene glycol monomethyl ether acetate according to the concentration ratio of 25:10:65, fully dissolve, and filter twice with 0.25 μm polytetrafluoroethylene ultrafiltration membrane to prepare a new type of resistant For high-temperature positive photoresist, store in a refrigerator at 5-20°C and keep it sealed and protected from light.

[0039] Prepare the AB silica gel at a ratio of 1:1, then mix it with an appropriate amount of fluorescent powder, and stir evenly to make fluorescent powder glue.

[0040] Mix and stir the prepared phosphor powder glue and photoresist according to the mass of 75 parts and 25 parts evenly to prepare photoresist containing phosphor powder, and place it still until the bubbles disappear.

[0041]Coat the photoresist containing the phosphor on the LED chip, and put the photoresist on the homogenizer at a speed of 350rpm for 20s to form a phosphor layer containing the photoresist, and dry it na...

Embodiment 2

[0046] Mix phenolic resin, azonaphthoquinone and propylene glycol monomethyl ether ester according to the concentration ratio of 15:7:78, stir evenly, fully dissolve, and filter twice with 0.25 μm polytetrafluoroethylene ultrafiltration membrane to prepare A new type of high-temperature-resistant positive-type photoresist should be stored in a refrigerator at 5-20°C and sealed away from light.

[0047] Prepare the AB silica gel at a ratio of 1:1, then mix it with an appropriate amount of fluorescent powder, and stir evenly to make fluorescent powder glue.

[0048] Mix and stir the prepared fluorescent powder glue and photoresist according to the mass of 65 parts and 35 parts evenly to make a photoresist containing phosphor powder, and place it still until the bubbles disappear.

[0049] The photoresist containing phosphor is sprayed on the front surface of the LED chip to form a phosphor layer containing photoresist, and air-dried in a dark room.

[0050] The phosphor layer o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a high-power white-light LED packaging technology, in particular to a fluorescent powder coating process. The fluorescent powder coating process comprises the following steps: preparing a positive photoresist based on phenolic resin; preparing a fluorescent powder gum with the photoresist; coating the fluorescent powder gum; exposing and developing; and hardening. According to the high-power white-light LED fluorescent powder coating method, the phenolic resin as an organic component is taken as a film forming agent, azo naphthoquinone and derivates thereof or a diazo compound or orthodiazonaphthoquinone is taken as a photosensitizer, acetic acid propylene glycol benzyl ether ester is taken as a solvent, the high-temperature-resistant positive photoresist is prepared, the photoresist is uniformly mixed with fluorescent powder and silica gel / epoxy resin according to a certain ratio so as to prepare the fluorescent powder gum of the photoresist based on the phenolic resin, and a fluorescent powder layer with uniform thickness is formed on the surface of an LED chip through processes of coating, exposing by aligning, developing and hardening, so that the LED emergent light uniformity is improved, the LED space light color difference is reduced, and a device is not influenced by a high temperature in a subsequent packaging process.

Description

Technical field: [0001] The invention belongs to the technical field of semiconductor lighting, and specifically relates to high-power white LED packaging technology, especially phosphor powder coating technology. The invention can improve the uniformity of LED light output, reduce the spatial light color difference of LED, and is not affected by the high temperature of subsequent packaging processes. . Background technique: [0002] Semiconductor lighting sources have become a new type of lighting source development trend in the world due to their advantages of high efficiency, energy saving, long life, rich colors and environmental protection. There are three ways to realize white LED: blue LED chip and yellow phosphor, RGB LED chip synthesis, ultraviolet LED chip and red, green and blue phosphor. In the white LED lighting technology, the method of combining blue LED chips with yellow phosphor (phosphor converted light emitting diode (PCLED)) is simple and feasible, and i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/50G03F7/039
Inventor 刘沛郭伦春夏鼎智陈建昌
Owner SHENZHEN JIUZHOU OPTOELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com