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Method for manufacturing polytetrafluoroethylene high-frequency circuit board

A high-frequency circuit board, polytetrafluoroethylene technology, applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc. Stable, high precision, and the effect of improving product quality and work efficiency

Inactive Publication Date: 2013-01-30
蔡新民
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

Since the ultra-long circuit board is relatively long (mostly more than 1 meter), this brings difficulties to manufacturers without corresponding hole-forming equipment
If two PTH and two thickened copper plating are performed, the bottom copper thickness of the high-frequency board will become uneven, which will bring difficulties to subsequent circuit etching and increase the performance inconsistency of high-frequency circuit board products. even unusable in severe cases

Method used

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  • Method for manufacturing polytetrafluoroethylene high-frequency circuit board

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Embodiment Construction

[0008] exist figure 1 Among them, the present invention is a manufacturing method of a polytetrafluoroethylene high-frequency circuit board, which includes the following steps: Step 1: Carry out engineering and photo-painting data production: first, carry out graphic design on the template, and use the designed graphics according to the production process According to the parameters, the engineering documents are processed, and then the processed documents are made up according to the production conditions. A high-precision laser photoplotter with a resolution of 20240dpi is used to make black negatives, and a 100-fold magnifying glass is used to wash and develop the photopainted negatives. Fixing, cleaning, air-drying; then check the finished negative, and finally use the checked negative as the master to copy the diazo film with a 5KW exposure machine, and check and splice the copied diazo film; step 2 : Production of material cutting, drilling, and hole metallization: First...

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Abstract

The invention discloses a method for manufacturing a polytetrafluoroethylene high-frequency circuit board. The method comprises the following steps of: (1) manufacturing engineering and light painting information; (2) cutting, drilling and carrying out hole metallization; (3) manufacturing surface patterns; (4) electroplating and etching; (5) carrying out surface weldability treatment; and (6) molding. The method for manufacturing the polytetrafluoroethylene high-frequency circuit board, disclosed by the invention, has the advantages that the manufacturing accuracy is high, the product quality and the work efficiency are effectively increased, and the manufactured high-frequency circuit board has stable performance.

Description

technical field [0001] The invention relates to a manufacturing method of a polytetrafluoroethylene high-frequency circuit board. Background technique [0002] With the development of electronic products in the direction of high frequency and high reliability, high-frequency circuit boards for 3G and 4G communications not only have the excellent high heat resistance, high heat dissipation, and excellent dimensional stability of ordinary circuit boards, but also With high frequency, the insulating dielectric layer has good strength, flexibility and high breakdown voltage; since most of the antenna circuit boards for 4G communication base stations are ultra-conventional ultra-long circuit boards, with the upgrading of communication technology, the current Some ultra-long circuit boards have begun to require metallized holes. Since the ultra-long circuit board is relatively long (mostly more than 1 meter), this brings difficulties to manufacturers who do not have corresponding...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
Inventor 蔡新民
Owner 蔡新民
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