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Electroplating solution and electroplating method

A copper electroplating solution and electrolyte technology, applied in the fields of metal electroplating and copper electroplating, can solve the problem of not being able to provide a flat copper plating layer, and achieve the effect of reducing nodules and good dispersing ability

Active Publication Date: 2016-01-13
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current bath additives, especially current levelers are not effective in providing a planar copper plating on the substrate surface and enabling via filling and / or blind via filling

Method used

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  • Electroplating solution and electroplating method
  • Electroplating solution and electroplating method
  • Electroplating solution and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] In a 100 mL round-bottomed three-necked flask equipped with a condenser and a thermometer, add 100 mmol of pyrazole and 20 mL of deionized water, and then add 63 mmol of 1,4-butanediol diglycidyl ether. The resulting mixture was heated using an oil bath set to 110° C. for about 5 hours and stirred at room temperature for an additional 8 hours. The amber, less viscous reaction product was transferred to a 200 mL volumetric flask, rinsed and adjusted to the 200 mL mark with deionized water. The reaction product (reaction product 1) was used without further purification. reaction product 1 1 HNMR (500MHz, CH 3OH-d6) analysis results showed the following peaks confirming its structure: δppm: 7.65-7.62 (m, 1H, H arom .); 7.49-7.48 (m, 1H, H arom .); 6.29-6.27 (m, 1H, H arom .); 4.32-3.30(m, 8.82H(14Hx0.63mole), 4xCH 2 -O, 2xCH-OH, 2xCH 2 -N); 1.69-1.63(m, 2.52H(4Hx0.63mole), 2xCH 2 ).

Embodiment 2

[0084] 1,4-Butanediol diglycidyl ether (25.2 mmol) and 40 mmol of 4,5,6,7-tetrahydroindazole were added to a round bottom reaction flask at room temperature. 12 mL of deionized water was then added to the flask. The initially formed white suspension eventually transformed into a phase-separated mixture as the reaction temperature increased. The reaction mixture was heated using an oil bath set to 95°C for about 2 hours. After that, 2 mL of concentrated sulfuric acid (or 4 mL of 50% sulfuric acid) was added to the reaction flask, and the solution became transparent light yellow. The mixture was heated for an additional 3 hours and stirred at room temperature for an additional 8 hours. The resulting light amber reaction product was transferred to a volumetric flask, rinsed and diluted with 0.5-1% sulfuric acid. The reaction product (reaction product 2) solution was used without further purification.

Embodiment 3

[0086] The reaction products in Table 1 were prepared by the general procedure of Example 1 or 2. Detect the ultraviolet absorption spectrum of this reaction product in water and record the λ of absorbance in table 1 max (nm).

[0087] Table 1

[0088]

[0089]

[0090]

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PUM

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Abstract

Electroplating solution and electroplating method. Provided is a copper electroplating solution layer containing a leveler that is a combination of one or more cyclic diazo compounds and one or more epoxide-containing compounds for depositing copper plating on the surface of a conductive layer reaction product. This bath deposits a substantially uniform copper layer on the substrate over a range of electrolyte concentrations. A method of depositing a copper layer using such a copper electroplating solution is also disclosed. A copper electroplating solution is provided, the copper electroplating solution comprises: a copper ion source, an electrolyte and a leveling agent, wherein the leveling agent is one or more cyclic diazepine compounds and one or more epoxy-containing The reaction product of the compound of compound; wherein at least one cyclic diazepine compound has structural formula (I)

Description

technical field [0001] The present invention relates generally to the field of metal plating. The invention relates in particular to the field of copper electroplating. Background technique [0002] A typical method of electroplating a metal coating on an item involves applying an electrical current between two electrodes in an electroplating bath, one of the electrodes being the item to be plated. Typically acidic copper plating baths include dissolved copper (usually copper sulfate), an acidic electrolyte such as an amount of sulfuric acid to give the bath sufficient conductivity, and suitable additives to improve the uniformity of plating and the quality of the metal deposit. Such additives include accelerators, levelers and inhibitors, among others. [0003] Copper electroplating baths have been used in a variety of industrial applications, such as decorative and protective plating, and in the electronics industry, particularly in the manufacture of printed circuit boa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC25D7/00C25D3/38
Inventor Z·I·尼亚齐比托瓦M·A·热兹尼克
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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