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Electronic device module comprising long chain branched (LCB), block, or interconnected copolymers of ethylene and optionally silane

A technology for electronic devices, copolymers, applied at the value of melting temperature. Fields that can solve problems such as reduced thermal creep resistance

Inactive Publication Date: 2013-03-06
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this thermoplasticity must not be achieved at the expense of effective thermal creep resistance

Method used

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  • Electronic device module comprising long chain branched (LCB), block, or interconnected copolymers of ethylene and optionally silane
  • Electronic device module comprising long chain branched (LCB), block, or interconnected copolymers of ethylene and optionally silane
  • Electronic device module comprising long chain branched (LCB), block, or interconnected copolymers of ethylene and optionally silane

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0239] 2 grams of Polymer 2 (LP2) was added to a 100 ml autoclave reactor. After closing the reactor, the stirrer was started at 1000 rpm (revolutions per minute). The reactor was deoxygenated by evacuating the system and pressurizing with nitrogen. Repeat 3 times. The reactor was then pressurized to 2000 bar with ethylene at ambient temperature and then vented. Repeat 3 times. The last time the reactor was vented with ethylene, the pressure only dropped to about 100 bar, at which point the reactor heating cycle was started. After reaching an internal temperature of about 220°C, the reactor was pressurized to about 1600 bar with ethylene and maintained at 220°C for at least 30 minutes. The estimated amount of ethylene in the reactor was about 46.96 grams. A 3.0 mL mixture of 0.5648 mmol / ml propionaldehyde and 0.01116 mmol / ml tetrabutyl peroxyacetate initiator in n-heptane was then purged into the reactor using ethylene. The increase in pressure (to about 2000 bar) and th...

Embodiment 2

[0243] 2 grams of polymer 1 (LP1) was added to a 100 ml autoclave reactor. After closing the reactor, the stirrer was started at 1000 rpm. The reactor was deoxygenated by evacuating the system and pressurizing with nitrogen. Repeat 3 times. The reactor was then pressurized to 2000 bar with ethylene at ambient temperature and then vented. Repeat 3 times. The last time the reactor was vented with ethylene, the pressure only dropped to about 100 bar, at which point the reactor heating cycle was started. After reaching an internal temperature of about 220°C, the reactor was pressurized to about 1600 bar with ethylene and maintained at 220°C for at least 30 minutes. The estimated amount of ethylene in the reactor at this time was about 46.96 grams. A 3.0 mL mixture of 0.5648 mmol / ml propionaldehyde and 0.01116 mmol / ml tetrabutyl peroxyacetate initiator in n-heptane was then purged into the reactor using ethylene. The increase in pressure (to about 2000 bar) and the addition o...

Embodiment 3-5

[0263] This process was repeated for each example. For each example, 2 grams of the ethylene-based polymer resins prepared in the preparation of the ethylene-based polymers (ie, LP1-3) were charged into a 100 ml autoclave reactor. Example 3 includes LP2. Example 4 includes LP1. Example 5 includes LP3. The basic properties of these polymers can be found in Table 3. After closing the reactor, the stirrer was started at 1000 rpm. The reactor was deoxygenated by evacuating the system, heating the reactor to 70 °C for 1 hour, and then purging the system with nitrogen. Afterwards, the reactor was pressurized with nitrogen and the reactor was evacuated. This step was repeated 3 times. The reactor was pressurized to 2000 bar with ethylene, while maintaining ambient temperature, and vented. This step was repeated 3 times. Upon final ethylene venting, the pressure was only reduced to about 100 bar and reactor heating was started. When the internal temperature reached about 220°...

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Abstract

An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm> in DEG C, and a heat of fusion, Hf in J / g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm > (0.2143* Hf) + 79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer.; (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt% based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.

Description

[0001] Related Application Cross Reference [0002] This application claims priority to US Provisional Application Serial No. 61 / 358065, filed June 24, 2010, which is hereby incorporated by reference in its entirety. This application is related to US Application No. 11 / 857195, filed September 18, 2007, and US Application No. 12 / 402789, filed March 12, 2009. field of invention [0003] The present invention relates to electronic device modules. In one aspect, the invention relates to an electronic device module comprising: an electronic device, such as a solar or photovoltaic (PV) cell, and a protective polymeric material. In another aspect, the present invention relates to electronic device modules wherein the protective polymer material is an ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms, said values ​​determined by NMR, the polymer also has the highest peak melting temperature T m (°C) and heat of fusion H f (J / g), said value is determined...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/10H01L31/048
CPCH01L2924/0002H01L23/293B32B17/10018H01L31/0203B32B17/1055B32B17/10678H01L31/0481H05K1/032H01L31/048Y02E10/50B32B17/10697H01L2924/00
Inventor J·A·瑙莫维茨R·M·帕特尔S·吴D·H·尼曼
Owner DOW GLOBAL TECH LLC