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Support structure of lithography machine and manufacture method

A supporting structure and manufacturing method technology, applied in the direction of microlithography exposure equipment, photolithography exposure device, etc., can solve the problems of uneven expansion and shrinkage of weldments, shorten the welding manufacturing cycle, improve structural rigidity, and reduce costs Effect

Active Publication Date: 2013-03-27
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the welding process of Invar alloy, due to the existence of uneven temperature field, the weldment will expand and shrink unevenly, so that welding stress will be generated inside the weldment.

Method used

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  • Support structure of lithography machine and manufacture method
  • Support structure of lithography machine and manufacture method
  • Support structure of lithography machine and manufacture method

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] In order to better understand the technical content of the present invention, specific embodiments are given and described below in conjunction with the accompanying drawings.

[0043] see figure 1 , figure 1 Shown is a schematic structural diagram of a support structure of a lithography machine according to a preferred embodiment of the present invention.

[0044] The support structure includes a peripheral panel 10 including at least a first face 11 and a second face 12 , the first face 11 being connected to the second face 12 . Of course, if figure 1 As shown in the figure, the peripheral board 10 also includes other surfaces, which are not labeled and described in this embodiment for the convenience of description. Those skilled in the art can change the shape of the peripheral plate 3 as required.

[0045] The peripheral board 10 includes at least one bending edge 1, the bending edge 1 has a bending groove, and the first surface 11 and the second surface 12 are...

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PUM

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Abstract

The invention provides a support structure of a lithography machine and a manufacture method. The support structure comprises a peripheral board. The peripheral board comprises a first surface, a second surface and a folding edge. The second surface is connected to the first surface. The sheet material at the connection part of the first surface and the second surface can form the folding edge through folding, the folding edge has a folding groove, the first surface and the second surface fold at the position of the folding groove to form an included angle. The first surface and the second surface are connected through welding by multiple blocks of the sheet materials. According to the invention, the sheet material folding replaces partial welding structure, and is more suitable for polyhedral complex support structure with a geometrical profile, and the manufacture technology is improved and the welding manufacture period is shortened.

Description

technical field [0001] The present invention relates to a support structure, in particular to a support structure in which a bent plate replaces a part of a welded structure, and a manufacturing method of the support structure. Background technique [0002] Invar (Invar) is a common material for the main substrate and measurement bracket of the lithography machine. It is a low thermal expansion alloy, the composition is an iron-nickel alloy containing Ni36%, and it has a very low thermal expansion coefficient below 230°C (as low as -253°C). Due to its good plasticity, stable performance and low heat transfer, it is mainly used to manufacture parts with high dimensional accuracy within the range of ambient temperature changes, and precision instrumentation parts and resonant cavities that require constant size and extremely low expansion coefficient near normal temperature. Parts, including measuring instruments with small scale drift with temperature changes, radio frequenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
Inventor 吴飞周瑞良阎涛袁志扬
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD