Laminate film, and film for use in production of semiconductor comprising same
A laminated film, outermost layer technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, layered products, etc., can solve problems such as difficult peeling, twisting or warping, semiconductor wafer deformation, etc., to achieve excellent heat resistance and stress relaxation effects
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Embodiment
[0092] Next, the present invention will be described in detail based on examples, but the present invention is not limited by these examples.
[0093] ・About the test method [heat resistance test]
[0094] A laminate was formed by stacking the strip-shaped aluminum foil cut to a width of 6 cm and the film produced in this example or comparative example. The film was cut so that the longitudinal direction was the TD direction. In addition, the aluminum foil and the film were laminated so that the outermost layer of the film was in contact with the aluminum foil. The obtained laminate was covered with a fluororesin film, and pressurized under the conditions shown below using a heat seal bar (30 cm) to obtain a sample for evaluation.
[0095] Pressure: 0.07MPa
[0096] Sealing strip width: 20mm
[0097] Heat sealing time: 5 seconds
[0098] Sealing strip temperature: 80°C
[0099] Using a tensile tester, the adhesive force (g / 20mm) between the aluminum foil and the film of ...
Embodiment 1
[0130] Use EMAA (1) (ethylene·methacrylic acid random copolymer, manufactured by Mitsui-DuPont Polychemicals Co., Ltd.) shown in Table 1 as the material of the outermost layer, and EMAA-IO (1) shown in Table 2. ) (zinc (Zn) ionomer of ethylene·methacrylic acid random copolymer, manufactured by Mitsui-DuPont Polychemicals Co., Ltd.) As the material for the second layer, a multilayer extruder (40mmφ×3 ) was subjected to extrusion molding, whereby a laminated film having a thickness of 160 μm having a two-layer structure (thickness ratio of the outermost layer to the second layer=30 / 70) was obtained. The evaluation result of the heat resistance of the obtained laminated film was "⊚", and the evaluation result of the stress relaxation property was "◯".
Embodiment 2～9、 comparative example 1～7
[0132] A (laminated) film was obtained in the same manner as in Example 1 above except that the materials of the outermost layer and the second layer and the thicknesses of the outermost layer and the second layer were as shown in Table 3. Table 3 shows the evaluation results of the heat resistance and stress relaxation properties of the obtained (laminated) film.
[0133]
[0134] [evaluate]
[0135] From the results shown in Table 3, it can be seen that the laminated films of Examples 1 to 9 are superior to the (laminated) films of Comparative Examples 1 to 7 in heat resistance and stress relaxation. In addition, when the ionomer of EMAA having a methacrylic acid content of 17% by mass or more was used to form the second layer (Example 1), compared with the ionomer of EMAA having a methacrylic acid content of less than 17% by mass, Compared with the case of forming the second layer (Comparative Examples 4 and 5), the stress relaxation property was excellent.
[0136] It...
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Abstract
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