Heat dissipation adhesive tape applied to electronic device and preparation process of same

Abstract

The invention discloses a heat dissipation adhesive tape applied to an electronic device, which is characterized by comprising a PET (polyethylene terephthalate) thin film with the thickness of 0.004 mm to 0.025 mm, wherein the lower surface of the PET thin film is coated with a heat conduction adhesive layer; the heat conduction adhesive layer is prepared from the following components in part by weight by baking after mixing: 100 parts of acrylic ester adhesive, 50 to 150 parts of graphite powder, 200 to 300 parts of solvent, 0.1 to 1 part of curing agent and 0.01 to 0.1 part of coupling agent; and the acrylic ester adhesive consists of the following components in part by weight: 100 parts of butyl acrylate, 0.1 to 1 part of benzoyl peroxide, 50 to 150 parts of iso-octyl acrylate, 2 to 5 parts of acrylic acid, 10 to 30 parts of methyl methacrylate, 0 to 10 parts of vinyl acetate and 0.1 to 1 part of 2-hydroxyethyl methacrylate. According to the invention, the effect that thermal conductivity is improved in both length and thickness directions is ensured; uniformity of thermal conductivity of the adhesive tape is realized; not only is the heat dissipation adhesive tape beneficial for dissipating heat, but also local overheating of the adhesive tape is avoided; and performance and service life of the product are improved.

Description

technical field [0001] The invention relates to a heat dissipation adhesive tape applied to electronic devices and a preparation process thereof, belonging to the technical field of adhesive materials. Background technique [0002] With the rapid development of the electronics industry, from ordinary desktop computers to notebook computers, tablet computers, and smart phones, technological innovation is advancing by leaps and bounds. Electronic products are becoming more portable, smaller in size, and more powerful in function, which leads to higher integration. This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components. However, the fan-type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the...

AI Technical Summary

Problems solved by technology

This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components.

However, the fan type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise.

In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.

Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits its application promotion; therefore, if a high-performance heat dissipation tape is designed for the characteristics of electronic products, it will become The direction of efforts of those of ordinary skill in the art

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