A kind of metal bonding method for quartz wafer
A quartz wafer and metal bonding technology, used in electrical components, impedance networks, etc., can solve the problem of virtual connection of quartz wafers, not suitable for bonding between quartz wafers and bases, affecting the performance stability and reliability of quartz crystal resonators, etc. problems to ensure stability and reliability
Active Publication Date: 2016-02-24
BEIJING INST OF RADIO METROLOGY & MEASUREMENT
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Problems solved by technology
[0005] However, the commonly used metal bonding method is not suitable for the bonding between the quartz wafer and the base in the quartz crystal resonator
Quartz wafers bonded by metal bonding are prone to false connections, insufficient bonding strength, and falling off, which lead to the inability of the quartz crystal resonator to vibrate, large resistance or stop vibration, thus affecting the stability and reliability of the performance of the quartz crystal resonator. sex
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Embodiment Construction
[0019] The content of the present invention will be further described below in conjunction with the embodiments.
[0020] The metal bonding method for quartz wafer provided by the present embodiment comprises the following steps:
[0021] Prepare the adhesive: the material of the adhesive is a gold-tin alloy, wherein the mass percentage of gold is 80%, and the mass percentage of tin is 20%;
[0022] Clean the object to be bonded: immerse the quartz wafer and base of the object to be bonded in an acidic cleaning solution and clean it with ultrasonic waves for 1-2 minutes; after ultrasonic cleaning, heat the container containing the quartz wafer, base and cleaning solution until the cleaning solution boils , and then naturally cooled to room temperature; pour out the cleaning solution in the container after cooling to room temperature, and then add sodium hydroxide solution to the container to neutralize the cleaning solution remaining on the surface of the quartz wafer and the ...
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The invention discloses a metal bonding method for a quartz wafer. The method comprises the following steps of: preparing an adhesive agent; cleaning a to-be-bonded object; bonding, namely fixing a dried base on a fixing plate of a heater and heating the base to 300-340 DEG C; observing by virtue of a microscope, clamping the adhesive agent by use of a clamping tool and putting the adhesive agent on the to-be-bonded part of the base, wherein the adhesive agent is molten after being contacted with the base; observing by virtue of the microscope, clamping the quartz wafer by use of the clamping tool and putting the quartz wafer to the molten adhesive agent on the base; repeatedly moving the quartz wafer so as to enable the quartz wafer to rub with the adhesive agent until the quartz wafer and the adhesive agent are in full contact; and after rubbing, taking down the base from the mounting plate of the heater, and bonding the quartz wafer with the base after the base is naturally cooled to room temperature. The metal bonding method can be used for avoiding the phenomena such as false connection, insufficient bonding strength and shedding of the bonded quartz wafer, and thus ensuring the performance stability and reliability of a quartz-crystal resonator.
Description
technical field [0001] The invention relates to the technical field of metal bonding, in particular to a metal bonding method for quartz wafers. Background technique [0002] A quartz crystal resonator generally includes a quartz wafer with electrodes, a base and a casing, wherein the connection between the quartz wafer and the base is realized by bonding an adhesive. After the connection between the quartz wafer and the base is realized by bonding the adhesive, the base is used to support and fix the quartz wafer, and to realize the electrical connection between the quartz wafer and the base. The oscillation of the quartz crystal is realized through the peripheral circuit, so that the quartz crystal generates an oscillation frequency, so that the quartz crystal can be used as a frequency source. [0003] At present, the common adhesive used for bonding between the quartz wafer and the base is conductive glue, and its main components are silver powder and resin. The conduc...
Claims
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IPC IPC(8): H03H3/02H03H9/05
Inventor 周伟平潘立虎叶林郑文强刘小光张秋艳牛磊王作雨高远
Owner BEIJING INST OF RADIO METROLOGY & MEASUREMENT