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A kind of chemical treatment method of pcb electroplating copper bath

A treatment method and technology for electroplating copper, which are applied in the directions of electrolysis components, electrolysis process, cells, etc., can solve the problems of reducing the pollution degree of copper bath potion and high treatment cost, and achieve the effect of convenient adsorption and guaranteeing treatment quality.

Active Publication Date: 2015-10-28
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, the present invention provides a method for treating PCB electroplating copper bath potion, which can effectively solve the problem of high treatment cost when there are too many pollutants in electroplating potion, and realize copper plating at a relatively low cost. Pollution degree of potion water is significantly reduced, and the reuse of potion not only effectively guarantees the production quality, but also greatly reduces the pressure of wastewater treatment, so as to realize energy saving and environmental protection in the process of PCB board production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Pump the potion in the electroplating copper tank into the spare tank through the filter pump; add 3ml / l industrial hydrogen peroxide and turn on the blower device; and start the heating device to control the temperature in the spare tank at 70°C, and reduce the temperature to 70°C after 2 hours Add activated carbon powder to 4.5g / l at 40°C, turn off the blower device to stop air stirring; the potion turns blue after standing for 8 hours, and the whole Hastelloy plate shows In the burnt state, use the filter pump to pump the treated liquid back into the electroplating copper tank for reuse.

[0027] The specific steps for the test using the copper tank Hastelloy sheet are as follows: 1) Take 500ml of the treated potion; 2) Grind the brass sheet ((100mm*65mm) evenly with 1000-mesh sandpaper and wash it with water; 3) First remove the treated Pour the final potion into the Hastelloy tank, then put the brass sheet, connect the rectifier, connect the anode to the phosphor c...

Embodiment 2

[0030] Pump the potion in the electroplating copper tank into the spare tank through the filter pump; add 2ml / l industrial hydrogen peroxide and turn on the blower device; and start the heating device to control the temperature in the spare tank at 70°C, and reduce the temperature to 70°C after 2 hours Add activated carbon powder to 4.5g / l at 40°C, turn off the blower device to stop air stirring; after standing for 8 hours, the potion passed the Hastelloy test. When the potion was tested, the high current area was slightly burnt, but all the coatings had a layer It is misty and the solution is light green. Use a filter pump to pump the treated liquid back into the electroplating tank for reuse.

Embodiment 3

[0032] Pump the potion in the electroplating copper tank into the spare tank through the filter pump, add industrial hydrogen peroxide 4ml / l and turn on the blower device; and start the heating device to control the temperature in the spare tank at 65°C, and reduce the temperature to 65°C after 2 hours. Add activated carbon powder to 4g / l at 35°C, turn off the blower device to stop air stirring; the potion turns blue after standing for 10 hours. In the coke state, use the filter pump to pump the treated liquid back into the electroplating copper tank for reuse.

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PUM

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Abstract

The invention discloses a chemical water treatment method for a PCB (printed circuit board) electro-coppering trough. The method comprises the following steps: (1) pumping chemical water in an electro-coppering trough into a spare trough through a filtering pump, wherein a heating device and a blower device are arranged outside the spare trough; (2) adding 3-5ml / l of industrial hydrogen peroxide with concentration of 50-70%, and starting the blower device; (3) starting the heating device, controlling the temperature in the spare trough at 65-70DEG C, lowering temperature to less than 40DEG C after two hours, adding active carbon powder to 4-5g / l, and stopping the blower device so as to stop air stirring; and (4) standing chemical water for 8-10 hours, and pumping the treated chemical water back to the electro-coppering trough to reuse through the filtering pump. The chemical water pollution degree in the copper trough is obviously reduced through the method disclosed by the invention while the cost is low, the chemical water can be reused, not only is the production quality guaranteed, but also the pressure of waste water treatment is reduced; and therefore, the energy conservation and environmental protection in the production process of the PCB are realized.

Description

technical field [0001] The invention relates to a PCB board electroplating process, in particular to a PCB electroplating copper tank liquid treatment method. Background technique [0002] In the PCB board manufacturing industry, in order to realize graphic transfer, most enterprises use dry film process for graphic transfer, and then use graphic electroplating to realize the circuit function of PCB board. Since the dry film in the dry film process is a high-molecular organic matter, it will gradually dissolve after long-term immersion in high-acidity electroplating potions, so that the content of organic pollutants in the potion in the electroplating copper bath will continue to increase; and under the action of current, light The agent may decompose in a small amount and further pollute the electroplating solution. With more and more pollutants, the color of the potion in the electroplating copper bath gradually changes from blue to green, and the ductility and tensile st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/18C25D21/02C25D21/06
Inventor 王予州刘德威周刚
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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