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Low-medium low-loss LTCC (Low Temperature Co-Fired Ceramic) microwave ceramic material and preparation method thereof

A technology of microwave ceramics and low loss, applied in the field of electronic ceramic materials and its manufacturing, can solve the problems of reducing ceramic microwave performance, ceramic cracking, etc., and achieve the effects of improving process compatibility and yield, convenient operation, and low dielectric loss

Active Publication Date: 2013-05-29
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

Low-temperature sintering can be achieved by adding low-melting oxides and glass phases, but the addition of glass phases will reduce the microwave performance of ceramics, and after the LTCC process is used to make devices or substrates, ceramics have the risk of cracking in case of soldering.

Method used

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  • Low-medium low-loss LTCC (Low Temperature Co-Fired Ceramic) microwave ceramic material and preparation method thereof
  • Low-medium low-loss LTCC (Low Temperature Co-Fired Ceramic) microwave ceramic material and preparation method thereof
  • Low-medium low-loss LTCC (Low Temperature Co-Fired Ceramic) microwave ceramic material and preparation method thereof

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Embodiment Construction

[0027] The following description is a specific embodiment of the LTCC microwave ceramic material of the present invention. Such as figure 2 Shown, the concrete preparation method of this material is as follows:

[0028] Step 1: Using CaCO 3 , WO 3 , Li 2 CO 3 As the initial raw material, according to 0.9 CaWO 4 -0.1 Li 2 WO 4 The molar ratio of each element in the formula molecular formula is converted into CaCO 3 , WO 3 and Li 2 CO 3 The mass percentage of the mass percentage is accurately weighed, ball milled in a planetary ball mill for 12 hours at a time, and the ball milled material is placed in an oven and dried at 100°C.

[0029] Step 2: Pass the dried material obtained in Step 1 through a 40-mesh sieve, put it into a crucible for compaction, and pre-burn it at a heating rate of 2 °C / min to 900 °C, keep it for 2 hours, and cool it with the furnace to obtain a pre-fired material for use .

[0030] Step 3: Roughly grind the bulk calcined material obtained in...

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Abstract

The invention discloses a low-medium low-loss LTCC (Low Temperature Co-Fired Ceramic) microwave ceramic material and a preparation method thereof. The material is composite ceramic containing double phases, wherein the principal crystalline phase is tetragonal-phase scheelite CaWO4; the auxiliary phase is a trigonal crystal system phenacite structure Li2WO4 with the molecular formula of (1-x) CaWo4-xLi2WO4. The preparation method of the low-medium low-loss LTCC microwave ceramic material comprises the following steps of: with CaCO3, WO3 and Li2CO3 as initial materials, calculating the mass percentages of CaCO3, WO3 and Li2CO3 according to the molar ratio of each element in the molecular formula (1-x)CaWo4-xLi2WO4; weighing the materials, preliminarily ball-milling the materials, drying the materials, pre-sintering, secondarily ball-milling the materials; and obtaining the low-medium low-loss microwave ceramic material by carrying out a series of processes including drying, pelletizing, forming, sintering and the like.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials and its manufacture, and relates to a low-intermediate and low-loss microwave ceramic material sintered at low temperature and a preparation method thereof. Background technique [0002] In recent years, whether it is general-purpose electronic machines, communication equipment or consumer electronic products in the world, they are rapidly developing in the direction of miniaturization, light weight, integration, multi-function and high reliability. LTCC (Low Temperature Co-fired Ceramics) technology, as an advanced three-dimensional assembly and integration technology, has created conditions for the development of passive devices and hybrid integration of passive / active devices, and has rapidly gained popularity in laminated chip passive devices. a wide range of applications. Many internationally renowned manufacturers of electronic materials and components have entered this field, su...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/495C04B35/622
Inventor 唐晓莉章著苏桦张怀武荆玉兰李元勋
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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