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Radar-infrared combined stealth material and preparation method thereof

A stealth material, infrared technology, applied in the direction of chemical instruments and methods, laminated, layered products, etc., can solve the problems of stealth function effect to be strengthened, cumbersome process, complex structure, etc., to achieve easy scale production and application, process Simple and effective in improving the absorbing performance

Active Publication Date: 2013-06-19
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, how to develop composite radar and infrared compatible stealth materials is more realistic and operable for those skilled in the art. However, the existing composite stealth materials are not only complex in structure, cumbersome in process, but also thick It is thicker and the effect of stealth function needs to be strengthened, which has become a technical obstacle for those skilled in the art to further overcome

Method used

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  • Radar-infrared combined stealth material and preparation method thereof
  • Radar-infrared combined stealth material and preparation method thereof
  • Radar-infrared combined stealth material and preparation method thereof

Examples

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Comparison scheme
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Embodiment 1

[0032] A radar and infrared compatible stealth material of the present invention, such as figure 1 As shown, the compatible stealth material includes metal capacitive frequency selective surface layer (MCFSS layer), intermediate dielectric layer (FR-4 dielectric plate), resistive capacitive frequency selective surface layer (RCFSS layer) and Dielectric base layer (epoxy resin glass steel plate), its specific structural parameter values ​​are shown in Table 2 below:

[0033] Table 2 The value of each structural parameter of the radar and infrared compatible stealth material of embodiment 1

[0034]

[0035] A preparation method of the radar and infrared compatible stealth material of the present embodiment, comprising the following steps:

[0036] (1) Buy FR-4 single-sided copper clad laminates directly in the market;

[0037] (2) Using PCB technology to corrode the FR-4 single-sided copper clad board as figure 1 The metal-type capacitive frequency selective surface layer...

Embodiment 2

[0044] A radar and infrared compatible stealth material of the present invention, such as figure 1 As shown, the compatible stealth material includes metal capacitive frequency selective surface layer (MCFSS layer), intermediate dielectric layer (FR-4 dielectric plate), resistive capacitive frequency selective surface layer (RCFSS layer) and Dielectric base layer (unsaturated polyester resin glass steel plate), its specific structural parameter values ​​are shown in Table 4:

[0045] Table 4 The value of each structural parameter of the radar and infrared compatible stealth material of embodiment 2

[0046]

[0047] A preparation method of the radar and infrared compatible stealth material of the present embodiment, comprising the following steps:

[0048] (1) A layer of silver paste is printed on the FR-4 dielectric board by screen printing technology, and then cured to obtain a FR-4 single-sided silver-clad board;

[0049] (2) Use the circuit board engraving process to ...

Embodiment 3

[0056] A radar and infrared compatible stealth material of the present invention, such as figure 1 As shown, the compatible stealth material includes metal capacitive frequency selective surface layer (MCFSS layer), intermediate dielectric layer (FR-4 dielectric plate), resistive capacitive frequency selective surface layer (RCFSS layer) and Dielectric base layer (epoxy glass steel plate), its specific structural parameter values ​​are shown in Table 6:

[0057] Table 6 The value of each structural parameter of the radar and infrared compatible stealth material of embodiment 3

[0058]

[0059] A preparation method of the radar and infrared compatible stealth material of the present embodiment, comprising the following steps:

[0060] (1) A layer of gold film is sputtered on the FR-4 dielectric board by magnetron sputtering process to obtain the FR-4 single-sided gold-clad board;

[0061] (2) Use the circuit board engraving process to engrave such as figure 1 The metal-t...

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Abstract

The invention discloses a radar-infrared combined stealth material and a preparation method thereof. The radar-infrared combined stealth material orderly comprises a metal-type capacitive frequency selection surface layer, a middle medium layer, a resistance-type capacitive frequency selection surface layer and a medium base layer from top to bottom. The metal-type capacitive frequency selection surface layer and the resistance-type capacitive frequency selection surface layer have matrix structures. The metal-type capacitive frequency selection surface layer adopts metals having low infrared emissing ability. The middle medium layer and the medium base layer have dielectric constants of 3-10 and dielectric loss of 0.01 to 0.50. The preparation method comprises the following steps of preparing a metal film by screen printing processes, carrying out etching of the metal-type capacitive frequency selection surface layer on the metal film by a PCB technology, preparing the resistance-type capacitive frequency selection surface layer on the medium base layer by the screen printing processes, and binding the layers into an integral body by a binder by the vacuum bag molding process. The radar-infrared combined stealth material has a simple structure, is light and thin and has a good stealth effect.

Description

technical field [0001] The invention relates to the field of new materials, in particular to a radar and infrared compatible stealth material and a preparation method thereof. Background technique [0002] With the rapid development of multi-spectral detection technology, the use of single-function stealth materials has been limited. Multi-band compatible stealth materials, especially radar and infrared compatible stealth materials, have become the development direction of stealth materials research. However, in order to realize the integration of radar and infrared stealth functions (that is, mutual compatibility), there are still some contradictions. The reason is that radar stealth requires strong absorption and low reflection of electromagnetic waves, while infrared stealth requires low absorption and high reflection. . Therefore, how to solve the contradiction between the two and make them coordinate and unify is the key to realize radar / infrared compatible stealth, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B37/02B32B37/12B32B38/14B32B38/18
Inventor 程海峰田浩刘海韬周永江
Owner NAT UNIV OF DEFENSE TECH
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