Method of removing oxide film on surface of copper or copper-base alloy and copper or copper-base alloy recovered using the method

An oxide film, copper-based alloy technology, applied in the improvement of process efficiency, instruments, optics, etc., to achieve the effects of increased electrolysis efficiency, reduced size, and efficient recycling

Inactive Publication Date: 2013-06-19
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In the conventional method for removing the oxide film formed on the surface of copper or copper-based alloys, after the oxide film is removed in the pickling tank, the pickling solution containing the oxide film is electrolyzed in the electrolytic tank, s

Method used

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  • Method of removing oxide film on surface of copper or copper-base alloy and copper or copper-base alloy recovered using the method
  • Method of removing oxide film on surface of copper or copper-base alloy and copper or copper-base alloy recovered using the method
  • Method of removing oxide film on surface of copper or copper-base alloy and copper or copper-base alloy recovered using the method

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Embodiment Construction

[0035] figure 1 It is a schematic diagram of a device for implementing a corresponding embodiment of the present invention. In the oxide film removal device 1 of the present invention, copper or copper-based alloy 4 is immersed in the pickling that is full of the oxide film on the surface of copper or copper-based alloy. In the pickling tank 3 of the liquid 2, the oxide film on the surface is removed in the pickling liquid 2. Although the oxide film also depends on the degree of heat treatment in the previous process, the thickness is 0.05-10 μm, the temperature of the pickling solution 2 for the oxide film is preferably 30-60°C, and the immersion time is preferably 30-120 minutes. The copper or copper-based alloy 4 from which the oxide film has been removed is carried out from the pickling tank 3 and supplied to the next step.

[0036] Pickling solution 2 contains 50-400g / L of sulfuric acid; 1-100g / L of at least one oxidizing agent selected from nitric acid, hydrogen peroxid...

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Abstract

The invention discloses a method of removing oxide film formed on a surface of a copper or copper-base alloy of the related art, after oxide film is removed in a pickling bath, it is difficult to electrolyze a pickling solution containing the oxide film in an electrolytic bath and efficiently recover a high-purity copper or copper-base alloy capable of being reused as a recycled material having superior handleability, and furthermore it is also difficult to return the electrolyzed pickling solution to the pickling bath for reuse. A pickling solution, including: 50 g/L to 400 g/L of sulfuric acid; 1 g/L to 100 g/L of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (III) ions; 0.01 g/L to 10 g/L of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/L to 10 g/L of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/L to 300 g/L of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts.

Description

technical field [0001] The present invention relates to a method for removing the oxide film on the surface of copper or copper-based alloy, in particular, relates to a method for immersing the copper or copper-based alloy with the oxide film formed on the surface in a pickling bath to remove the oxide film, The pickling solution containing the oxide film is electrolyzed in the electrolytic tank to recover high-purity copper or copper-based alloys with good processability, and the electrolytic pickling solution is returned to the pickling tank to recover copper or copper-based alloys that can be reused. A method for removing an oxide film on the surface of a copper-based alloy. [0002] This invention is based on Japanese Patent Application No. 2011-274719 filed in Japan on December 15, 2011, Japanese Patent Application No. 2012-039190 filed in Japan on February 24, 2012, and Japanese Patent Application No. 2012-099274 filed in Japan on April 24, 2012. Priority is claimed, th...

Claims

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Application Information

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IPC IPC(8): C23G1/36C25C1/12C23G1/10
CPCC23G1/103C23G1/36C25C1/12Y02P10/20C23G1/10C25F1/04
Inventor 熊谷淳一樽谷圭荣中山宏明冈田健志加藤直树久保田贤治
Owner MITSUBISHI MATERIALS CORP
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