Chemical copper plating solution

Abstract

The invention discloses a chemical copper plating solution which comprises 10-20 g/L copper sulfate, 5-10 g/L potassium nitrate, 5-30 g/L potassium sodium tartrate, 5-30 g/L sodium ethylene diamine tetracetate, 5-50 g/L sodium hydroxide, 5-20 g/L sodium carbonate, 0.5-2 g/L ferrous sulfate, 5-50 g/L formaldehyde, 5-50 g/L methanol and the balance of deionized water. The invention has the advantages of reasonable formula, high stability, fewer impurities, high speed and high efficiency; and the coating thickness can reach higher than 20 mu m.

Description

technical field [0001] The invention belongs to the technical field of electroless copper plating, and in particular relates to an electroless copper plating solution. Background technique [0002] Electroless copper plating is a copper plating method commonly used by us at present. It is suitable for the surface of wires, plates, pipes and flying metals. Poor liquid stability, uneven coating and even virtual plating, it is difficult to meet production requirements. Contents of the invention [0003] The object of the present invention is to provide an electroless copper plating solution with a reasonable formula, a long stable service time of the plating solution and a uniform plating layer. [0004] Technical solution of the present invention is: [0005] A kind of electroless copper plating solution, it is characterized in that: be by weight ratio by following composition, copper sulfate 10-20g / L, potassium nitrate 5-10g / L, potassium sodium tartrate 5-30g / L, ethylened...

AI Technical Summary

Problems solved by technology

[0002] Electroless copper plating is a copper plating method commonly used by us at present. It is suitable for the surface of wires, plates, pipes and flying metals. Poor liquid stability, uneven coating or even virtual plating, it is difficult to meet production requirements