High-thermal-conductive moisture permeable film and preparation method thereof
A technology of moisture-permeable membrane and high thermal conductivity, which is applied in the direction of sustainable manufacturing/processing, chemical industry, climate sustainability, etc. It can solve the problem of low thermal conductivity of dehumidification membrane, inability to guarantee high heat recovery, low efficiency of total heat recovery, etc. problems, to achieve the effects of easy operation, energy-saving preparation process, and high thermal conductivity
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Embodiment 1
[0029] 1g of carbon nanotube filler and 9g of polyvinylidene fluoride powder were dissolved in 100ml of N,N-dimethylformamide, heated and stirred at 50°C for 5 hours, and then vibrated at 120W ultrasonic power for 30 minutes. Apply the solution on a clean glass plate, use a scraper to control the thickness of the film to 150um, and immediately put it into a gel bath to form a film by wet method. The gel medium used is 2-4wt% isopropanol aqueous solution. After 8 minutes, the film was peeled off from the glass plate and placed in pure water for 48 hours to remove the solvent. The film after solvent removal was flattened with a glass plate, and dried at 60°C for 4 hours to obtain a high thermal conductivity and moisture permeable film.
[0030] In the formed film, the mass content of the high thermal conductivity filler is 10%. The DRPL-I thermal conductivity measuring instrument was used to test the thermal properties of the samples. In addition, as a comparative example, the ...
Embodiment 2
[0032] 1 g of graphene filler and 9 g of modified polyvinylidene fluoride powder were dissolved in 100 ml of N,N-dimethylformamide, heated and stirred at 60°C for 4 hours, and then vibrated at 120 W ultrasonic power for 30 minutes. Apply the solution on a clean glass plate, use a scraper to control the thickness of the film to 150um, and immediately put it into a gel bath to form a wet film. The gel medium used is water. After 8 minutes, the film was peeled off from the glass plate and placed in pure water for 48 hours to remove the solvent. The film after solvent removal was flattened with a glass plate, and dried at 60°C for 4 hours to obtain a high thermal conductivity and moisture permeable film.
[0033] In the formed film, the mass content of the high thermal conductivity filler is 10%. The DRPL-I thermal conductivity measuring instrument was used to test the thermal properties of the samples. In addition, as a comparative example, the same method was used to prepare a ...
Embodiment 3
[0035] Dissolve 0.1g of aluminum nitride filler and 10g of polyethylene glycol powder in 100ml of N,N-dimethylacetamide, heat and stir at 10°C for 2 hours, and then vibrate for 40 minutes under 80W ultrasonic power. Spread the non-woven fabric on a glass plate, then apply the solution on the non-woven fabric, and use a mechanical applicator to control the thickness of the film to 250um. The film formed after the solvent is naturally volatilized is placed in a hot air drying oven and the temperature is adjusted to 80°C for further drying for 2 hours. After drying, it becomes a high thermal conductivity and moisture permeable film.
[0036] In the formed film, the mass content of the high thermal conductivity filler is 1%. The DRPL-I thermal conductivity measuring instrument was used to test the thermal properties of the samples. In addition, as a comparative example, the same method was used to prepare a moisture-permeable film without high thermal conductivity fillers. The re...
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