Preparation method of gamma-Fe2O3 sodium ion battery anode material
A technology for sodium ion batteries and anode materials, which is applied in the field of preparation of anode materials for sodium ion batteries, can solve problems such as constraints, the safety of lithium batteries has not been fundamentally solved, and the proportion of material costs increases, so as to improve the degree of crystallization, increase the capacity, the effect of increasing the actual capacity
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Embodiment 1
[0029] γ-Fe of Example 1 2 o 3 The preparation method of sodium ion battery anode material comprises the following steps:
[0030] 1) Preparation of γ-Fe by conventional co-precipitation method 2 o 3 powder, the γ-Fe 2 o 3 The powder is pressed into a target;
[0031] 2) The pressed γ-Fe 2 o 3 The target is loaded into the magnetron sputtering chamber;
[0032] 3) Use the copper sheet as the substrate, first wash with dilute hydrochloric acid to remove the oxide layer on the surface of the copper sheet, and then put the copper sheet into the magnetron sputtering chamber;
[0033] 4) Vacuumize the magnetron sputtering chamber and fill it with argon gas at a pressure of 3.0Pa, and deposit γ-Fe on the copper sheet by magnetron sputtering method 2 o 3 Thin film with a deposition rate of 0.08 nm / s and a deposition thickness of 350 nm;
[0034] 5) will deposit the γ-Fe 2 o 3 The copper sheet of the film is in a vacuum of 8.0×10 -5 Annealing at 400°C for 1 hour under t...
Embodiment 2
[0036] γ-Fe of Example 2 2 o 3 The preparation method of sodium ion battery anode material comprises the following steps:
[0037] 1) Preparation of γ-Fe by conventional co-precipitation method 2 o 3 powder, the γ-Fe 2 o 3 The powder is pressed into a target;
[0038] 2) The pressed γ-Fe 2 o 3 The target is loaded into the magnetron sputtering chamber;
[0039] 3) Use the copper sheet as the substrate, first wash with dilute hydrochloric acid to remove the oxide layer on the surface of the copper sheet, and then put the copper sheet into the magnetron sputtering chamber;
[0040] 4) Vacuumize the magnetron sputtering chamber and fill it with argon gas at a pressure of 3.0Pa, and deposit γ-Fe on the copper sheet by magnetron sputtering method 2 o 3 Thin film with a deposition rate of 0.08 nm / s and a deposition thickness of 350 nm;
[0041] 5) will deposit the γ-Fe 2 o 3 The copper sheet of the film is in a vacuum of 8.0×10 -5 Annealing at 600°C for 1 hour under t...
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