Heat radiation material, heat radiation structure, and preparation method and application thereof

A technology of heat-dissipating materials and heat-dissipating structures, applied in heat-exchange materials, chemical instruments and methods, coatings, etc., can solve the problems affecting thermal conductivity and stability, poor compatibility between heat-dissipating fillers and polymer materials, and easy aggregation of nano-heat-dissipating materials and other problems, to achieve the effect of improving interface performance, excellent heat dissipation performance, and improving compatibility

Inactive Publication Date: 2013-07-17
REGAL PAPER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat dissipation fillers in heat dissipation coating materials on the market are mainly graphite, carbon nanotubes, etc.; however, the compatibility between the above

Method used

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  • Heat radiation material, heat radiation structure, and preparation method and application thereof
  • Heat radiation material, heat radiation structure, and preparation method and application thereof
  • Heat radiation material, heat radiation structure, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0054] Example 1:

[0055] Under the protection of nitrogen, weigh 10g of 30-40nm hollow carbon nanospheres (HCNC) and place them in 50g of solvent water, ultrasonically at room temperature for 30 minutes until the dispersion is uniform; then under the ultrasonic state, adjust the pH value with 5% ammonia water To 8-10, then add 10g of modifier polyvinyl alcohol (Mw=2000) aqueous solution (concentration of 50wt%) at a rate of 3ml / min. After the addition, continue ultrasonic for 30min until the dispersion is uniform; The temperature rise rate is ℃ / min to 60℃. During this process, the remaining 5g of the modifier polyvinyl alcohol aqueous solution is added dropwise at a rate of 3ml / min. When the temperature reaches 60℃, the dripping is completed. After 4 hours of reaction, the ultra-high pressure nano-homogenizer disperses for 60 minutes, and the ultrasonic dispersion for 60 minutes, then a uniformly dispersed inorganic heat-dissipating nanomaterial aqueous slurry can be obtained. ...

Example Embodiment

[0056] Example 2

[0057] Under the protection of nitrogen, weigh 10g of 10-30nm carbon nanotubes (product label: IMC4, the same below), place them in 100g of solvent water, ultrasonically at room temperature for 30 minutes until they are uniformly dispersed; then, use 5% under ultrasonic conditions Adjust the pH value of the ammonia water to 8-10, then add 10g of modifier polyvinyl alcohol (Mw=2000) aqueous solution (concentration of 50wt%) at a rate of 4ml / min, and continue ultrasonic for 30min until dispersed Uniform; then the temperature is raised to 50°C at a heating rate of 3°C / min, during this process, the remaining 5g of the above modifier polyvinyl alcohol aqueous solution is added dropwise at a rate of 4ml / min, and the addition is complete when the temperature is raised to 50°C , React at this temperature for 6 hours, and then disperse in an ultra-high pressure nano-homogenizer for 60 minutes and ultrasonic dispersion for 60 minutes to obtain a uniformly dispersed inorg...

Example Embodiment

[0058] Example 3

[0059] Under the protection of nitrogen, weigh 25g of 30nm nano aluminum nitride (product number: DK331, the same below) into 75g of solvent water, ultrasonic 20min at room temperature until the dispersion is uniform; then under the ultrasonic state, use 5% Adjust the pH value of ammonia water to 8, then add 12g of modifier polyacrylic acid (Mw=3000) aqueous solution (concentration of 50wt%) at a rate of 2ml / min. After the addition, continue ultrasonic for 15min until the dispersion is uniform; The temperature is raised to 60°C at a rate of 3°C / min. During this process, the remaining 6g of the above-mentioned modifier polyacrylic acid aqueous solution is added dropwise at a rate of 2ml / min. When the temperature is raised to 60°C, the dropwise addition is complete. After 3 hours of reaction, the ultra-high pressure nano-homogenizer disperses for 120 minutes, and the ultrasonic dispersion for 90 minutes, to obtain a uniformly dispersed inorganic heat-dissipating ...

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Abstract

The invention provides inorganic heat radiation nano-grade material aqueous slurry, a heat radiation material comprising the inorganic heat radiation nano-grade material aqueous slurry, and preparation methods and applications thereof. The inorganic heat radiation nano-grade material aqueous slurry comprises the components comprising, by weight, 10-25 parts of an inorganic heat radiation nano-grade material, 0.5-20 parts of a modifier solution, and 50-100 parts of a solvent. The heat radiation material comprises, by weight, 10-30 parts of the inorganic heat radiation nano-grade material aqueous slurry, 40-80 parts of aqueous high-molecular resin, 20-30 parts of latex, 10-40 parts of a film-forming auxiliary agent, 0.5-5 parts of an auxiliary agent, and 5-20 parts of a diluting agent. With the application of the inorganic heat radiation nano-grade material aqueous slurry, compatibility and system dispersion stability of the inorganic heat radiation nano-grade material and the high-molecular material are improved, such that the unique heat radiation material with excellent heat radiation performance and with the inorganic heat radiation nano-grade material aqueous slurry is obtained.

Description

technical field [0001] The present invention relates to a heat dissipation material, a structure, a manufacturing process and its application, in particular to a heat dissipation material, a structure, a manufacturing process and its application containing inorganic heat dissipation nanomaterial slurry. Background technique [0002] Thermally conductive materials include thermal pad, thermal grease (thermal grease), thermal tape (thermal tape), etc., which are designed to provide the best conditions for heat conduction, and are usually placed on heating components and heat sinks It is used to fill the gap between the two, and it is true that the heat is completely conducted from the heating component to the heat sink. It can be applied to various products, such as: notebook computer, desktop computer, motherboard, memory module DDR, motherboard, hard disk, LED module, PDP / LCD TV, etc. Nowadays, the functions of electronic devices are becoming more and more powerful, but the...

Claims

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Application Information

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IPC IPC(8): C08L29/04C08L33/02C08K7/24C08K3/04C08K3/28C08K3/08C08K3/22C09K5/14C08L33/00C08L25/14C09D133/00C09D125/14C09D7/12B32B33/00
Inventor 黄进瑞
Owner REGAL PAPER TECH
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