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Heat radiation material, heat radiation structure, and preparation method and application thereof

A technology of heat-dissipating materials and heat-dissipating structures, applied in heat-exchange materials, chemical instruments and methods, coatings, etc., can solve the problems affecting thermal conductivity and stability, poor compatibility between heat-dissipating fillers and polymer materials, and easy aggregation of nano-heat-dissipating materials and other problems, to achieve the effect of improving interface performance, excellent heat dissipation performance, and improving compatibility

Inactive Publication Date: 2013-07-17
REGAL PAPER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat dissipation fillers in heat dissipation coating materials on the market are mainly graphite, carbon nanotubes, etc.; however, the compatibility between the above heat dissipation fillers and polymer materials is poor, and nano heat dissipation materials are easy to aggregate, which seriously affects its heat conduction effect and stability

Method used

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  • Heat radiation material, heat radiation structure, and preparation method and application thereof
  • Heat radiation material, heat radiation structure, and preparation method and application thereof
  • Heat radiation material, heat radiation structure, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Under the protection of nitrogen, weigh 10g of 30-40nm hollow carbon nanospheres (HCNC) and place them in 50g of solvent water, ultrasonic wave at room temperature for 30min to disperse evenly; then under ultrasonic state, use 5% ammonia water to adjust the pH value To 8-10, then dropwise add 10g of modifying agent polyvinyl alcohol (Mw=2000) aqueous solution (concentration is 50wt%) at the speed of 3ml / min, continue ultrasonic wave 30min to disperse evenly after dropping; The heating rate of °C / min is raised to 60 °C. During this process, the remaining 5 g of the above modifier polyvinyl alcohol aqueous solution is added dropwise at a rate of 3 ml / min. When the temperature is raised to 60 °C, the dropwise addition is completed. React for 4 hours, then disperse for 60 minutes with an ultra-high pressure nano homogenizer, and disperse for 60 minutes with an ultrasonic wave to obtain a uniformly dispersed inorganic heat-dissipating nanomaterial water-based slurry.

Embodiment 2

[0057] Under the protection of nitrogen, weigh 10g of 10-30nm carbon nanotubes (product label: IMC4, the same below) and place them in 100g of solvent water, and use ultrasonic wave at room temperature for 30min to disperse evenly; then in the ultrasonic state, use 5% Adjust the pH value to 8-10 with ammonia water, then add 10g of modifying agent polyvinyl alcohol (Mw=2000) aqueous solution (concentration is 50wt%) dropwise at a speed of 4ml / min, continue ultrasonic wave for 30min to disperse Uniform; then raise the temperature to 50°C at a heating rate of 3°C / min, add the remaining 5g of the above modifier polyvinyl alcohol aqueous solution dropwise at a rate of 4ml / min during this process, and complete the dropwise addition when the temperature rises to 50°C , react at this temperature for 6 hours, then disperse for 60 minutes with an ultra-high pressure nano homogenizer, and disperse with an ultrasonic wave for 60 minutes to obtain a uniformly dispersed inorganic heat-dissip...

Embodiment 3

[0059] Under the protection of nitrogen, weigh 25g of 30nm nano-aluminum nitride (product label: DK331, the same below) and place it in 75g of solvent water, and use ultrasonic wave at room temperature for 20min to disperse evenly; then under ultrasonic state, use 5% Ammonia adjusts the pH value to 8, then drips 12g of modifying agent polyacrylic acid (Mw=3000) aqueous solution (concentration is 50wt%) with the speed of 2ml / min, continues ultrasonic wave 15min to disperse evenly after dropping; Raise the temperature to 60°C at a heating rate of 3°C / min. During this process, drop the remaining 6g of the above modifier polyacrylic acid aqueous solution at a rate of 2ml / min. When the temperature rises to 60°C, the dropwise addition is completed. React for 3 hours, then disperse for 120 minutes with an ultra-high pressure nano-homogenizer, and disperse for 90 minutes with an ultrasonic wave to obtain a uniformly dispersed inorganic heat-dissipating nanomaterial water-based slurry. ...

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Abstract

The invention provides inorganic heat radiation nano-grade material aqueous slurry, a heat radiation material comprising the inorganic heat radiation nano-grade material aqueous slurry, and preparation methods and applications thereof. The inorganic heat radiation nano-grade material aqueous slurry comprises the components comprising, by weight, 10-25 parts of an inorganic heat radiation nano-grade material, 0.5-20 parts of a modifier solution, and 50-100 parts of a solvent. The heat radiation material comprises, by weight, 10-30 parts of the inorganic heat radiation nano-grade material aqueous slurry, 40-80 parts of aqueous high-molecular resin, 20-30 parts of latex, 10-40 parts of a film-forming auxiliary agent, 0.5-5 parts of an auxiliary agent, and 5-20 parts of a diluting agent. With the application of the inorganic heat radiation nano-grade material aqueous slurry, compatibility and system dispersion stability of the inorganic heat radiation nano-grade material and the high-molecular material are improved, such that the unique heat radiation material with excellent heat radiation performance and with the inorganic heat radiation nano-grade material aqueous slurry is obtained.

Description

technical field [0001] The present invention relates to a heat dissipation material, a structure, a manufacturing process and its application, in particular to a heat dissipation material, a structure, a manufacturing process and its application containing inorganic heat dissipation nanomaterial slurry. Background technique [0002] Thermally conductive materials include thermal pad, thermal grease (thermal grease), thermal tape (thermal tape), etc., which are designed to provide the best conditions for heat conduction, and are usually placed on heating components and heat sinks It is used to fill the gap between the two, and it is true that the heat is completely conducted from the heating component to the heat sink. It can be applied to various products, such as: notebook computer, desktop computer, motherboard, memory module DDR, motherboard, hard disk, LED module, PDP / LCD TV, etc. Nowadays, the functions of electronic devices are becoming more and more powerful, but the...

Claims

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Application Information

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IPC IPC(8): C08L29/04C08L33/02C08K7/24C08K3/04C08K3/28C08K3/08C08K3/22C09K5/14C08L33/00C08L25/14C09D133/00C09D125/14C09D7/12B32B33/00
Inventor 黄进瑞
Owner REGAL PAPER TECH
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