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Laser direct structuring materials with all color capability

A laser-activated, oxide-based technology, applied in the field of thermoplastic compositions for the manufacture of these compositions and articles containing them, laser direct structuring method, capable of solving limitations of LDS technology, reprogramming, LDS additives preventing coloration of compositions And other issues

Active Publication Date: 2013-08-14
SHPP GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the circuit design is changed, it is only a matter of reprogramming the computer that controls the laser
[0005] Additionally, the use of prior art LDS additives which are substantially dark in color prevents the ability to tint the composition as desired
Additives currently used in LDS materials are usually spinel-based metal oxides (such as copper chromium oxide), organometallic complexes such as palladium / palladium-containing heavy metal complexes or copper complexes, and there are some limitations based on these additives
The spinel-based metal oxides used can only provide black color, which limits the application of LDS technology in many fields, such as canopy antennas, which usually require that the materials used should be colorable and colorful
Additionally, for organometallic complexes, relatively high loading is required to obtain sufficiently dense nucleation formation for rapid metallization when activated by laser radiation, which adversely affects the mechanical properties of the material

Method used

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  • Laser direct structuring materials with all color capability
  • Laser direct structuring materials with all color capability
  • Laser direct structuring materials with all color capability

Examples

Experimental program
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Effect test

Embodiment

[0099] In these examples, the effect of the LDS additive on the color of the polymer composition was examined. In these examples, the polymeric base resin was a polycarbonate / acrylonitrile-butadiene-styrene resin blend (available from SABIC Innovative Plastics), and the metal oxide-coated filler was antimony-doped tin oxide (available from Merck Chemicals (shanghai) Co., Ltd.). Different amounts of antimony-doped tin oxide (from 0.5 to 10 wt %) were used. The comparative example shows the implementation of the use of standard LDS additives with copper chromium oxide spinel (commercially available from Ferro Taiwan). 3.46 wt% of additional additives including mica (available from Hayashi Kasei Co. Ltd.), hindered phenol anti-oxidant, phosphite stabilizers and metal passivators were used in all examples. oxidizing agents (all three available from Ciba Specialty Chemicals (China) Ltd.) and Aclyn 295 ethylene-acrylic acid zinc ionomer (available from Honeywell). The effect of t...

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PUM

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Abstract

Thermoplastic compositions that are capable of being used in a laser direct structuring process to provide enhanced plating performance and good mechanical properties. The compositions include a thermoplastic base resin, a laser direct structuring additive, and a mineral filler. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.

Description

technical field [0001] The present invention relates to thermoplastic compositions, and more particularly to thermoplastic compositions that can be used in laser direct structuring processes. The invention also relates to methods of making these compositions and articles comprising these compositions. Background technique [0002] Electrical components can be supplied as injection molding devices (molded injection devices) (MID) with the required printed conductors, i.e. when manufactured in MID technology different methods are used, e.g. masking methods, double-pack Sub-injection molding (injection molding, injection molding, injection molding) is followed by electroplating (or electroless plating (electroless plating, electroless plating)), because for some cases electroless plating is used for two-component injection molding. In contrast to conventional circuit boards made of glass-fiber-reinforced plastic, etc., MID elements manufactured in this way are three-dimensiona...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M5/26C08K9/02H05K3/18C08L69/00C08K3/22C08L55/02
CPCC08L69/00C08K3/2279H05K3/185C08K5/0041C08L55/02C08K9/02H05K2203/107H05K1/0284Y10T428/31507B41M5/26C08K3/34C08L77/00H05K3/18
Inventor 纪强姜思光孟季茹邹湘坪吴彤
Owner SHPP GLOBAL TECH BV
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