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A parallel optical transceiver component for broadband high-speed transmission

An optical transceiver component and high-speed transmission technology, applied in the field of communication, can solve the problems of complex packaging structure, difficult processing, long process time, etc., and achieve the effect of reducing processing cost, reducing mounting accuracy and high coupling efficiency

Active Publication Date: 2015-08-12
INNOLIGHT TECH (TONGLING) LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This packaging structure is complicated, the processing is difficult, the process time is long, and the cost is high

Method used

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  • A parallel optical transceiver component for broadband high-speed transmission
  • A parallel optical transceiver component for broadband high-speed transmission

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Embodiment Construction

[0017] Such as figure 1 As shown, a parallel optical transceiver assembly for broadband high-speed transmission, including a first printed circuit board 1, a second printed circuit board 2, and a flexible board 3 connecting the first printed circuit board 1 and the second printed circuit board 2 , TIA transimpedance amplifier 4, laser driver chip 5, PD photodetector array 6, VCSEL vertical cavity emitting laser array 7, optical fiber array 8, optical fiber fixing assembly 9 and spacer 10, one end of the first printed circuit board 1 forms a gold-plated The signal input port of the plug-in board structure, the surface of the second printed circuit board 2 is provided with a TIA transimpedance amplifier 4 and a laser driver chip 5 through a flipchip flip-chip process, and a PD photodetector array 6 and a VCSEL are packaged through gold wire bonding The vertical cavity emitting laser array 7; the front end of the fiber array 8 is placed in the fiber fixing component 9, and the fi...

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Abstract

The invention relates to a parallel optical transceiver module used for broadband high-speed transmission. A signal input port of a gold-plated plugboard structure is formed at one end of a first printed circuit board, and a trans-impedance amplifier (TIA), a laser driving chip, a photoelectric detector (PD) array, a vertical cavity surface emitting laser (VCSEL) array and a spacer are arranged on the surface of a second printed circuit board. The front end of a fiber array is arranged in a fiber fixing component, and the fiber array is aligned to the PD array and the VCSEL array in a coupled mode. The fiber fixing component comprises a fiber orientation conversion piece bottom board, a covering board and fastening bolts, a V-shaped groove is carved in the surface of the fiber orientation conversion piece bottom board, bare fibers of the fiber array are placed in the V-shaped groove, the covering board covers the V-shaped groove, and holes matched with the fastening bolts are formed in the fiber orientation conversion piece bottom board, the spacer and the second printed circuit board. The parallel optical transceiver module used for broadband high-speed transmission achieves optical packaging with high coupling efficiency, and reduces stick-mounting accuracy of the photoelectric component arrays and technological difficulty of connection of the photoelectric components and the fibers.

Description

technical field [0001] The invention relates to a parallel optical transceiver assembly for broadband high-speed transmission, belonging to the technical field of communication. Background technique [0002] With the improvement of human requirements for high-speed signal transmission, parallel optical transceiver components have emerged. The parallel optical module is to realize the mutual conversion of multiple electrical signals and optical signals in a single structure, so as to realize the function of sending and receiving. Due to the high bandwidth density and low power consumption brought about by device integration and miniaturization, the transmission bandwidth and power consumption of the parallel optical module are much better than multiple discrete devices, thereby improving the transmission performance of the system. [0003] However, the existence of multiple discrete components makes the assembly error allowed for parallel optical module packaging smaller, re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/43G02B6/42
Inventor 李伟龙贾凌慧孙雨舟王祥忠刘圣
Owner INNOLIGHT TECH (TONGLING) LTD
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