Light-emitting diode (LED) lamp heat dispersing material and preparation method thereof as well as radiator and LED lamp

A technology of LED lamps and heat dissipation materials, applied in lighting and heating equipment, cooling/heating devices of lighting devices, lighting devices, etc., can solve problems such as difficulty in meeting flatness requirements, easy to produce deformation, etc., and achieve good heat dissipation effect. Easy to deform, high heat radiation effect

Inactive Publication Date: 2013-08-28
林浩青 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Aluminum profile products can easily meet the above requirements, but there are the aforementioned defects; and ceramic products made by traditional technology, becaus

Method used

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  • Light-emitting diode (LED) lamp heat dispersing material and preparation method thereof as well as radiator and LED lamp
  • Light-emitting diode (LED) lamp heat dispersing material and preparation method thereof as well as radiator and LED lamp
  • Light-emitting diode (LED) lamp heat dispersing material and preparation method thereof as well as radiator and LED lamp

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preparation example Construction

[0105] Accordingly, see figure 1 , the present invention provides a first embodiment of a method for preparing heat dissipation materials for LED lamps. The preparation method mainly adopts an extrusion molding method, which sequentially includes the following steps:

[0106] S101, batching main raw materials required for preparing heat dissipation materials for LED lamps.

[0107] Wherein, the formula of the main raw material in percent by volume is as follows:

[0108] Epoxy resin 15-27%

[0109] Ceramic powder filler 73-85%;

[0110] Described epoxy resin selects the epoxy resin of epoxy value 0.38-0.54mol / 100g for use;

[0111] The ceramic powder filler is selected from one or more of mullite-corundum, mullite, and silica glass phases, and the mullite-corundum, mullite, and silica glass phases are ceramic fired The waste is obtained through pretreatment.

[0112] Preferably, in the preparation of the heat dissipation material for LED lamps by extrusion molding, the fo...

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Abstract

The invention discloses a light-emitting diode (LED) lamp heat dispersing material which comprises the following materials in percentage by volume: 15%-27% of epoxy resin and 73%-85% of ceramic powder filler, wherein the epoxy resin has the epoxide number of 0.38-0.54 mol/100g; and the ceramic powder filler is one or more in mullite-corundum, mullite and silica glass phase, which are obtained by carrying out pretreatment on ceramic sintering wastes. Correspondingly, the invention also discloses a preparation method of the LED lamp heat dispersing material, a radiator made from the LED lamp heat dispersing material, and an LED lamp. The environment-friendly heat dispersing material made from the ceramic wastes is good in heat dissipation effect, low in cost of raw materials, light in weight, high in safety guarantee and beneficial to reduction, resource utilization and harmless disposal of the ceramic wastes, thus promoting the sustainable development of ceramic industry.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to a heat dissipation material for LED lamps, a method for preparing the heat dissipation material for LED lamps, and a heat sink and LED lamp made of the heat dissipation material. Background technique [0002] As a lighting source, LED (light-emitting diode) has the advantages of energy saving, environmental protection, long service life, small size, good directionality, fast response, rich colors, and low driving voltage. The fourth generation of lighting sources. During the working period of LED, only about 20-35% of the input electric energy is converted into light energy, and the rest is converted into heat. The heat flux density per unit area of ​​the LED chip can reach 100W / cm2. If the heat dissipation of the chip is not good, it will cause heat accumulation inside the chip and a sudden increase in the junction temperature, resulting in changes in the performance o...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K3/00F21V29/00F21V29/87
Inventor 林浩青谢海鸿
Owner 林浩青
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