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High-thermal-conductivity thermosetting resin and preparation method thereof

A thermosetting, high thermal conductivity technology, applied in the chemical industry, can solve the problems of sacrificing thermosetting resin molding manufacturability, limiting applications, etc., to achieve the effect of reducing effective paths, good optical properties, and reducing filling volume

Inactive Publication Date: 2013-09-11
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this often sacrifices the molding processability of thermosetting resins, thus limiting its application in thermally conductive coatings, thermally conductive adhesives, etc.

Method used

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  • High-thermal-conductivity thermosetting resin and preparation method thereof
  • High-thermal-conductivity thermosetting resin and preparation method thereof
  • High-thermal-conductivity thermosetting resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. Preparation of Epoxy Resin Powder

[0028] 1) Mix 100g of epoxy resin (E-51) and 23.4g of diethyltoluenediamine curing agent evenly, and cure at 120°C for 2.5h+180°C for 1h to obtain a cured epoxy resin;

[0029] 2) Put the epoxy resin cured product obtained in step 1) into the crushing equipment and pulverize it into epoxy resin powder with an average particle size of 70um.

[0030] 2. Preparation of amino group-containing aluminum nitride

[0031] Add 10g of aluminum nitride with an average particle size of 5um, 100mL of acetone and 0.1g of 3-aminopropyltrimethoxysilane into the reaction vessel, stir and ultrasonically vibrate for 50 minutes at 50°C, filter, wash and dry After drying, aluminum nitride containing amino groups is obtained.

[0032] 3. Preparation of high thermal conductivity epoxy resin

[0033] After mixing 81g of epoxy resin, 19g of diethyltoluenediamine curing agent, 10g of the epoxy resin powder prepared in Example 1 and 20g of the amino group...

Embodiment 2

[0036] 1. Preparation of Epoxy Resin Powder

[0037] 1) Mix 100g of epoxy resin (E-51) and 23.4g of diethyltoluenediamine curing agent evenly, and cure at 120°C for 2.5h+180°C for 1h to obtain a cured epoxy resin;

[0038] 2) Put the epoxy resin cured product obtained in step 1) into the crushing equipment and pulverize it into epoxy resin powder with an average particle size of 70um.

[0039] 2. Preparation of amino group-containing aluminum nitride

[0040] Add 10g of aluminum nitride with an average particle size of 5um, 100mL of acetone and 0.1g of 3-aminopropyltrimethoxysilane into the reaction vessel, stir and ultrasonically vibrate for 50 minutes at 50°C, filter, wash and dry After drying, aluminum nitride containing amino groups is obtained.

[0041] 3. Preparation of high thermal conductivity epoxy resin

[0042] After mixing 81g of epoxy resin, 19g of diethyltoluenediamine curing agent, 20g of the epoxy resin powder prepared in Example 1 and 20g of the amino group-c...

Embodiment 3

[0045] 1. Preparation of Polyurethane Powder

[0046] 1) Mix 100g polyether polyol and 100g diisocyanate evenly, and cure at room temperature for 15 minutes to obtain a polyurethane cured product;

[0047] 2) The polyurethane cured product obtained in step 1) is put into a ball milling equipment and ball milled into a polyurethane powder with an average particle size of 1000um.

[0048] 2. Preparation of Amino Alumina

[0049] Add 10g of alumina with an average particle size of 200um, 120mL of ethanol and 0.1g of 3-aminopropyltriethylmethoxysilane into the reaction vessel, stir and ultrasonically vibrate for 5 minutes at 80°C, filter, wash, After drying, amino group-containing alumina is obtained.

[0050] 3. Preparation of High Thermal Conductivity Polyurethane Resin

[0051] After uniformly mixing 50 g of polyether polyol, 50 g of diisocyanate, 1 g of the polyurethane resin powder prepared in Example 1 and 5 g of amino group-containing alumina prepared in Example 1, a pol...

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Abstract

The invention relates to high-thermal-conductivity thermosetting resin and a preparation method thereof. The high-thermal-conductivity thermosetting resin is obtained though uniformly mixing 100 parts of thermosetting resin, 1-100 parts of thermosetting resin powder and 5-200 parts of surface-modified thermal conductive fillers by weight. According to the high-thermal-conductivity thermosetting resin, the filling quantity required by high thermal conductivity of the thermosetting resin can be greatly reduced, further the thermal conductivity property of the thermosetting resin can be improve obviously on the basis of keeping / improving the mechanical property, the processing property and the optical property of the thermosetting resin, and the high-thermal-conductivity thermosetting resin can be widely applied to the fields of heat conductive plastics, heat conductive rubber, heat conductive bonding agents, heat conductive coatings and the like.

Description

technical field [0001] The invention relates to a thermosetting resin with high thermal conductivity and a preparation method thereof, in particular to a method for preparing a thermosetting resin with high thermal conductivity by filling original micro-nano powder, which belongs to the technical field of chemical industry. Background technique [0002] Thermosetting resin is a kind of high molecular polymer with cross-linked network structure. With good mechanical, electrical and bonding properties, they are often widely used in the fields of machinery, chemical industry, electronics and aerospace in the form of adhesives, coatings, sealants, packaging materials and resin matrices for composite materials. Representative ones are epoxy resins, silicone resins, phenolic resins, unsaturated polyesters, and polyurethanes. [0003] In recent years, the rapid development of modern industry has made some special industrial fields, such as aerospace, electronics and electrical fie...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L61/06C08L83/06C08L67/06C08L75/08C08L79/04C08L79/08C08K9/06C08K9/02C08K9/04
Inventor 吴立新卓东贤马林翁子骧
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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