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High-temperature-resistant pressure-sensitive adhesive-film for COF and preparation method thereof

A pressure-sensitive adhesive film, high temperature resistant technology, applied in the direction of adhesives, film/sheet adhesives, adhesive types, etc. problems, to achieve the effect of small cost and reduced requirements

Inactive Publication Date: 2013-09-11
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The Chinese patent documents CN1519488 and CN1667268 of Nippon Denko disclose transparent double-sided adhesive tapes respectively, and specifically record a composition containing butyral resin and C1-18 alkyl propionate as a weak adhesive layer composition, described in the literature, The pressure-sensitive adhesive composition can use well-known materials such as polyurethane resin, silicone resin and natural synthetic rubber to prepare pressure-sensitive adhesive tapes, etc., and has high temperature resistance, but the temperature is not specifically limited, especially without considering chip packaging, element The use and application range of high temperature resistant adhesive film required for the installation of devices and micro devices at temperatures above 260°C and high temperature reflow devices

Method used

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  • High-temperature-resistant pressure-sensitive adhesive-film for COF and preparation method thereof
  • High-temperature-resistant pressure-sensitive adhesive-film for COF and preparation method thereof
  • High-temperature-resistant pressure-sensitive adhesive-film for COF and preparation method thereof

Examples

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Effect test

example 1

[0054] In a 1000 ml three-neck flask equipped with a thermometer reflux condenser and a stirrer, the monomers of 80 parts by weight of cyclohexyl methacrylate and 20 parts by weight of methacrylic acid are charged, and then 0.1 parts by weight of azo Diisobutyronitrile, dissolved in 150 parts of solvent ethyl acetate and stirred to dissolve, heated to reflux of ethyl acetate, reacted at reflux temperature for 6-8 hours, cooled to room temperature, added 8.8 parts of acrylate epoxy resin and 0.1 Parts by weight of diisooctyl cyclohexanedicarboxylate and the remaining 80 parts of ethyl acetate solution are mixed and copolymerized with 20 parts by weight of thermoplastic polyimide resin to obtain thermoplastic polyimide, acrylic Composition of copolymers of polymers. Apply it to a yellow silicone-treated release liner. After drying, the thickness of the adhesive film is 30 μm, and the heat-resistant pressure-sensitive adhesive film is obtained by pressing on the anti-adhesive re...

example 2

[0066] In 1000 milliliters of there-necked flasks equipped with a thermometer reflux condenser and agitator, the monomers of 80 parts by weight of cyclohexyl methacrylate and 18 parts by weight of methacrylic acid are charged, and then 0.1 parts by weight of azobisisobutyronitrile, Dissolve in 150 parts of solvent ethyl acetate and stir to dissolve, heat up to reflux of ethyl acetate, react at reflux temperature for 7-8 hours, cool to room temperature, add 8.3 parts of acrylate epoxy resin and 0.1 parts by weight of cyclohexane Diisooctyl diformate and the remaining 80 parts of ethyl acetate solution are formulated into glue, and mixed with 10 parts by weight of thermoplastic polyimide resin to obtain a copolymer containing thermoplastic polyimide and acrylic polymer. Composition. Coated on yellow silicone-treated release paper, dried to obtain a film thickness of 30 μm, and pressed on release paper coated with silicone on both sides to obtain a heat-resistant pressure-sensiti...

example 3

[0078] In 1000 milliliters of there-necked flasks equipped with a thermometer reflux condenser and agitator, the monomers of 80 parts by weight of cyclohexyl methacrylate and 15 parts by weight of methacrylic acid are charged, then 0.1 part by weight of azobisisobutyronitrile is added, Dissolve in 150 parts of solvent ethyl acetate and stir to dissolve, heat up to ethyl acetate reflux, react at reflux temperature for 7.5 hours, cool to room temperature, add 8.5 parts of acrylate epoxy resin and 0.1 parts by weight of cyclohexane dicarboxylic acid Diisooctyl ester and the remaining 80 parts of ethyl acetate solution are prepared into a glue solution, mixed and copolymerized with thermoplastic polyimide resin in a weight ratio of 15 parts, to obtain a composition containing a copolymer of thermoplastic polyimide and acrylic polymer . Coat it on a yellow silicone-treated release paper, dry it to obtain an adhesive film with a thickness of 30 μm, and press it on a release paper co...

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Abstract

Provided is a high-temperature-resistance pressure-sensitive adhesive-film for COF, and the high-temperature-resistance pressure-sensitive adhesive-film is formed by a glue solution containing a copolymer of thermoplastic polyimide and an acrylic polymer. Further provided is a preparation method of the high-temperature-resistance pressure-sensitive adhesive-film for COF, and the method comprises the following steps of: preparing the glue solution containing a copolymer of thermoplastic polyimide and an acrylic polymer, and forming the pressure-sensitive adhesive-film by employing the glue solution. The high-temperature-resistance pressure-sensitive adhesive-film has characteristics of high binding property, adaptability, cohesion property and heat resistance property.

Description

technical field [0001] The invention relates to a high-temperature-resistant pressure-sensitive adhesive film for COF (Chip On Flex or Chip On Film, ie, chip-on-chip film) and a preparation method thereof. Background technique [0002] As information electronic products become thinner and smaller, COF, which has the advantages of light weight, ultra-thin, and flexible packaging chips, has a large degree of freedom in flexible shapes, and has been widely used in various computers, monitors, digital cameras, smart phones and many consumer devices. Electronic chip packaging and components, micro-device mounting applications. [0003] The pressure-sensitive adhesive film usually uses a resin film made of polyester PET, polyethylene, etc., and at room temperature, the adhesive is coated to prepare a pressure-sensitive adhesive tape, which has many uses, including cigarette paper, daily necessities and industrial temporary Fixed adhesive use, etc. [0004] Japanese patents 20040...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/04C09J179/08C09J133/10C08F220/18C08F220/06
Inventor 刘萍
Owner SHENZHEN DANBOND TECH
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