Novel LED lamp

Abstract

The invention provides a novel LED lamp which comprises an LED lamp heat-dissipating aluminum cup (8), a lamp disc (5) and a lamp shade (1). The novel LED lamp is characterized by further comprising a pressing ring (3) arranged on the lamp disc (5), and a plastic isolating ring (7) arranged between the heat-dissipating aluminum cup (8) and the lamp disc (5). A round hole matched with the plastic isolating ring (7) is formed in the center of the heat-dissipating aluminum cup (8) so that the plastic isolating ring (7) can be buckled to the heat-dissipating aluminum cup (8) conveniently. The pressing ring (3), the lamp disc (5) and the heat-dissipating aluminum cup (8) are connected and fixed through screws (2). The edge of the pressing ring (3) is provided with threads corresponding to the screws (2). The inner edge of the heat-dissipating aluminum cup (8) is provided with small symmetrically-arranged holes. Threads corresponding to screws (6) are arranged inside the small holes. The heat-dissipating aluminum cup (8) and the lamp disc (5) are connected through heat-conducting glue (13).

Description

technical field [0001] The invention relates to a new type of LED lamp, in particular to a new type of heat-conducting adhesive for the LED lamp, its preparation method and its application. Background technique [0002] At present, with the development of microelectronics technology and assembly technology, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly. relationship, the contact interface between the heating device and the heat sink in electronic products often cannot achieve the theoretical "zero gap" contact, and the contact surface is as follows: figure 1 As shown, part of the interface between the heat generating device 12 (such as LED and lamp chip, etc.) and the heat sink 13 (such as aluminum alloy profile, back plate, etc.) is not in contact, and heat exchange can only be performed through the air layer A. [0003] The heat cannot be transmitted evenly through the entire contact sur...

AI Technical Summary

Problems solved by technology

A thermally conductive adhesive with excellent performance must not only ensure the adhesion between the heating device and the heat sink, but also have good thermal conductivity (heat dissipation). During the process, the inventor found at least the following problems in the prior art: for example, the thermally conductive adhesive disclosed in patent applications CN97181574.7, CN201010163571.9, CN91103592.3, CN200480010246.1, CN200780028241.5, and a kind of High thermal conductivity composite material, which uses thermal conductive particles added to the polymer (solution) that has been polymerized. Due to the small diameter of the thermal conductive particles and the high viscosity of the polymer, it is difficult to disperse evenly during the mixing process, which will cause adhesion during use. The heat distribution on the surface is uneven, the thermal conductivity deteriorates, and thermal stress is easily generated during the impact of cold and heat cycles, resulting in deterioration or even failure of the film performance

[0005] Patent application CN200510034477.2 discloses a thermal interface material, and CN200680045876.1 discloses a carbon nanotube composite, which is prepared by mixing a carbon nanotube-metal composite with silica gel. Nanomaterials with a high ratio are prone to the "cluster" phenomenon that often occurs in nanomaterials, and it is difficult to disperse into a uniform thermally conductive continuous phase in polymers

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