A metal-based conductive circuit board and its manufacturing method

A conductive circuit and metal-based technology, which is applied in printed circuit manufacturing, printed circuit, circuit substrate materials, etc., can solve the problems of poor heat dissipation of metal-based conductive circuit boards, and achieve good heat resistance and corrosion resistance, heat dissipation Excellent performance and strong combination

Inactive Publication Date: 2016-08-17
上舜电子科技(中国)有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the traditional metal-based conductive circuit board has poor heat dissipation capability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A metal-based conductive circuit board and its manufacturing method
  • A metal-based conductive circuit board and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 and figure 2 As shown, a metal-based conductive circuit board includes a bottom layer 1, an insulating layer 2 and a conductive layer 3, and the material of the bottom layer 1 is metal; an insulating layer 2 is arranged on the bottom layer 1, and the insulating layer 2 The material is silicon oxide; a conductive layer 3 is provided on the insulating layer 2 .

[0027] The metal-based conductive circuit board in this embodiment is manufactured by the following method:

[0028] Firstly, take the aluminum bottom layer 1 and polish it, then use a surfactant solution and water to clean the surface of the bottom layer 1 respectively, remove stains, dust, etc. on the surface of the bottom layer 1, and make the bottom layer 1 smooth and flat.

[0029] Next, silicon oxide particles with an average particle size of 250 μm are used to form a silicon oxide film on the bottom layer 1 by vacuum evaporation, and then sintered at 1200° C. for 1 hour to vitrify the ...

Embodiment 2

[0035] Such as figure 1 and figure 2 As shown, a metal-based conductive circuit board includes a bottom layer 1, an insulating layer 2 and a conductive layer 3, and the material of the bottom layer 1 is metal; an insulating layer 2 is arranged on the bottom layer 1, and the insulating layer 2 The material is silicon oxide; a conductive layer 3 is provided on the insulating layer 2 .

[0036] The metal-based conductive circuit board in this embodiment is manufactured by the following method:

[0037] Firstly, take the aluminum bottom layer 1 and polish it, then use a surfactant solution and water to clean the surface of the bottom layer 1 respectively, remove stains, dust, etc. on the surface of the bottom layer 1, and make the bottom layer 1 smooth and flat.

[0038] Next, a silicon oxide film is formed on the bottom layer 1 by vacuum spraying, and then sintered to obtain an aluminum plate 1 with a silicon oxide insulating layer 2 .

[0039] Next, the conductive layer 3 i...

Embodiment 3

[0044] Manufacturing steps of a metal-based conductive circuit board:

[0045] Firstly, take the aluminum bottom layer 1 and polish it, then use a surfactant solution and water to clean the surface of the bottom layer 1 respectively, remove stains, dust, etc. on the surface of the bottom layer 1, and make the bottom layer smooth and flat.

[0046] Next, take a sodium silicate solution (concentration is 0.25mol / L), adjust the pH to 4-8 with acid, and stir to obtain a sol; put the bottom layer 1 obtained above in the sol, and pull it out after immersing for 6 hours. Drying; heat treatment at 500°C for 4 hours.

[0047] Next, the conductive circuit layer 3 is directly fabricated on the aluminum plate 1 with the silicon oxide insulating layer by means of sputtering or vapor deposition. In this embodiment, silver is used as the material of the conductive layer 3 .

[0048] Finally, it is enough to form the solder resist layer 4 on the conductive layer 3, and white oil is selected...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a printed circuit board, in particular to a metal-based conductive circuit board used in high-power electronic devices, and belongs to the technical field of electronic circuits. The printed circuit board includes a bottom layer, an insulating layer and a conductive layer. The material of the bottom layer is metal; an insulating layer is arranged on the bottom layer, and the material of the insulating layer is silicon oxide; a conductive layer is arranged on the insulating layer. In the metal-based conductive circuit board provided by the invention, the silicon oxide insulating layer has good heat resistance and corrosion resistance, is dense and uniform, and is firmly combined with the substrate, which can effectively overcome the differences between the circuit layer, the insulating heat-conducting layer and the metal base layer. The expansion coefficient causes problems such as low mechanical strength and difficult processing. The thermal conductivity of the silicon oxide insulating layer is higher than that of ordinary fibers and resins, and the texture of the film is dense and uniform, so that the heat dissipation performance of the metal-based conductive circuit board is better.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a metal-based conductive circuit board used in high-power electronic devices, and belongs to the technical field of electronic circuits. Background technique [0002] Heat dissipation has undoubtedly become one of the biggest challenges facing electronic designers. On the one hand, with the continuous development of PCB towards high-density, high-precision, and small multi-layer SMT, the installation space of components is greatly reduced; on the other hand, the power requirements for power components are getting higher and higher. High power in a small space will inevitably generate more heat accumulation, resulting in degradation or even damage to the electrical performance of components. The earlier solution was to dissipate heat using cooling hardware or ceramic functional blocks. The former itself requires a lot of space, while the latter is more due to poor thermal matching (the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/05H05K1/02H05K3/00
Inventor 王劲黄精文
Owner 上舜电子科技(中国)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap