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Resin composition, and printed wiring board, laminated sheet, and prepreg using same

A resin composition, resin technology, applied in the field of prepreg, laminate and printed wiring board, can solve problems such as reduction

Inactive Publication Date: 2013-09-25
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the moisture resistance and adhesiveness of the modified imide resin composition are improved (for example, refer to Patent Document 2). The low-molecular compound of the oxygen group is modified, so the heat resistance of the modified imide resin obtained is significantly lower than that of the polybismaleimide resin.

Method used

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  • Resin composition, and printed wiring board, laminated sheet, and prepreg using same
  • Resin composition, and printed wiring board, laminated sheet, and prepreg using same
  • Resin composition, and printed wiring board, laminated sheet, and prepreg using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～18、 comparative example 1～3

[0111] Using components (a) to (d) shown below, (e) curing accelerator, (f) inorganic filler, and methyl ethyl ketone as a diluting solvent, follow the compounding ratio shown in Table 1 to Table 5 (parts by mass) were mixed to obtain a uniform varnish having a resin component of 65% by mass.

[0112] Next, the above-mentioned varnish was dip-coated on an E-glass cloth with a thickness of 0.1 mm, and heated and dried at 160° C. for 10 minutes to obtain a prepreg having a resin content of 50% by mass.

[0113] Four of these prepregs were stacked, and 18 μm electrolytic copper foils were arranged above and below the prepregs, and pressed at a pressure of 2.5 MPa and a temperature of 230° C. for 90 minutes to obtain a copper-clad laminate.

[0114] Tables 1 to 5 show the measurement and evaluation results of the obtained copper-clad laminates.

[0115] (a) Maleimide compound

[0116] Bis(4-maleimidephenyl)methane

[0117] 3,3-Dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimi...

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Abstract

A resin composition containing: (a) a maleimide compound having at least two N-substituted maleimide groups in each molecular structure, and (b) a silicone compound having at least one reactive organic group in each molecular structure; and a printed wiring board, a laminated sheet, and a prepreg using the resin composition. A resin composition exhibiting excellent heat resistance and low thermal expansion, and a printed wiring board, a laminated sheet, and a prepreg using the resin composition can be provided.

Description

technical field [0001] The present invention relates to a resin composition having insulating properties, heat resistance, etc., and particularly excellent low thermal expansion, which is used for electronic parts and the like, and a prepreg, a laminate, and a printed wiring board using the resin composition. Background technique [0002] In recent years, with the popularity of miniaturization and high performance of electronic equipment, the wiring density and high integration of printed wiring boards have intensified. The resulting reliability requirements are strengthened. In such applications, both excellent heat resistance and low thermal expansion coefficient are required. [0003] As a laminated board for printed wiring boards, generally, a resin composition containing an epoxy resin as a main ingredient and a glass woven fabric are solidified and integrally molded. In general, epoxy resins have an excellent balance of insulation, heat resistance, and cost. When th...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08G59/40C08J5/24C08K3/00C08K5/18C08K5/3415C08K5/3445C08L63/00C08L79/04H05K1/03
CPCB32B15/04C08L63/00C08L79/04C08L79/085H05K1/0366B32B15/08B32B15/092H05K1/0353B32B27/08B32B27/28B32B33/00C08G59/40H05K1/0313H05K2201/068H05K2201/0162H05K2201/0154C08L2201/08C08L2201/02C08L2205/02C08L2205/03C08L2203/20C08J2463/00C08J2479/04C08J2479/08C08J2363/00C08J2383/04C08J2379/04C08J2379/08B32B2457/08B32B2255/26B32B2307/546B32B2307/306C08J5/244C08J5/249C08L83/08C08K3/36C08K5/3445C08L83/06C08K5/3415C08K13/02C08K5/5419C08L83/04C08K3/013C08J5/24H05K1/0373C08K5/18
Inventor 宫武正人小竹智彦长井骏介桥本慎太郎井上康雄高根泽伸村井曜
Owner HITACHI CHEM CO LTD
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