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Low-melting-point metal thermal-conducting paste as well as preparation method and application thereof

A low-melting-point metal, thermally conductive paste technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve problems such as oxidation failure of low-melting-point metal thermal conductive paste, and achieve the effect of preventing oxidation failure

Active Publication Date: 2013-11-20
BEIJING EMIKON TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a low-melting-point metal heat-conducting paste, which uses low-melting-point metals as the main body of heat-conducting functions, and uses antioxidants to improve the overall oxidation resistance, and adds sodium gallate to improve its adhesion, which can ensure heat conduction. Solve the problem of oxidation failure of conventional low-melting-point metal thermal paste while having excellent spreading properties

Method used

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  • Low-melting-point metal thermal-conducting paste as well as preparation method and application thereof

Examples

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Effect test

Embodiment 1

[0024] Embodiment 1 A kind of low-melting point metal heat conduction paste, consists of the following components by weight:

[0025] The mass fraction of gallium indium tin alloy (the mass fraction of each component is Ga: 66%, In: 20.5%, Sn: 13.5%) is 94.9%, the mass fraction of sodium sulfide is 0.1%, and the mass fraction of sodium gallate is 5%. .

[0026] Among them, gallium indium tin alloy can maintain a liquid state at a temperature of 10°C and above.

[0027] The method for preparing the low-melting-point metal thermal paste described in this embodiment comprises the following steps:

[0028] (1) Gallium indium tin alloy is melted by hot melting method, and its mass fraction in thermal paste is 94.9%;

[0029] (2) Add sodium sulfide with a mass fraction of 0.1% and sodium gallate powder with a mass fraction of 5% to the molten low melting point metal;

[0030] (3) Stir the mixture in step (2) in an air-isolated environment with a rotation speed of 480 rpm and a st...

Embodiment 2

[0031] Embodiment 2 A kind of low-melting-point metal heat conduction paste, consists of the following components by weight:

[0032] The mass fraction of gallium indium tin zinc alloy (the mass fraction of each component is Ga: 61%, In: 24%, Sn: 13%, Zn: 2%) is 94.9%, and the mass fraction of ferrous chloride is 5% , the mass fraction of sodium gallate is 0.1%.

[0033] Among them, the gallium indium tin zinc alloy can maintain a liquid state at a temperature of 10°C and above.

[0034] The method for preparing the low-melting-point metal thermal paste described in this embodiment comprises the following steps:

[0035] (1) Gallium indium tin zinc alloy is melted by hot melting method, and its mass fraction in thermal paste is 94.9%;

[0036] (2) Add ferrous chloride with a mass fraction of 5% and sodium gallate powder with a mass fraction of 0.1% to the molten low melting point metal;

[0037] (3) Stir the mixture in step (2) in an air-isolated environment with a rotation...

Embodiment 3

[0038] Embodiment 3 A kind of low-melting point metal heat conduction paste, consists of the following components by weight:

[0039] The mass fraction of gallium-lead alloy (the mass fraction of each component is Ga: 98%, Pb: 2%) is 99.8%, the mass fraction of magnesium sulfide is 0.1%, and the mass fraction of sodium gallate is 0.1%.

[0040] Among them, the gallium-lead alloy can maintain a liquid state at a temperature of 30°C or higher.

[0041] The method for preparing the low-melting-point metal thermal paste described in this embodiment comprises the following steps:

[0042] (1) Gallium-lead alloy is melted by hot melting method, and its mass fraction in thermal paste is 99.8%;

[0043] (2) Add magnesium sulfide with a mass fraction of 0.1% and sodium gallate powder with a mass fraction of 0.1% to the molten low melting point metal;

[0044] (3) Stir the mixture in step (2) in an air-isolated environment with a rotation speed of 300 rpm and a stirring time of 120 mi...

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Abstract

The invention provides a low-melting-point metal thermal-conducting paste as well as a preparation method and an application thereof. The prepared low-melting-point metal thermal-conducting paste comprises a low-melting-point metal, an antioxidant and sodium gallium. The low-melting-point metal has high thermal conductivity, so that excellent thermal conducting performance of the thermal-conducting paste can be guaranteed; the antioxidant can restrain the low-melting-point metal from being oxidized by air and prevent the thermal-conducting paste from being gradually oxidized and losing efficacy during a use process; and the sodium gallium can reduce surface tension of the low-melting-point metal, can improve viscosity of the thermal-conducting paste, can enhance the characteristic of easiness in applying the thermal-conducting paste, and can prevent the flowing and leaking phenomena of the thermal-conducting paste during the use process. The low-melting-point metal thermal-conducting paste as well as the preparation method and the application thereof can be widely applied to the thermal-conducting and heat-dissipation fields, such as aerospace thermal control, advanced energy, electronic information and the like, which require for reducing thermal contact resistance.

Description

technical field [0001] The invention relates to a low-melting-point metal heat-conducting paste and its preparation method and application, in particular to a low-melting-point metal heat-conducting paste comprising a low-melting-point metal, an antioxidant and sodium gallate. The invention belongs to the field of heat-conducting materials. Background technique [0002] Thermally conductive silicone grease is a key material for heat dissipation of electronic components. This is mainly because there is a very fine uneven air gap between the surface of the heat source and the radiator, and air is a poor conductor of heat, which will form an obvious contact thermal resistance between the heat source and the radiator, reducing the efficiency of the radiator . The thermal conductive silicone grease is filled between the heat source and the heat sink, which can eliminate the air in the interface and establish an effective heat conduction channel between them, reducing the contact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/12
CPCC09K5/12
Inventor 郭瑞
Owner BEIJING EMIKON TECH DEV
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