Defect detection system for extreme ultraviolet lithography mask

A technology for extreme ultraviolet lithography and defect detection, applied in the field of extreme ultraviolet lithography mask defect detection system, to achieve the effects of small size, easy processing, and reduced processing costs

Inactive Publication Date: 2013-12-04
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

[0006] In order to solve the problems in the above-mentioned technologies, the present invention provides a defect detection system for extreme ultraviolet lithography masks, especially a design method for EUV mask detection systems, which utilizes the small size, easy processing, low cost and The characteristic of strong resolution replaces the Schwarzschild lens, which is extremely difficult to process, expensive and bulky, and realizes a low-cost, small-volume and high-resolution extreme ultraviolet lithography mask defect detection device

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  • Defect detection system for extreme ultraviolet lithography mask
  • Defect detection system for extreme ultraviolet lithography mask
  • Defect detection system for extreme ultraviolet lithography mask

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0022] The EUV lithography mask defect detection system provided by the present invention uses a photon sieve instead of a traditional Schwarzchild objective to realize imaging of the mask in the EUV band, thereby detecting defects on the mask.

[0023] like figure 1 as shown, figure 1 It is a schematic structural diagram of an extreme ultraviolet lithography mask defect detection system according to an embodiment of the present invention. The extreme ultraviolet lithography mask defect detection system is oriented to the detection of mask defects in extreme ultraviolet lithography at the 22nm node, and specifically includes extreme ultraviolet lithography. Light source 1, extreme ultraviolet light transmission system (i...

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Abstract

The invention discloses a defect detection system for an extreme ultraviolet lithography mask. The defect detection system for the extreme ultraviolet lithography mask comprises an extreme ultraviolet light source, an extreme ultraviolet light transmission system (comprising a multilayer plane mirror and a multilayer concave condenser), an extreme ultraviolet lithography mask, a sample scan stage, a photon sieve, a CCD camera, a PC, an vibration isolation platform, a vacuum chamber and a multilayer half-transparent half-reflecting mirror. In the defect detection system for the extreme ultraviolet lithography mask, a conventional Schwarzchild lens is replaced by the photon sieve, so that imaging of the mask by an extreme ultraviolet band is realized, and thus defects on the mask are detected. Due to the fact of replacement of the conventional Schwarzchild lens which is difficult to process, high in cost and large in volume by the photon sieve which has the characteristics of small volume, good workability, low cost and high resolution ratio, the defect detection system for the extreme ultraviolet lithography mask is realized in lower cost, smaller volume and high resolution ratio.

Description

technical field [0001] The invention relates to the technical field of integrated circuit photolithography in semiconductor science, in particular to an extreme ultraviolet (extreme ultra-violet, EUV) photolithography mask defect detection system. Background technique [0002] Since the 1970s, the semiconductor industry has continuously reduced the graphic size of integrated circuits according to Moore's Law, making the number of transistors on the central processing unit (CPU) in computers double every two years. Extreme ultraviolet lithography is aimed at the 22nm node as the next generation of advanced lithography technology, opening up a new path of faster speed, smaller size and cheaper price for the semiconductor industry. However, through the difficult progress of EUV lithography technology, we can realize that the development of lithography technology is not just a lithography machine. The mutual cooperation and optimization of other links, such as the need for suita...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/84G03F1/22
Inventor 李海亮谢常青刘明李冬梅牛洁斌史丽娜朱效立王子欧
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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