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Rolled copper or copper-alloy foil provided with roughened surface

A technology for roughening the surface and copper alloy foil. It is applied in the direction of thin material processing, secondary processing of printed circuits, metal pattern materials, etc. It can solve the problems of copper foil etching damage and undercut, and achieve high peel strength. , good etching and gloss, with acid resistance and tin plating solution resistance effect

Active Publication Date: 2013-12-18
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Conventionally, electrolytic copper foils are roughened to improve the adhesiveness with resins, but there are problems in that the etchability of the copper foil is significantly impaired due to the roughening treatment, and it is difficult to etch with a high aspect ratio. , undercutting occurs during etching, making sufficient fine patterning impossible
This is very effective, but still found to produce a small amount of craters

Method used

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  • Rolled copper or copper-alloy foil provided with roughened surface
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  • Rolled copper or copper-alloy foil provided with roughened surface

Examples

Experimental program
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Effect test

Embodiment 1

[0077] As the copper foil, a rolled copper alloy foil composed of Cr: 0.2% by weight, Zr: 0.1% by weight, Zn: 0.2% by weight, and the balance of Cu and unavoidable impurities was used.

[0078] The rolled copper foil was subjected to degreasing and water washing treatment, followed by pickling and water washing treatment, and then, copper sulfate (Cu: 20g / L in conversion), sulfuric acid: 100g / L, temperature: 50°C, Dk: 5.0A / dm 2 (C: 10.3As / dm 2 ) under the conditions of forming a 0.04μm thick copper base plating. The thickness of the base plating layer is a trial value obtained from the Coulomb quantity and the specific gravity of copper.

[0079] Next, on the base coating, further at Dk: 50A / dm 2 (C: 70As / dm 2 ) conditions, the roughening treatment was performed by copper plating treatment including copper particles of 0.4 μm.

[0080] Various evaluation tests were performed on the rolled copper alloy foil after the roughening plating under the conditions shown below. I...

Embodiment 2

[0087] The formation condition of the copper base plating layer is Dk: 10.0A / dm 2 (C: 20.7As / dm 2 ) under the condition of forming a 0.08μm thick base plating layer of copper. Other conditions are identical with embodiment 1. The number of craters on the copper roughened surface was counted with an optical microscope, and the number was investigated. The results are similarly shown in Table 1 above. As shown in Table 1, in Example 2, the generation of arc craters is less, 2.1 craters / 25mm 2 .

Embodiment 3

[0089] The formation condition of the copper base plating layer is Dk: 15.0A / dm 2 (C: 41.0As / dm 2 ) under the condition of forming a 0.15 μm thick copper base plating. Other conditions are identical with embodiment 1. The number of craters on the copper roughened surface was counted with an optical microscope, and the number was investigated. The results are similarly shown in Table 1 above. As shown in Table 1, in Example 3, the generation of arc craters is less, 0.5 craters / 25mm 2 .

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Abstract

This rolled copper or copper-alloy foil provided with a roughened surface is a rolled copper or copper-alloy foil which is roughened by forming fine copper particles and which is characterized by being provided with a base plating layer of copper between the roughened copper layer and the rolled copper or copper-alloy foil. Thus, a roughened rolled copper-alloy foil with fewer craters is provided, craters being a significant disadvantage unique to a rolled copper-alloy foil provided with a roughened surface. In particular, a rolled copper or copper-alloy foil which can minimize the occurrence of craters caused by inclusions present either in the surface layer of a base metal or in the neighborhood thereof is provided.

Description

technical field [0001] The present invention relates to a rolled copper or copper alloy foil having a roughened surface, and in particular to less occurrence of craters (detached portions of roughening treatment caused by inclusions present on the surface of the copper foil) and having a bond with the resin layer. Adhesive strength, acid resistance and tin plating solution resistance, high peel strength, good etching and gloss, rolled copper or copper alloy foil suitable for manufacturing flexible printed circuit boards that can realize fine patterning of wiring. Background technique [0002] In recent years, along with the development of miniaturized integration technology for mounting components such as semiconductor devices and various electronic chip components, further fine patterning of wiring is required for printed wiring boards processed from flexible printed circuit boards on which these components are mounted. [0003] Conventionally, electrolytic copper foils are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D5/10H05K1/09H05K3/38
CPCC25D3/38C25D5/10C25D7/0614C25D5/605C25D5/617H05K1/09H05K3/384H05K2201/0355Y10T428/12076
Inventor 新井英太三木敦史
Owner JX NIPPON MINING & METALS CORP
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