A preparation method of treated copper foil with porous structure on the surface

Abstract

Belonging to the field of copper foil materials, the invention relates to a treated copper foil with a porous structure on the surface and a preparation method thereof. The treated copper foil with a porous structure on the surface is characterized in that the surface layer of its anti-oxidation and passivation layer is a porous layer, and an organized layer can be dip sprayed on the surface of the treated copper foil; a chemical corrosion or electrochemical way is employed to conduct dealloying treatment on the anti-oxidation and passivation layer's surface layer of a traditional surface treated copper foil so as to obtain the treated copper foil with a porous layer on the surface, and after washing, the organized layer treatment can be carried out on the surface of the porous layer. The anti-oxidation and passivation layer's surface layer of the surface treated copper foil is a porous structure, thus greatly increasing the specific surface area, being in favor of enhancing the bonding strength between resin substrates, and speeding up application of the surface treated copper foil. The dealloying method is employed to prepare the porous structure-containing porous layer on the anti-oxidation and passivation layer's surface layer of the surface treated copper foil, and has the advantages of simple equipment, short flow, high efficiency, energy saving and consumption reduction, low cost, green and environmental protection.

Description

Technical field [0001] The invention relates to the field of copper foil materials, and in particular provides a treated copper foil with a porous structure on the surface and a preparation method thereof. [0002] technical background [0003] Copper foil (including rolled copper foil and electrolytic copper foil) is one of the core basic materials for manufacturing printed circuit boards (Printed Circuit Board, PCB). With the rapid development of the electronic information industry, the use of copper foil is increasing, and the demand for high-performance copper foil is increasing day by day. In practical applications, copper foil and resin substrate are generally pressed into a copper clad laminate under high temperature and pressure conditions. In order to ensure sufficient bonding strength between the copper foil and the resin substrate, the processed copper foil with a roughened surface is usually used in the production of printed circuit boards. [0004] Traditional copper f...

AI Technical Summary

Problems solved by technology

On this basis, develop a treated copper foil with a porous structure on the surface, develop a preparation method for the treated copper foil with a porous structure on the surface, and solve the problem of the small specific surface area of ​​the current surface-treated copper foil and the bonding strength between the resin substrate Low, the quality and performance of the product are difficult to meet the higher requirements for use, etc.

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