High-performance insulating adhesive

An adhesive and high-performance technology, which is applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problem of high viscosity of epoxy resin, poor heat dissipation, and inapplicability of high-power electrical equipment, etc. problems, to achieve high mechanical properties, high thermal conductivity

Inactive Publication Date: 2014-01-08
KUNSHAN FENFA INSULATING MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among them, epoxy resin adhesive is the most widely used adhesive, but simple epoxy resin has high viscosity, poor heat dissipation, and the heat is too late to dissipate, so it is not suitable for high-power electrical equipment, so it is necessary to develop a modified ring Oxygen resin adhesive to overcome the shortcomings of existing epoxy adhesives

Method used

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Embodiment Construction

[0010] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0011] Embodiments of the present invention include: a high-performance insulating adhesive, including 55-70% epoxy resin, 6-12% curing agent, 15-30% silicon dioxide, 5-8% diluent, and 2% coupling agent -6%, modifying agent 1-3%, accelerator 1-4%, described curing agent is a novel nontoxic curing agent, described diluent is acetone, and described coupling agent is silane coupling agent, described The modifier is polyamide resin, the accelerator is ethanolamine; the silica is modified silica treated with a coupling agent, and the coupling agent needs to be diluted with a diluent.

[0012] The new non-toxic curing agent is C20. Traditional amines, acid anhydrides, and resin-based epoxy resin curin...

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Abstract

The invention discloses a high-performance insulating adhesive comprising the following components in percentage by mass: 55-70% of epoxy resin, 6-12% of a curing agent, 15-30% of silicon dioxide, 5-8% of a diluting agent, 2-6% of a coupling agent, 1-3% of a modifier and 1-4% of an accelerant, wherein the curing agent is a novel nontoxic curing agent, the diluting agent is a non-activated diluting agent acetone, the coupling agent is a silane coupling agent, the modifier is polyamide resin, and the accelerant is ethanolamine; the silicon dioxide is modified silicon dioxide treated by the coupling agent, and the coupling agent needs to be diluted by the diluting agent. Therefore, the high-performance insulating adhesive disclosed by the invention is an epoxy resin modified adhesive prepared by filling modified silicon dioxide into an epoxy resin adhesive base, has high thermal conductivity and high mechanical properties, and can be applied to high-power motor electrical equipment.

Description

technical field [0001] The invention relates to the field of insulating materials, in particular to a high-performance insulating adhesive. Background technique [0002] The main application fields of insulating adhesives are: adhesives for the main insulating mica tape of motors; adhesives for other insulating gluing composite materials, bonding and potting of motors and electrical equipment. With the development of electrical appliances towards high voltage level, high power, large capacity and high performance, insulating adhesives have the following development directions: 1. High heat resistance level and high thermal conductivity; 2. High electrical performance; 3. High mechanical Strength; 4. Low dielectric loss. The emergence of adhesives based on epoxy resin, silicone resin, modified phenolic resin, polyester resin, polyurethane resin and polysulfide rubber has successfully solved a series of problems such as bonding and insulation sealing. [0003] Among them, ep...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08C09J9/00
Inventor 周巧芬
Owner KUNSHAN FENFA INSULATING MATERIALS
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