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A water-soluble epoxy-modified acrylate resin adhesive and an electromagnetic shielding adhesive film prepared using the adhesive

A water-soluble epoxy and resin adhesive technology, used in epoxy resin adhesives, adhesive additives, adhesives, etc., can solve problems such as unsatisfactory electromagnetic shielding performance and low nickel conductivity

Active Publication Date: 2015-08-19
JIUJIANG FLEX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] For nickel-based electromagnetic shielding coatings, the current research shows that: due to the moderate price of nickel-based coatings, the oxidation problem is lighter than that of copper, so it has become the mainstream of electromagnetic shielding coatings in Europe, America and other countries. However, the conductivity of nickel is low, and its electromagnetic parameters ( Conductivity, magnetic permeability, dielectric constant, etc.) vary with frequency, and the electromagnetic shielding performance in low-frequency and high-frequency regions is not ideal, so there are still many in engineering applications, shielding effectiveness, physical properties, and environmental performance. problem to be solved

Method used

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  • A water-soluble epoxy-modified acrylate resin adhesive and an electromagnetic shielding adhesive film prepared using the adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0098] The water-soluble epoxy-modified acrylate resin adhesive is composed of solid components, liquid components and organic solvents. The weight ratio of each component is as follows: 40g of butyl acrylate, 20g of methyl methacrylate, 20g of acrylic acid, and Acrylic acid 10g, styrene 10g, initiator 0.5g, emulsifier 5g, epoxy resin 25g, curing agent 4g, thickener 8g, electromagnetic shielding particles 60g, solvent 120g aqueous solution.

[0099] (1) Preparation of acrylic acid pre-emulsion

[0100] Add the above-mentioned measured butyl acrylate, methyl methacrylate, acrylic acid, methacrylic acid, styrene, initiator, emulsifier, deionized water to the reaction kettle, start the agitator to disperse and emulsify at room temperature for 60 minutes at a high speed, Make a pre-emulsion for later use.

[0101] (2) Preparation of acrylic resin emulsion

[0102] Add the above-mentioned measured butyl acrylate, methyl methacrylate, acrylic acid, methacrylic acid, styrene, in...

Embodiment 2

[0117]Its component weight ratio is as follows, butyl acrylate 40g, methyl methacrylate 20g, acrylic acid 20g, methacrylic acid 10g, styrene 10g, initiator 0.5g, emulsifier 5g, epoxy resin 25g, curing agent 4g, 8g of thickener, 70g of electromagnetic shielding particles, and 120g of aqueous solution as the solvent.

[0118] All the other are identical with embodiment 1.

Embodiment 3

[0120] The weight ratio of each component is as follows, 40g of butyl acrylate, 20g of methyl methacrylate, 20g of acrylic acid, 10g of methacrylic acid, 10g of styrene, 0.5g of initiator, 5g of emulsifier, 25g of epoxy resin, 4g of curing agent, 8g of thickener, 80g of electromagnetic shielding particles, and 120g of aqueous solution as the solvent.

[0121] All the other are identical with embodiment 1.

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Abstract

A water-soluble epoxy-modified acrylate resin adhesive and the electromagnetic shielding adhesive film prepared by using the adhesive, including solid components, liquid components and solvent components, the weight percentage of the solid and liquid components Including butyl acrylate 35~40, methyl methacrylate 15~20, acrylic acid 15~20, methacrylic acid 5~10, styrene 5~10, initiator 0.4~0.6, emulsifier 4~6, epoxy resin 20-30, curing agent 3-5, thickener 5-10, electromagnetic shielding particles 60-80, the solid component and the liquid component are dissolved in the water solvent, and the percentage of the solid component and the liquid component to the total weight is 60 ~70%. The electromagnetic shielding adhesive film made by using the adhesive has a two-layer structure, and the water-soluble epoxy-modified acrylate resin adhesive is used as an adhesive, including a PI film, and the water-soluble film coated on the PI film Coatings of epoxy-modified acrylate resin adhesives. It has the characteristics of light weight, excellent bending resistance, heat resistance, fluidity, high peel strength, excellent dimensional stability, and high electromagnetic shielding rate.

Description

technical field [0001] The invention relates to a water-soluble epoxy-modified acrylate resin adhesive and an electromagnetic shielding adhesive film prepared by using the adhesive. Background technique [0002] Flexible copper clad laminate is the basic material for the production of flexible printed circuit boards, and it is also the key for flexible printed circuit boards to realize their flexural functions. In recent years, with the increase in the use of flexible printed circuit boards, the global demand for flexible copper clad laminates is increasing year by year. It consists of three parts: insulating film (polyimide film), adhesive and copper foil, among which the adhesive has a greater impact on product performance. There are mainly two types of adhesives: epoxy resin and acrylate. Most of the adhesives currently used are solvent-based, which not only causes great harm to the environment, but also increases additional costs. In recent years, with the enhancemen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/08C09J163/00C09J11/04C09J7/02C09J9/00C08F220/18C08F220/14C08F220/06C08F212/08C08F2/30
Inventor 陈永务张庆利付凡李龙霞
Owner JIUJIANG FLEX