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A kind of rapid preparation method of copper-tungsten alloy

A copper-tungsten alloy and rapid technology, applied in the field of rapid preparation of copper-tungsten alloy, can solve the problems of low heating rate and energy conversion efficiency, and achieve the effects of preventing alloy surface oxidation, excellent alloy performance and simple process flow

Inactive Publication Date: 2016-06-22
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The above-mentioned invention uses microwave-assisted heating of SiC sheets and conditions of atmosphere protection to realize the sintering preparation of alloys. Compared with traditional preparation methods, microwaves can quickly heat SiC sheets and transfer heat to alloy compacts, which is an excellent heat transfer method. Indirect heat conduction, heating rate and energy conversion efficiency are lower than direct microwave heating

Method used

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  • A kind of rapid preparation method of copper-tungsten alloy
  • A kind of rapid preparation method of copper-tungsten alloy
  • A kind of rapid preparation method of copper-tungsten alloy

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Experimental program
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Effect test

Embodiment approach 1

[0021] Embodiment 1: The rapid preparation method of the copper-tungsten alloy of this embodiment is:

[0022] (1) The metal tungsten powder and copper powder were ball milled and mixed according to the mass percentage of 92wt%: 8wt%, and the ball milled

[0023] The material is ball milled for 40 minutes under the conditions of ball-to-material ratio of 50:1 and rotational speed of 100r / min; the particle size of metal tungsten powder and copper powder is 10-20μm, and the purity is greater than 99.8wt%.

[0024] (2) Press the tungsten powder and copper powder mixed by ball milling in step (1) into a compact, and the pressure is controlled at 30MPa to make a cylindrical tungsten skeleton compact;

[0025] (3) Put the tungsten skeleton block into the mullite crucible, and cover the tungsten skeleton block with copper powder with a thickness of 3mm, and then place it under the conditions of microwave frequency 2400MHz, power 5KW, and vacuum degree 0.08KPa. Maintain a heating rat...

Embodiment approach 2

[0026] Embodiment 2: The rapid preparation method of the copper-tungsten alloy of this embodiment is:

[0027] (2) The metal tungsten powder and copper powder were ball milled and mixed according to the mass percentage of 80wt%: 20%, and ball milled and mixed

[0028] The material is ball milled for 20 minutes under the conditions of a ball-to-material ratio of 30:1 and a rotational speed of 200r / min; the particle size of metal tungsten powder and copper powder are both less than 200 mesh, and the purity is greater than 99.8wt%.

[0029] (2) Press the tungsten powder and copper powder mixed by ball milling in step (1) into a compact, and the pressure is controlled at 45MPa to make a tungsten skeleton compact;

[0030] (3) Put the tungsten skeleton block into the mullite crucible, and cover the tungsten skeleton block with copper powder with a thickness of 2mm, and then place it under the conditions of microwave frequency 2500MHz, power 3KW, and vacuum degree less than 0.1KPa ...

Embodiment approach 3

[0031] Embodiment 3: The rapid preparation method of the copper-tungsten alloy of this embodiment is:

[0032] (1) The metal tungsten powder and copper powder are ball milled and mixed according to the mass percentage of 95wt%: 5%, and the ball milled

[0033] The material is ball milled for 10 minutes under the conditions of ball-to-material ratio of 1:1 and rotational speed of 300r / min; the particle size of metal tungsten powder and copper powder are both less than 200 mesh, and the purity is greater than 99.8wt%.

[0034] (2) Press the tungsten powder and copper powder mixed by ball milling in step (1) into a compact, and the pressure is controlled at 25MPa to make a tungsten skeleton compact;

[0035] (3) Put the tungsten skeleton block into the mullite crucible, and cover the tungsten skeleton block with copper powder with a thickness of 5mm, and then place it under the conditions of microwave frequency 2450MHz, power 3.5KW, and vacuum degree less than 0.1KPa , maintain ...

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Abstract

The invention relates to a rapid preparation method of copper-tungsten alloy, which belongs to the fields of powder metallurgy technology, new metallurgical technology and microwave sintering technology. The metal tungsten powder and copper powder are ball milled and mixed according to the mass percentage of 95-70wt%: 5-30%, and then the compact is pressed to make a tungsten skeleton compact, which is put into a mullite crucible and placed in the tungsten skeleton blank. Copper powder is covered around the block, and then the crucible is placed under the conditions of microwave frequency of 2400-2500MHz, power of 3-5KW, and vacuum degree of less than 0.1KPa, and the heating rate is kept at 15-20°C / min to raise the temperature to 1100-1300 Sintering at ℃ for 1 to 3 hours, cooling naturally to obtain copper-tungsten alloy. The copper-tungsten alloy prepared by the method has a uniform structure and a compact structure, and the relative density can reach 98.7%.

Description

technical field [0001] The invention relates to the fields of powder metallurgy technology, new metallurgical technology and microwave sintering technology, in particular to a rapid preparation method of copper-tungsten alloy. Background technique [0002] Copper-tungsten alloy not only has the high melting point, high density, electric corrosion resistance, welding resistance and high high temperature strength of W, but also has the high electrical and thermal conductivity, plasticity and processability of Cu. Because Cu can absorb a large amount of arc energy when it evaporates at high temperature in the arc, reduce the arc temperature, improve the use conditions and reduce the electric corrosion, it is widely used as the electrical contact material of high-voltage electrical appliances, and also used as the electrode of electric processing, High-temperature molds and other occasions that require electrical and thermal conductivity and high-temperature use. At present, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/16C22C1/04C22C27/04
Inventor 许磊彭金辉李云张利波刘秉国夏仡夏洪应周俊文巨少华代林晴魏亚乾
Owner KUNMING UNIV OF SCI & TECH