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A method of manufacturing a soft dielectric circuit

A manufacturing method and circuit technology, applied to circuits, chemical/electrolytic methods to remove conductive materials, electrical components, etc., can solve the problem of affecting the quality of circuit substrates, the reliability of wire bonding interconnections, and the impact of circuit substrates. Problems such as poor quality and flatness of circuit substrates

Active Publication Date: 2017-05-24
CHINA ELECTRONIS TECH INSTR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The prior art has the following deficiencies: 1. For soft dielectric circuits, the tinning process will cause the flatness of the circuit substrate to deteriorate, affecting the patch quality of the circuit substrate; 2. The flux in the tinning process will pollute the circuit substrate, affecting Placement quality of circuit substrates and reliability of wire bond interconnects

Method used

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  • A method of manufacturing a soft dielectric circuit
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  • A method of manufacturing a soft dielectric circuit

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Embodiment 1

[0023] The invention improves the manufacturing technology of the soft dielectric circuit, adopts full-plate electroplating to thicken to the required thickness of the bonding interconnection, and then adopts photolithography technology to open a process window in the soldering area of ​​the circuit, and the gold layer in the soldering area Thinning to a reliable soldering thickness can meet the different coating thickness requirements of soldering pads and bonding pads on the same circuit, without tinning, and at the same time guarantee the quality of soldering, bonding and placement.

[0024] Such as figure 1 As shown, on the soft dielectric circuit 1, the electroplated gold layer of 2.5 microns on the front side 101 and the electroplated gold layer of 2.5 microns on the back side 102;

[0025] As shown in FIG. 2 , a transmission line 201 is fabricated on the soft dielectric circuit 1 .

[0026] Such as Figure 3-Figure 4 As shown, use photoresist 104 to open a process win...

Embodiment 2

[0029] On the basis of the above embodiments, further, a method for fabricating a soft dielectric circuit, which includes the following steps:

[0030] Step 1: electroplating a gold layer of 2.5 microns on the front and back of the seed layer of the soft dielectric circuit;

[0031] Step 2: using photoetching of the semiconductor integrated circuit manufacturing process to make circuit patterns in time;

[0032] Step 3: using the photolithography technology of the semiconductor integrated circuit manufacturing process to open the process window in the soldering area;

[0033] Step 4: The gold layer in the process window is etched down to 0.5 micron by using wet etching technology of the semiconductor integrated circuit manufacturing process, and the back side is protected by photoresist.

[0034] Further, the step four includes photoetching 0.5 micron of soldering area, photoetching of bonding area of ​​2.5 micron, photoetching of front transmission line of 2.5 micron, photoe...

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Abstract

The invention provides a method for manufacturing a soft dielectric circuit. The method for manufacturing the soft dielectric circuit comprises the steps of manufacture of a circuitous pattern capable of satisfying the thickness requirement in the soft dielectric circuit, manufacture of a bonding zone pattern capable of satisfying the following bonding reliability requirement and manufacture of a soldering zone pattern capable of satisfying the soldering interconnection reliability requirement. According to the technical scheme, the problems that before soldering is conducted on the soft dielectric substrate circuit, the flatness of a circuit substrate is worsened and a patching zone and a bonding zone are polluted by scaling powder in the process of tin coating are solved, and the reliability of a hybrid integrated circuit can be greatly improved.

Description

technical field [0001] The invention belongs to the technical field of making soft dielectric circuits, and in particular relates to a method for making soft dielectric circuits. Background technique [0002] In the microwave hybrid integrated circuit, the soldering interconnection process is used between the inner conductor of the adapter and the gold-plated soft dielectric circuit to prevent the reliability of the soldering interconnection interface from being reduced due to the "gold brittle" phenomenon during soldering, and the gold-plated soldering on the circuit substrate The gold layer of the pad cannot exceed 1 micron; and the pads that need to be wire bonded on the same circuit, in order to ensure the bonding quality, the gold plating thickness of the pads needs to be greater than 2.5 microns. [0003] The current practice is to remove the gold layer on the tin soldering pads by tinning process to ensure the soldering quality. Etching the tin soldering area, etchin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H01L21/48
Inventor 王斌曹乾涛宋振国
Owner CHINA ELECTRONIS TECH INSTR CO LTD