Wafer level packaging method for micro electromechanical system (MEMS) chip and single-chip micro-miniature type MEMS chip

A wafer-level packaging, ultra-small technology, applied in the field of single-chip ultra-small MEMS chips, can solve the problems of large chip area, high cost, low efficiency, etc., and achieve the effect of reducing area, low cost and simple process flow
CN103552980AInactive Publication Date: 2014-02-05ANHUI BEIFANG XINDONG LIANKE MICROSYST TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ANHUI BEIFANG XINDONG LIANKE MICROSYST TECH
Publication Date
2014-02-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a wafer level packaging method for a micro electromechanical system (MEMS) chip and a single-chip micro-miniature type MEMS chip. The method comprises the steps of forming a silicon through-hole wafer, forming a first bonded wafer, forming a cover plate wafer, forming a second bonded wafer, forming an MEMS wafer and forming the single-chip micro-miniature type MEMS chip. According to the method, by reducing the depth of an upper cavity, part of a silicon through-hole layer can directly serve as a vertical electrode, and the process is simple. By additionally arranging a metal shielding layer, the influence on the performance of the MEMS chip caused by an environment interference signal is reduced. The prepared single-chip micro-miniature type MEMS chip is small in size and high in yield. By virtue of the metal shielding layer on the chip, the influence on the performance of the MEMS chip caused by the environment interference signal and packaging stress can be reduced.
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Description

technical field

[0001] The invention belongs to the field of chip packaging, and in particular relates to a MEMS chip wafer-level packaging method, and also relates to a single-chip ultra-small MEMS chip prepared by the method. Background technique

[0002] Electronic packaging is to electrically connect one or more electronic component chips to each other, and then encapsulate them in a protective structure. Its purpose is to provide electrical connection, mechanical protection, chemical corrosion protection, etc. for electronic chips. For some electronic products, the surface of the chip cannot be in contact with the packaging material, especially for those MEMS devices with movable structures, which need to be hermetically packaged with ceramic shells, metal shells, preformed plastic shells, etc., but these Packaging methods are costly and bulky, making them unsuitable for use in consumer electronics. As MEMS devices become more widely used in the consumer space, low-cos...

Claims

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