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A kind of halogen-free low expansion epoxy resin composition

An epoxy resin and low-expansion technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of IC packaging development restrictions and other issues

Active Publication Date: 2016-06-22
ITEQ DONGGUAN
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

Ordinary FR-4 epoxy system substrates are difficult to meet this demand due to their high expansion coefficient, and special resin systems such as bis-triazine resin (BT), polyphenylene ether (PPE) resin, polytetrafluoroethylene Although (PTFE) resin has an excellent expansion coefficient, the price is much higher than that of ordinary substrates and the special processing technology limits the further development of IC packaging. Therefore, the development of a low-cost IC packaging substrate has become a Urgent market demand

Method used

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  • A kind of halogen-free low expansion epoxy resin composition
  • A kind of halogen-free low expansion epoxy resin composition
  • A kind of halogen-free low expansion epoxy resin composition

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Embodiment Construction

[0036] A halogen-free low expansion resin composition comprising:

[0037] (A) epoxy resin

[0038] A1: Trifunctional epoxy resin

[0039] A2: DCPD modified epoxy resin

[0040] A3: biphenyl type epoxy resin

[0041] A4: BPA type epoxy resin

[0042] (B) Phosphorus-containing epoxy resin

[0043] B: Phosphorus-containing epoxy resin

[0044] (C) Thermosetting resin mainly composed of a compound having dihydrobenzoxazine

[0045] C1: phenolphthalein type benzoxazine resin

[0046] C2: BPA type benzoxazine resin

[0047] (D) Phenolic resin

[0048] D1: Phosphorus-containing phenolic resin

[0049] D2: Novolac resin

[0050] (E) Accelerator

[0051] E: Diethyltetramethylimidazole

[0052] (F) Coupling agent

[0053] F: Silane coupling agent

[0054] (G) Inorganic filler

[0055] G1: Fused silica

[0056] G2: spherical silica

[0057] Mix the above resins according to the ratio in Table 1, and then coat them on the reinforcing material glass fiber cloth, and bake ...

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Abstract

The invention discloses a halogen-free low-expansion epoxy resin composition. The resin composition comprises a multifunctional epoxy resin, a phosphorus-containing epoxy resin, a benzoxazine resin, a phosphorus-containing curing agent, an inorganic filler, Curing accelerators and solvents. The resin with good rigidity and toughness contained in the composition, as well as the inorganic filler endow the composition with a low expansion coefficient and excellent heat resistance. The laminate prepared from the above composition is a halogen-free compound, and the flame retardant grade is UL94 -V0 level.

Description

technical field [0001] The invention relates to a halogen-free low-expansion epoxy resin composition. Background technique [0002] With the further development of the digital age, it has become a trend for electronic products to be thin, light, small, and high-speed. For PCBs, this means that the size of thin thin-line small holes is accurate, the performance is stable, and the cost is low. Guided by this trend Under the background, the IC packaging technology of PCB has also made great progress, from the through-hole insertion (PTH Insertion) before the 1980s, to the surface mount SMT method from 1980 to 1993, and then to the BGA, CSP and FC. , LGA-based construction method. However, with the development of packaging technology, the requirements for IC packaging substrates are also getting higher and higher. [0003] In order to meet the technical development requirements of miniaturization, high density, and high frequency, the materials used for IC substrates must have...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L79/04C08G59/62C08K3/36C08K3/34B32B27/04B32B15/092
Inventor 唐锋朱全胜翁宗烈蒋勇新李海林涂发全
Owner ITEQ DONGGUAN
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