Halogen-free flame-retardant epoxy resin composition and high-flexibility halogen-free cover film prepared from same

Abstract

The invention provides a halogen-free flame-retardant resin composition which comprises the following components in parts by weight: (A) 1-30 parts of flexible epoxy resin, (B) 10-50 parts of special-type epoxy resin, (C) 10-50 parts of bisphenol A epoxy resin, (D) 10-40 parts of synthetic rubber, (E) 1-20 parts of flexible amine curing agent, (F) 1-15 parts of aromatic amine curing agent, (G) 0.01-1.0 part of imidazole curing accelerator, (H) 0.01-1.0 part of anti-aging agent, (I) 5-30 parts of phosphorus-containing flame retardant, (J) 0-100 parts of filler and (K) organic solvent. The solid components are proportionally dispersed in the organic solvent to obtain the adhesive with the solid content of 30-40 wt%. The halogen-free flame-retardant epoxy resin composition is free of halogens, uses the flexible epoxy resin and special-type epoxy resin as the main body resins, uses the flexible amine oligomer and aromatic diamine as a composite curing system, and also uses a small amount of organic-phosphorus flame retardant; and thus, the resin composition has favorable mechanical properties and softness, and the flame retardancy is up to UL94VTM-0.

Description

technical field [0001] The invention relates to the technical field of cover films, in particular to a halogen-free flame-retardant epoxy resin composition and a highly flexible halogen-free cover film prepared therefrom. Background technique [0002] In order to meet the green environmental protection trend of "lead-free process" and "halogen-free materials", the entire printed circuit industry is actively responding. Some large-scale electronic product manufacturers claim to switch to halogen-free materials in an all-round way. Flexible copper clad laminates (FCCL) For manufacturers, opportunities and challenges coexist: on the one hand, switching to non-halogenated materials provides them with a stage to compete with competitors again; In particular, the halogen-free cover film is the focus of competition among various manufacturers, so as to take the initiative in the future use with adhesive-free two-layer FCCL; in addition, the flexibility of the cover film has always ...

AI Technical Summary

Problems solved by technology

[0008] Due to the addition of a large amount of phosphorus-based flame retardants and other inorganic fillers, the mechanical properties of the cover film may be poor, the water absorption is high, and there is a danger of small molecule fillers oozing or migrating to the surface during processing or subsequent use; at the same time, due to the use of ordinary Structured epoxy resin, the prepared cover film has poor flexibility, which affects subsequent use

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