Halogen-free flame-retardant epoxy resin composition and high-flexibility halogen-free cover film prepared from same

A technology of flame-retardant resin and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of high water absorption, poor flexibility of the covering film, and poor mechanical properties of the covering film. Achieve good softness, excellent softness, softness and better peel strength

Inactive Publication Date: 2014-02-05
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Due to the addition of a large amount of phosphorus-based flame retardants and other inorganic fillers, the mechanical properties of the cover film may be poor, the water absorption is high, and there is a danger of small mo

Method used

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  • Halogen-free flame-retardant epoxy resin composition and high-flexibility halogen-free cover film prepared from same
  • Halogen-free flame-retardant epoxy resin composition and high-flexibility halogen-free cover film prepared from same
  • Halogen-free flame-retardant epoxy resin composition and high-flexibility halogen-free cover film prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A halogen-free flame-retardant resin composition, including the following components by weight: flexible epoxy resin (product model DX7160, manufactured by Hunan Jiashengde Material Technology Co., Ltd.) 7.0 parts by weight; biphenyl epoxy resin (product model NC-3000, manufactured by Nippon Kayaku Co., Ltd.) 14.0 parts by weight; bisphenol A type epoxy resin (product model GESN901, manufactured by Hongchang Electronic Materials Co., Ltd.) 49.0 parts by weight; synthetic rubber (product model Nipol1072CG, acrylonitrile content 27 % by mass, manufactured by Zeon Corporation) 30.0 parts by weight; poly-1,4-butylene glycol bis(4-aminobenzoate) (product model ELASMER-1000P, manufactured by Ihara Chemical Industry Co., LTD.) 22.85 parts by weight; 5.36 parts by weight of 4,4'-diaminodiphenylsulfone; 0.5 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); anti-aging agent (product model DNP, Quzhou City, Zhejiang Province) Jiang District Kaiyuan Fine Chemica...

Embodiment 2

[0051] A halogen-free flame-retardant resin composition, including the following components by weight: flexible epoxy resin (product model DX7160, manufactured by Hunan Jiashengde Material Technology Co., Ltd.) 14.0 parts by weight; biphenyl epoxy resin (product model NC-3000, manufactured by Nippon Kayaku Co., Ltd.) 14.0 parts by weight; bisphenol A type epoxy resin (product model GESN901, manufactured by Hongchang Electronic Materials Co., Ltd.) 42.0 parts by weight; synthetic rubber (product model Nipol1072CG, acrylonitrile content 27 % by mass, manufactured by Zeon Corporation) 30.0 parts by weight; poly-1,4-butylene glycol bis(4-aminobenzoate) (product model ELASMER-1000P, manufactured by Ihara Chemical Industry Co., LTD.) 15.42 parts by weight; 6.20 parts by weight of 4,4'-diaminodiphenylsulfone; 0.5 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); anti-aging agent (product model DNP, Quzhou City, Zhejiang Province) Jiang District Kaiyuan Fine Chemic...

Embodiment 3

[0054] A halogen-free flame-retardant resin composition, including the following components by weight: flexible epoxy resin (product model DX7160, manufactured by Hunan Jiashengde Material Technology Co., Ltd.) 21.0 parts by weight; biphenyl epoxy resin (product model NC-3000, manufactured by Nippon Kayaku Co., Ltd.) 14.0 parts by weight; bisphenol A type epoxy resin (product model GESN901, manufactured by Hongchang Electronic Materials Co., Ltd.) 35.0 parts by weight; synthetic rubber (product model Nipol1072CG, acrylonitrile content 27 % by mass, manufactured by Zeon Corporation) 30.0 parts by weight; poly-1,4-butylene glycol bis(4-aminobenzoate) (product model ELASMER-1000P, manufactured by Ihara Chemical Industry Co., LTD.) 7.80 parts by weight; 7.05 parts by weight of 4,4'-diaminodiphenylsulfone; 0.5 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); anti-aging agent (product model DNP, Quzhou City, Zhejiang Province) Jiang District Kaiyuan Fine Chemica...

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Abstract

The invention provides a halogen-free flame-retardant resin composition which comprises the following components in parts by weight: (A) 1-30 parts of flexible epoxy resin, (B) 10-50 parts of special-type epoxy resin, (C) 10-50 parts of bisphenol A epoxy resin, (D) 10-40 parts of synthetic rubber, (E) 1-20 parts of flexible amine curing agent, (F) 1-15 parts of aromatic amine curing agent, (G) 0.01-1.0 part of imidazole curing accelerator, (H) 0.01-1.0 part of anti-aging agent, (I) 5-30 parts of phosphorus-containing flame retardant, (J) 0-100 parts of filler and (K) organic solvent. The solid components are proportionally dispersed in the organic solvent to obtain the adhesive with the solid content of 30-40 wt%. The halogen-free flame-retardant epoxy resin composition is free of halogens, uses the flexible epoxy resin and special-type epoxy resin as the main body resins, uses the flexible amine oligomer and aromatic diamine as a composite curing system, and also uses a small amount of organic-phosphorus flame retardant; and thus, the resin composition has favorable mechanical properties and softness, and the flame retardancy is up to UL94VTM-0.

Description

technical field [0001] The invention relates to the technical field of cover films, in particular to a halogen-free flame-retardant epoxy resin composition and a highly flexible halogen-free cover film prepared therefrom. Background technique [0002] In order to meet the green environmental protection trend of "lead-free process" and "halogen-free materials", the entire printed circuit industry is actively responding. Some large-scale electronic product manufacturers claim to switch to halogen-free materials in an all-round way. Flexible copper clad laminates (FCCL) For manufacturers, opportunities and challenges coexist: on the one hand, switching to non-halogenated materials provides them with a stage to compete with competitors again; In particular, the halogen-free cover film is the focus of competition among various manufacturers, so as to take the initiative in the future use with adhesive-free two-layer FCCL; in addition, the flexibility of the cover film has always ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J109/02C09J113/00C09J11/06C09J11/08C09J7/02
Inventor 刘生鹏茹敬宏
Owner GUANGDONG SHENGYI SCI TECH
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