High-precision resin diamond micro-drilling excircle grinding wheel and application

A diamond and cylindrical grinding technology, used in abrasives, drill accessories, metal processing equipment, etc., can solve the problem of hard, brittle, wear-resistant grinding objects, and achieve good shape retention of grinding wheels and reduce fractures. Needle, inexpensive effect

Active Publication Date: 2014-02-12
沈阳中科超硬磨具磨削研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The domestic resin grinding wheel formula system is mostly made of phenolic resin plus copper powder plus chromium oxide, which is difficult to meet the characteristics of hard, brittle and wear-resistant grinding objects

Method used

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  • High-precision resin diamond micro-drilling excircle grinding wheel and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Grinding wheel manufacturing adopts the steps of the preparation process of general resin bonded diamond grinding wheel, namely: production preparation, lower abrasive formula, simultaneous rough turning of aluminum substrate with compounding materials, forming of grinding wheel blank, rough turning of grinding wheel substrate, drilling and tapping of grinding wheel substrate, fine grinding of grinding wheel substrate Car, grinding wheel outer circle dressing, dynamic balance, appearance treatment, final inspection. The composition of the working abrasive layer is by weight: resin bond 60, white corundum 10, nanometer MgO1, copper powder 5, nanometer TiO 2 4. Diamond 15, CBN5.

Embodiment 2

[0020] The preparation process steps are the same as in Example 1, except that the composition of the working abrasive layer is by weight: resin bond 50, white corundum 15, nanometer MgO2, copper powder 5, nanometer TiO 2 3. Diamond 20, CBN10.

Embodiment 3

[0022] The preparation process steps are the same as in Example 1, except that the composition of the working abrasive layer is: resin bond 70, white corundum 10, nanometer MgO1, copper powder 5, nanometer TiO21, diamond 10, CBN7.5.

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PUM

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Abstract

The invention discloses a high-precision resin diamond micro-drilling excircle grinding wheel and an application. By means of the grinding wheel and the application, the problem that product machining efficiency is low, rejection rate is high, a cutting edge is not sharp and the like due to the fact that a printed circuit board (PCB) drill material is high in hardness, abrasion resistance and brittleness and small in drill edge diameter (0.10-6.50mm) and the like is solved. The grinding wheel is composed of a base body and a work grinding material layer. The work grinding material layer comprises, by weight, 50-70% of resin binder, 10-20% of white corundum, 1-5% of nanoscale MgO, 5-15% of copper powder, 1-10% of nanoscale TiO2, 10-20% of diamond and 5-10% of CBN. The grinding wheel has the advantages of being high in grinding efficiency; being good in grinding wheel shape retention and high in abrasion resistance; being low in grinding temperature and good in heat conduction; being high in ground workpiece precision and sharp in cutting edge; greatly reducing rejection rate caused by needle breaking.

Description

technical field [0001] The invention relates to the field of machinery and electronic equipment, in particular to a high-precision resin diamond micro-drilling outer circle grinding wheel for grinding the outer circle of the drill bit diameter of a printed circuit board. Background technique [0002] Printed circuit board (PCB—Printed Circuit Board), also known as printed circuit board and printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Before the appearance of PCB, the interconnection between electronic components was realized by direct connection of wires, but now PCB has occupied an absolute dominant position in the electronics industry. [0003] With the popularization of electronic equipment and technological progress, the demand for PCBs is also increasing, and drilling accounts for 30-40% of the cost of PCBs, and mass production requires more specializ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28B24B3/24
Inventor 王雀王昆郑勇阁
Owner 沈阳中科超硬磨具磨削研究所
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