Low-beryllium copper alloy metallographic corrosive agent and display method of metallographic structure of low-beryllium copper alloy

A technology of beryllium copper alloy and metallographic structure, which is applied in the field of metallographic sample preparation, can solve the problems of low beryllium copper alloy metallographic structure inspection, etc., and achieve the effect of simple process and easy operation

Active Publication Date: 2014-02-12
西北稀有金属材料研究院宁夏有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no relevant technology for the metallographic st

Method used

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  • Low-beryllium copper alloy metallographic corrosive agent and display method of metallographic structure of low-beryllium copper alloy
  • Low-beryllium copper alloy metallographic corrosive agent and display method of metallographic structure of low-beryllium copper alloy
  • Low-beryllium copper alloy metallographic corrosive agent and display method of metallographic structure of low-beryllium copper alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 1) Sampling

[0042] Provide a low beryllium copper alloy sample with a beryllium content of less than 1%, cut or cut a part of it as a sample, the length of the sample is less than 20mm, the width is less than 15mm, and the cross-sectional area of ​​the circular cross section is less than 300mm 2 .

[0043] 2) grinding

[0044] Use silicon carbide water sandpaper or aluminum oxide water sandpaper, use water as a wetting agent, and use mesh numbers No.180, No.400, No.800 and No.1500 for grinding in turn, and rotate the sample after each change of sandpaper Grinding at 90 degrees until the rough scratches from the previous process are removed.

[0045] 3) polishing

[0046] Sprinkle or spray the polishing solution on the flannelette attached to the polishing machine for mechanical polishing. Use two polishing, that is, use 3 micron and 1 micron alumina polishing liquid (pure water and alumina suspension) to polish on the flannelette, or use other particle size polish...

Embodiment 2

[0056] Sampling, grinding, polishing and sample cleaning observation are the same as in Example 1.

[0057] In the corrosion process, first prepare the etchant according to the following ratio:

[0058] 9 water ferric nitrate 5.0g±0.1,

[0059] Chromium trioxide 0.5g±0.1,

[0060] Ethanol 75.0mL±5.0, analytically pure,

[0061] 27.5%-30% hydrogen peroxide 5.0mL±0.5,

[0062] First weigh ferric nitrate and chromium trioxide, add ethanol and hydrogen peroxide successively, and stir with a glass rod until ferric nitrate and chromium trioxide are completely dissolved. After preparing the corrosive agent, use tweezers to hold the cotton wool and dip it into the corrosive agent, and wipe the surface of the polished sample. image 3 Microstructure picture of low beryllium copper alloy after quenching + aging shown for this method.

Embodiment 3

[0064] Sampling, grinding, polishing and sample cleaning observation are the same as in Example 1.

[0065] In the corrosion process, first prepare the etchant according to the following ratio:

[0066] Corrosive 1:

[0067] Ferric chloride 10g±0.1,

[0068] Potassium dichromate 0.5g±0.1,

[0069] 36%-38% hydrochloric acid 3ml±0.5,

[0070] Water 130-330mL±5,

[0071] First weigh ferric chloride and potassium dichromate, then add water and hydrochloric acid with a mass concentration of 36%-38% successively, and stir with a glass rod until the ferric chloride and potassium dichromate are completely dissolved.

[0072] Corrosive 2:

[0073] 25%-28% ammonia water 25.0mL±2.0,

[0074] 27.5%-30% hydrogen peroxide 5.0mL±0.5,

[0075] Water 25.0mL±2.0,

[0076] First use tweezers to hold the cotton wool and dip it in corrosive agent 1, wipe the surface of the polished sample for 15S-30s, rinse it with clean water, and then immerse it in corrosive agent 2 for 3-5s. Figure 4 It...

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Abstract

The invention relates to a low-beryllium copper alloy metallographic corrosive agent and a display method of metallographic structure of low-beryllium copper alloy. The method comprises the following steps of: orderly burnishing a low-beryllium copper alloy sample with 180-mesh, 400-mesh, 800-mesh and 1500-mesh silicon carbide waterproof abrasive papers or aluminum oxide waterproof abrasive paper by virtue of using water as a wetting agent, then, polishing the alloy with aluminum oxide polishing solutions of different particle sizes, finally, performing corrosion treatment by using one or any combination of three types of low-beryllium copper alloy metallographic corrosive agents prepared by the invention, and further washing and observing the sample. According to the invention, with the prepared corrosive agent effective to the metallographic structure of the low-beryllium copper alloy, the metallographic structure of the low-beryllium copper alloy can be displayed clearly, so that inspection on the low-beryllium copper alloy is realized. The technology is simple, and is simple and convenient to operate.

Description

technical field [0001] The invention belongs to the technical field of metallographic sample preparation, in particular to a low-beryllium copper alloy metallographic etchant and a method for displaying the low-beryllium copper alloy metallographic structure. Background technique [0002] The internal structure of metal materials is closely related to the strength, hardness, elongation and other properties of materials, and the observation of metallographic structure is the most widely used inspection method in the daily scientific research and production of metal materials, and it is also the most direct method of observation. way. Metallographic inspection determines the relevant data of the three-dimensional metallographic structure of the sample through the measurement and calculation of the metallographic microstructure of the two-dimensional sample of the metal material, thereby establishing the quantitative relationship between the composition, structure and performan...

Claims

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Application Information

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IPC IPC(8): G01N1/32C23F1/44
Inventor 余艳妮浮国运张健康李峰李美岁龚伟明邓六良
Owner 西北稀有金属材料研究院宁夏有限公司
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