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A low-temperature preparation method of high-performance tungsten-copper composite material

A composite material and high-performance technology, applied in the direction of coating, etc., can solve the problems of poor uniformity of components and structure, poor wettability of tungsten-copper interface, high sintering temperature, etc., and achieve wide distribution of tungsten content and wettability of tungsten-copper interface Improved properties and low sintering temperature

Active Publication Date: 2016-01-13
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the existing preparation of tungsten-copper composite materials such as poor uniformity of components and structure, extremely poor wettability of tungsten-copper interface, low density, high sintering temperature, complex process and long process, requiring Defects and deficiencies such as post-processing provide a new low-temperature preparation method for preparing high-performance tungsten-copper composite materials

Method used

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  • A low-temperature preparation method of high-performance tungsten-copper composite material
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  • A low-temperature preparation method of high-performance tungsten-copper composite material

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Experimental program
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Effect test

Embodiment 1

[0031] Embodiment 1: Preparation of W-10Cu composite material

[0032] Weigh 30g of dry 20μmW-10Cu (indicating that the mass content of Cu in the composite powder is 10%, the same below) prepared by vacuum evaporation method and put it into the mold, heat it in a vacuum hot pressing sintering furnace Press sintering, the sintering temperature is 1100°C, the sintering pressure is 150MPa, and the holding time is 3h. The density of the obtained W-10Cu composite material is 98.6%, the thermal conductivity is 210W / m·K, and the thermal expansion coefficient is 6.1ppm / K. , the electrical conductivity is 24.5MS / m, and the bending strength is 1180MPa.

Embodiment 2

[0033] Embodiment 2: Preparation of W-20Cu composite material

[0034] Weigh 30g of dry 2μmW-5Cu coated powder prepared by magnetron sputtering method and mix with 5.625g of Cu powder with an average particle size of 1μm and mix them on a two-dimensional mixer for 8h, take out the mixed The powder was loaded into the mold, and hot-pressed and sintered in a vacuum hot-pressed sintering furnace. The sintering temperature was 1000 ° C, the sintering pressure was 80 MPa, and the holding time was 2 h. The density of the obtained W-20Cu composite material was 98.9%. The conductivity is 230W / m·K, the thermal expansion coefficient is 7.4ppm / K, the electrical conductivity is 29.9MS / m, and the bending strength is 986MPa.

Embodiment 3

[0035] Embodiment 3: preparation W-30Cu composite material

[0036] Weigh 30g of dry 10μmW-30Cu composite powder prepared by electroless plating and put it into a mold, and carry out hot-press sintering in a vacuum hot-press sintering furnace. h, the density of the obtained W-20Cu composite material is 99.1%, the thermal conductivity is 274W / m·K, the thermal expansion coefficient is 9.4ppm / K, the electrical conductivity is 34.8MS / m, and the flexural strength is 852MPa.

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Abstract

The invention provides a low-temperature preparation method of a high-performance tungsten copper composite material. The method is as follows: copper coated tungsten composite powder and copper powder with corresponding masses are weighed according to the tungsten copper component ratios of the tungsten copper composite material required to be prepared for mixing to obtain mixed powder, or copper coated tungsten powder with corresponding components is directly used as sintering raw materials; the mixed powder or the copper coated tungsten composite powder with corresponding components are loaded into a mold for implementing low-temperature thermal pressing and sintering to obtain the high-performance tungsten copper composite material. The method is simple and reliable in technique, short in flow, low in production cost and high in efficiency; the prepared tungsten copper composite material has the advantages of wide distribution of tungsten content, high compactness, possession of copper network structure, uniform components and structure, improved tungsten copper interface wettability and excellent thermal, electric and mechanical properties, so that wide application foreground in the fields such as electronic sealing, electric contacts and electrode processing materials is achieved.

Description

technical field [0001] The invention belongs to the technical field of powder metallurgy. In particular, it relates to a low-temperature preparation method of a high-performance tungsten-copper composite material. Mix copper-coated tungsten composite powder and copper powder or directly use copper-coated tungsten powder of the corresponding composition as sintered raw material powder, put the raw material powder into a mold for low-temperature hot-press sintering to obtain high-performance Tungsten copper composite material. Background technique [0002] W-Cu composite material has the advantages of both tungsten and copper, and has the characteristics of high density, high strength, good electrical conductivity and good thermal conductivity, etc., and can be prepared to meet different applications by adjusting the ratio of two-phase components. W-Cu composite material. At present, W-Cu composite materials are widely used in electronic packaging materials for large-scale ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/04B22F1/02C22C27/04
Inventor 张联盟陈文书沈强罗国强王传彬李美娟
Owner WUHAN UNIV OF TECH