A low-temperature preparation method of high-performance tungsten-copper composite material
A composite material and high-performance technology, applied in the direction of coating, etc., can solve the problems of poor uniformity of components and structure, poor wettability of tungsten-copper interface, high sintering temperature, etc., and achieve wide distribution of tungsten content and wettability of tungsten-copper interface Improved properties and low sintering temperature
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Embodiment 1
[0031] Embodiment 1: Preparation of W-10Cu composite material
[0032] Weigh 30g of dry 20μmW-10Cu (indicating that the mass content of Cu in the composite powder is 10%, the same below) prepared by vacuum evaporation method and put it into the mold, heat it in a vacuum hot pressing sintering furnace Press sintering, the sintering temperature is 1100°C, the sintering pressure is 150MPa, and the holding time is 3h. The density of the obtained W-10Cu composite material is 98.6%, the thermal conductivity is 210W / m·K, and the thermal expansion coefficient is 6.1ppm / K. , the electrical conductivity is 24.5MS / m, and the bending strength is 1180MPa.
Embodiment 2
[0033] Embodiment 2: Preparation of W-20Cu composite material
[0034] Weigh 30g of dry 2μmW-5Cu coated powder prepared by magnetron sputtering method and mix with 5.625g of Cu powder with an average particle size of 1μm and mix them on a two-dimensional mixer for 8h, take out the mixed The powder was loaded into the mold, and hot-pressed and sintered in a vacuum hot-pressed sintering furnace. The sintering temperature was 1000 ° C, the sintering pressure was 80 MPa, and the holding time was 2 h. The density of the obtained W-20Cu composite material was 98.9%. The conductivity is 230W / m·K, the thermal expansion coefficient is 7.4ppm / K, the electrical conductivity is 29.9MS / m, and the bending strength is 986MPa.
Embodiment 3
[0035] Embodiment 3: preparation W-30Cu composite material
[0036] Weigh 30g of dry 10μmW-30Cu composite powder prepared by electroless plating and put it into a mold, and carry out hot-press sintering in a vacuum hot-press sintering furnace. h, the density of the obtained W-20Cu composite material is 99.1%, the thermal conductivity is 274W / m·K, the thermal expansion coefficient is 9.4ppm / K, the electrical conductivity is 34.8MS / m, and the flexural strength is 852MPa.
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